Especificación
Dimensions (WxHxD, mm)
3U 10-Blade 20-Node - Front access
447 x 132 x 770
CPU
AMD EPYC™ 4005 Series processors
AMD EPYC™ 4004 Series processors
AMD Ryzen™ 9000 Series processors
AMD Ryzen™ 7000 Series processors
Single processor per node, TDP up to 65 W
[Note] Overclocking is not supported due to thermal limitations.
[Note] Mixing different CPU series across nodes is not recommended due to thermal considerations.
Memory
4 x DIMM slots per node
Support DDR5 ECC/Non-ECC UDIMM
Dual-channel memory per processor
AMD EPYC™ 4005 / Ryzen™ 9000:
Up to 5600 MT/s (1DPC), 3600 MT/s (2DPC)
AMD EPYC™ 4004 / Ryzen™ 7000:
Up to 5200 MT/s (1DPC), 3600 MT/s (2DPC)
LAN
Front (LAN board):
2 x 25 Gb/s SFP28 LAN (1 x Broadcom® BCM57502) per node
1 x 1 Gb/s LAN (1 x Intel® I210-AT) per node
- Supports NCSI
Rear (MLAN board x 2):
2 x Chassis Management LAN [1]
[1] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.
Video
Integrated in ASPEED® AST2600
- 1 x Mini-DP per node
Storage
Internal M.2:
2 x M.2 (2280) per node, PCIe Gen5 x4
Front I/O
Per node (2 x nodes on a single blade):
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
1 x RJ45 port
1 x Power button with LED
1 x ID LED
LAN board:
2 x SFP28 ports
2 x LAN activity LEDs
Rear I/O
MLAN board x 2:
2 x CMC ports
Security Modules
Onboard TPM 2.0
Power Supply[#1]
4 x 3200 W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 100-127V~, 16A, 50-60Hz
- 200-220V~, 16A, 50-60Hz
- 220-240V~, 16A, 50-60Hz
DC Input: (Only for China)
- 240Vdc, 16A
DC Output:
- Max 1300W/ 100-127V~
+12.2V/ 106.6A
+12.2Vsb/ 3A
- Max 3000W/ 200-220V~
+12.2V/ 246A
+12.2Vsb/ 3A
- Max 3200W/ 220-240V~ or 240Vdc Input
+12.2V/ 262.3A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Fans
5 x 80x80x80mm
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
Weight
Net Weight: 75 kg
Gross Weight: 82 kg
Packaging Dimensions
1087 x 686 x 564 mm
Packaging Content
1 x B353-C60-AAS1
20 x CPU heatsinks
1 x Mini-DP to D-Sub cable
40 x M.2 heatsinks
1 x L-shape Rail kit
Part Numbers
- Barebone package: 6NB353C60MR000ACS1*
- Motherboard: 9MC63BL0NR-000*
- L-shape Rail kit: 25HB2-A96100-K0R
[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.