TO17-D82-L01

ORV3 Server - AMD EPYC 9006 SP7 Server Processors - 1OU 2-Node DP 8-Bay E3.S Gen6 NVMe DLC
  • CPU DLC solution with leak detection
  • 1OU 2-node front access server system
  • Dual AMD EPYC 9006 SP7 Server processors per node
  • 16-Channel DDR5 RDIMM/MRDIMM per CPU with 32 x DIMMs per node
  • 4 x E3.S Gen6 NVMe hot-swap bays per node
  • 2 x LP PCIe x16 slots with Gen6 x16 lanes per node
  • 48 V to 54 V DC bus bar power solution
Ordering Numbers: 6NTO17D82HR000L01*
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6th Generation AMD EPYC™ Processors for SP7 Socket

16
DDR5 channels 
Delivering up to 1.6TB/s memory bandwidth in 1DPC (MRDIMMs)
Up to 256
CPU cores
More VMs per rack and more tasks done with less real estate 
Zen6 & Zen6c
Cores
Optimized core package to achieve high frequency or high density 
CXL 3.1
Support
Multi-host memory sharing and P2P over fabric at double data rate
PCIe Gen6
Lanes
2x per-lane bandwidth vs Gen5, for next-gen GPUs, NICs, and storage 
2nm
Architecture
Smaller process node boosts core density and efficiency per watt

Select GIGABYTE for the AMD EPYC™ 9006 Platform

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High Performance

Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding workloads such as high frequency training and scientific simulation.
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Advanced Cooling

GIGABYTE's cooling solutions utilize diverse technologies and system designs, purpose built to keep demanding workloads performing at their peak.
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Fast and Stable Connectivity

Keeping pace with the challenges for next gen technology, GIGABYTE boards provide users the signal integrity for PCIe 6.0 speeds and I/O flexibility.
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Optimal Price

A broad portfolio tailored to specific applications lets customers select only the features a workload needs, keeping total cost of ownership down.
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Memory Bandwidth

GIGABYTE boards support the maximum 32-channel DDR5 subsystem EPYC 9006 offers running at up to 12800 MT/s (MRDIMMs). Expertly crafted layouts ensure bandwidth remains stable under heavy workloads.

TO17-D82-L01 Block Diagram

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Power Efficiency

Automatic Fan Speed Control
GIGABYTE servers are enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.
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Hardware Security

Optional TPM 2.0 Module
For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.
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System Management

Enhanced HPC & AI Management with AST2700
The AST2700 delivers increased performance and efficiency over previous generations. It is built to support high-density multi-node HPC and AI systems, with enhanced CMC to BMC communication reducing retransmissions and IPMB signal interference. In addition, it comes equipped with the management and diagnostic tools operators need to recover quickly when issues arise.

  • Firmware rollback across the last five BMC and BIOS versions
  • Dual OS ISO storage for remote recovery and Virtual Media installation
  • Full BMC process logging for diagnostics
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High Availability

Dual ROM Architecture
If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version.

User Friendly

Tool-less Drive Bays Design

Tool-less Drive Bays Design

Clipping mechanism secures the drive in place. Install or replace a new drive in seconds.
Certified Ready with Software Partners

Certified Ready with Software Partners

Being a member of key software alliance partner programs enables GIGABYTE to rapidly develop and validate joint solutions, enabling our customers to modernize their data centers and implement IT infrastructure and application services with speed, agility, and cost optimization.

Spesifikasi

Dimensions (WxHxD, mm)
1OU 2-Node
Open Rack Version
ORV3
Motherboard
MD85-HD0
CPU
AMD EPYC 9006 SP7 Server processors

[DLC] Dual processors per node, PPT up to 600 W

[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Memory
32 x DIMM slots per node
Support DDR5 RDIMM/MRDIMM [1]
16-Channel memory per processor

RDIMM: Up to 8000 MT/s
MRDIMM: Up to 12800 MT/s

[1] MRDIMMs are supported only on select CPU SKUs.
LAN
Front:
1 x Management LAN per node
Video
Integrated in ASPEED® AST2700
- 1 x Mini-DP per node
Storage
Front hot-swap:
4 x E3.S Gen6 NVMe per node
- (2 x NVMe from CPU_0, 2 x NVMe from CPU_1)
PCIe Expansion Slots
Riser Card x 2:
2 x LP x16 (Gen6 x16) per node, from CPU_0
Front I/O
Per node:
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
1 x MLAN port
1 x Power button with LED
1 x System status LED
1 x ID LED
Security Modules
1 x TPM header with SPI interface per node
- Optional TPM 2.0 kit: CTM012
System Fans
4 x 40x40x56mm per node
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)

[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 45°C.
Packaging Content
1 x TO17-D82-L01
2 x CPU cold plate loops
1 x Mini-DP to D-Sub cable
Part Numbers
- Barebone package: 6NTO17D82HR000L01*
- Motherboard: 9MD85HD0ID-000*

[#1] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.

[#2] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.

[#3] All trademarks and logos are the property of their respective owners.

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