GIGABYTE X570 AORUS XTREME Wins the iF Design Award 2020
Extreme Performance + Sleek Aesthetics to Earn the Praise of International Design Critics
Taipei, Taiwan, February 20th, 2020 – GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, today announced that the X570 AORUS XTREME has won the iF design award 2020 for its innovative features, fine-tuned details, ultra durable product quality, and exceptional design features. The enthusiast-grade motherboard earned the unanimous praise of the judging panel, winning a prestigious iF award.
The iF Design Award was first awarded in 1953 in Germany and is one of the oldest, most prestigious design awards along with four other major international design awards such as the Red Dot award from Germany, IDEA award from the US, and G-MARK award from Japan. Regarded as one of the most important design awards in the world, the iF Design Award attracts over 5000 contestants a year from over 70 different countries. Composed of internationally renowned design judges, the judging panel carefully evaluates each product and bestows an iF design award to the products that stand out the most for their innovative design. X570 AORUS XTREME earned the award based on its innovative qualities, performance, features, and ultra durable components.
GIGABYTE X570 AORUS XTREME motherboard is based off the new AMD X570 chipset. The motherboard provides an unprecedented level of support for the new PCIe 4.0 interface to deliver ultra-high transfer speeds. The feature-packed motherboard packs a 16-phase digital power design for the most stable power management along with Fins-Array stacked fin heatsink technology, Direct Touch heatpipe, and a Nanocarbon baseplate for advanced cooling. The first fanless thermal design earned much praise for its ability to keep temperatures low which enables users to extract the full potential from their 3rd gen. AMD Ryzen™ processors. GIGABYTE X570 AORUS XTREME delivers up to 2.4Gbps wireless internet speeds with its WiFi 6 802.11ax wireless configuration, comes with right angled power connectors for more convenient cable management, provides the newest version of Q-Flash Plus technology for easier BIOS tuning, and offers RGB LED support, all of which enables users to truly build a performance-oriented, ultra durable system with extremely fast transfer speeds.
With the X570 AORUS XTREME, GIGABYTE has invested a great deal of time on the drawing board to conceptualize ideas, fine-tune details, and handcraft an enthusiast-grade motherboard that is equal parts beast and beauty. With 16-power phases to work with, the motherboard optimizes performance on 3rd Gen AMD Ryzen desktop processors while incorporating sleek, highly stylized cooling armor for exceptional cooling on the most heat sensitive areas. The armor is inspired by the Falcon's swift, aerodynamic attributes and is fused with glorious RGB lighting to offer ultra cool gaming aesthetics.
“We are thrilled to win a 2020 iF Design Award for the X570 AORUS XTREME motherboard. It is a tremendous honor for us and a testament to all the hard work and commitment we’ve put into developing this next-gen motherboard,” said Jackson Hsu, Director of the GIGABYTE Product Development Division. “The demand for better performance, thermals, and aesthetics has never been higher so we were laser focused on addressing these needs with our newest platform. GIGABYTE X570 AORUS XTREME is made by enthusiasts and designed for enthusiasts. We’ve implemented features such as a 16-phase power design, fanless thermal design, right-angled power connectors, PCIe 4.0 support, high-speed connectivity, RGB LED, and the latest Q-Flash Plus technology to deliver a motherboard that impresses even the most hardcore enthusiasts. X570 AORUS XTREME has also been rigorously tested and fine-tuned so that users can build the most stable and performance-oriented AMD platforms.”
For more information on X570 AORUS XTREME, please visit the official GIGABYTE website:
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