GIGABYTE X570 AORUS XTREME Wins iF Design and Reddot Design Awards 2020
Double renowned Design Awards- Proof of Extreme Performance with Aesthetics on GIGABYTE Product Design
Taipei, Taiwan, Marh 27th, 2020 – GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, today announced that the X570 AORUS XTREME has won the 2020 Red Dot Design Award right after winning a prestigious iF Design Award. With its cutting-edge design and Ultra Durable quality, the enthusiast-grade motherboard earned the unanimous praise of the judging panel.
The Red Dot Design Award and the iF design award are two highly prestigious professional design awards from Germany, which attracts over 5000 contestants a year from over 70 different countries. These two awards are composed of internationally renowned design judges who carefully evaluate each product. X570 AORUS XTREME earned the award based on its innovative qualities, performance, features, and ultra durable components.
“With the X570 AORUS XTREME, GIGABYTE has invested a great deal of time on the drawing board to conceptualize ideas, fine-tune details, handcraft an enthusiast-grade motherboard that is equal parts beast and beauty, and enhanced user-friendly design. All of that allowed it to earn this award” from the iF Design Award evaluation committee. “Only those products with cutting-edge design and innovation potential can win this award, X570 AORUS XTREME earned the approval of the evaluation committee based on its innovative qualities, design, performance, and features. GIGABYTE has proven its remarkable ability combining R&D, manufacture, and design, as well as devoted to developing next-gen motherboard” from the Red Dot Design Award evaluation committee.
GIGABYTE X570 AORUS XTREME motherboard is based off the new AMD X570 chipset. The motherboard provides an unprecedented level of support for the new PCIe 4.0 interface to deliver ultra-high transfer speeds. The feature-packed motherboard packs a 16-phase digital power design for the most stable power management along with Fins-Array stacked fin heatsink technology, Direct Touch heatpipe, and a Nanocarbon baseplate for advanced cooling. Being the world-first X570 motherboard with fanless thermal design, X570 AORUS XTREME earned much praise for its ability to keep temperatures low when users to extracting the full potential from their 3rd gen. AMD Ryzen™ processors. Furthermore GIGABYTE X570 AORUS XTREME delivers up to 2.4Gbps wireless internet speeds with its WiFi 6 802.11ax wireless configuration, providing more diversified network application, and also comes with right angled power connectors for more convenient cable management for system builders.
“We are incredibly honored to win both 2020 iF Design Award and Red Dot award for the X570 AORUS XTREME motherboard.” said Jackson Hsu, Director of the GIGABYTE Product Development Division. “GIGABYTE X570 AORUS XTREME is made by enthusiasts and designed for enthusiasts. We’ve implemented features such as a 16-phase power design, fanless thermal design, right-angled power connectors, PCIe 4.0 support, high-speed connectivity, RGB LED, and the latest Q-Flash Plus technology to deliver a motherboard that impresses even the most hardcore enthusiasts. Winning these two renowned design awards proves that we are on the right rack of devoting to the best design.
For more information on X570 AORUS XTREME, please visit the official GIGABYTE website: https://www.gigabyte.com/Motherboard/X570-AORUS-XTREME-rev-1x#kf
For more information and news on GIGABYTE products, please visit the official GIGABYTE website: http://www.gigabyte.com