| Description | Version | Size | Date |
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TO86-SD1-AA05
ORv3 GPU Server - Intel® Xeon® 6 Processors - 8OU DP NVIDIA HGX™ B200
- NVIDIA HGX™ B200
- 1.8TB/s GPU-to-GPU bandwidth with NVIDIA NVLink™ and NVSwitch™
- Dual Intel® Xeon® 6700/6500-Series Processors
- 8-Channel DDR5 RDIMM / MRDIMM, 32 x DIMMs
- Compatible with NVIDIA® BlueField®-3 DPUs and NVIDIA ConnectX®-7 NICs
- 2 x 10Gb/s LAN ports via Intel® X710-AT2
- 1 x M.2 slot with PCIe Gen5 x4 interface
- 8 x 2.5" Gen5 NVMe hot-swap bays
- 12 x FHHL PCIe Gen5 x16 slots
- 48V to 54V DC Bus Bar power solution
Ordering Numbers: 6NTO86SD1UR000AA05*
- Overview
- Specifications
- Support
Specifications
Dimensions (WxHxD, mm)
8OU
537 x 380.5 x 853
537 x 380.5 x 853
Open Rack Version
ORv3
Motherboard
MSJ4-GD0
CPU
Intel® Xeon® 6 Processors
- Intel® Xeon® 6700-Series Processors
- Intel® Xeon® 6500-Series Processors
Dual processor, TDP up to 350W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
- Intel® Xeon® 6700-Series Processors
- Intel® Xeon® 6500-Series Processors
Dual processor, TDP up to 350W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4710
Socket E2
Socket E2
Chipset
System on Chip
Memory
32 x DIMM slots
Support DDR5 RDIMM/MRDIMM [1]
8-Channel memory per processor
RDIMM: Up to 6400 MT/s (1DPC), 5200 MT/s (2DPC)
MRDIMM: Up to 8000 MT/s
[1] MRDIMMs are only supported with Intel® Xeon® 6 Processors with P-cores and in a 1DPC configuration.
Support DDR5 RDIMM/MRDIMM [1]
8-Channel memory per processor
RDIMM: Up to 6400 MT/s (1DPC), 5200 MT/s (2DPC)
MRDIMM: Up to 8000 MT/s
[1] MRDIMMs are only supported with Intel® Xeon® 6 Processors with P-cores and in a 1DPC configuration.
LAN
Front (I/O board - COFP332):
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Video
Integrated in ASPEED® AST2600
- 1 x Mini-DP
- 1 x Mini-DP
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89104)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89104)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1
SAS
N/A
RAID
N/A
Modular GPU
NVIDIA HGX™ B200 with 8 x SXM GPUs
PCIe Expansion Slots
8 x FHHL x16 (Gen5 x16), from PEX89104
4 x FHHL x16 (Gen5 x16), from PEX89048
4 x FHHL x16 (Gen5 x16), from PEX89048
Front I/O
I/O board - COFP332:
1 x USB 3.2 Gen1 port (Type-C)
1 x Micro USB port for BMC UART
1 x Mini-DP
2 x RJ45 ports
1 x MLAN port
I/O board - COFP340:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
1 x USB 3.2 Gen1 port (Type-C)
1 x Micro USB port for BMC UART
1 x Mini-DP
2 x RJ45 ports
1 x MLAN port
I/O board - COFP340:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
1 x PRoT connector (only enabled on RoT SKU)
- Optional TPM2.0 kit: CTM010
1 x PRoT connector (only enabled on RoT SKU)
System Management
ASPEED® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
Motherboard:
4 x 92x92x38mm
GPU tray:
12 x 92x92x76mm
4 x 92x92x38mm
GPU tray:
12 x 92x92x76mm
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
Packaging Dimensions
1300 x 800 x 650 mm
Packaging Content
1 x TO86-SD1-AA05
2 x CPU heatsinks
4 x Carriers
1 x L-shape Rail kit
2 x CPU heatsinks
4 x Carriers
1 x L-shape Rail kit
No. of Bus Bars
5 x 48V to 54V Bus Bar Connectors
Part Numbers
- Barebone with NVIDIA module: 6NTO86SD1UR000AA05*
- Motherboard: 9MSJ4GD0DR-000*
- CPU heatsink: 25ST1-143102-C1R
- Backplane board - CBPG086: 9CBPG086NR-00*
- Fan module 92x92x38mm: 25ST2-993832-C1R
- Fan module 92x92x76mm: 25ST2-997631-C1R
- I/O board - COFP332: 9COFP332NR-00*
- I/O board - COFP340: 9COFP340NR-00*
- Motherboard: 9MSJ4GD0DR-000*
- CPU heatsink: 25ST1-143102-C1R
- Backplane board - CBPG086: 9CBPG086NR-00*
- Fan module 92x92x38mm: 25ST2-993832-C1R
- Fan module 92x92x76mm: 25ST2-997631-C1R
- I/O board - COFP332: 9COFP332NR-00*
- I/O board - COFP340: 9COFP340NR-00*
[#1] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#2] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#3] All trademarks and logos are the property of their respective owners.