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G210-H4G
Legacy | Software updates supported
2U - 4 nodes Computing Server
- 2U - 4 nodes high density rack with front access to the node trays
- Intel® Xeon® processor E3-1200 V3 & V4 product families
- 4 x LGA 1150 sockets
- Intel® C226 chipset
- 4 x PCIe x16 (Gen3 x16 bus) supporting double slot cards
- 8 x DDR3 ECC slots
- 8 x GbE LAN ports (Intel® I210)
- 16 x 2.5” hot-swappable HDD/SSD bays
- 3200W 80 PLUS Platinum level (96.2% efficicency) PSU
-
The Power of GPU VirtualizationDeveloped in partnership with Carri Systems, a French specialist of GPU computing & HPC solutions, this product is a 2U rackmount housing 4 blades capable of receiving one NVIDIA GRID or AMD FirePro card each.
With the amount of possibilities offered by the GPU virtualization exploding in all directions, the G210-H4G is a simple solution designed with simplicity and flexibility in mind to let organizations, big and small, enjoy the benefits of this growing computing trend.
Compatible with all the models from NVIDIA's GRID and AMD FirePro product families, this product is a standard 2U rackmount built with 4 blades. Each blade is built with a GA-6LISL motherboard that can receive an Intel Xeon E3-1200 V3 processor, with 4 hot-swappable bays for 2.5" HDDs or SSDs, and with a special PCIe x16 (Gen3 x16 bus) slot large enough to receive a computing card up to 267mm length and 300W TDP.
With such specifications, the G210-H4G is an ideal product to unlock the enormous potential offered by NVIDIA and AMD professional cards in many types of scenarios, notably for virtual desktops running graphics intensive applications and cloud gaming as well. -
The Multi-Node Design AdvantagesThe 2U multi-nodes rackmount design regroups all the critical features required to satisfy datacenter environment criteria:
Space:
The chassis is equipped with four motherboards (computing nodes), when traditional 2U racks have only one. Here in 2U you get in total 4 processors from the Intel Xeon E3-1200 V3 family, 8 memory DIMMs, and 16 HDD bays, while keeping optimal airflow and thermal properties.
The computing density is multiplied by 4, which means the space utilization of the chassis is improved by 3.
Power:
Within the chassis, the power supply blocks are removed from each blade to be shared and managed at the rack level. This implies less components obstruction, enhanced thermal performance, and reduced power consumption.
Serviceability:
With rear access to the computing nodes and hot-swappable HDD bays, this rack can be serviced easily and can fit in most of existing datacenter infrastructure.
For routine monitoring, this rack comes with a management controller that allows it to be remotely controlled.
Also, it perfectly matches hot aisle/cold aisle designs.
Cost:
Being able to fit 4 motherboards within 1 chassis instead of 4, you save on the chassis cost. -
Energy Saving ArchitectureWith an optimal airflow throughout each blade specially designed around the GPU card slots, and a redundant power delivery system shared across the entire rack, the G210-H4G is highly power efficient and will help your infrastructure achieve significant power savings compared to traditional rack systems in a short amount of time.
-
Intel® Xeon® Processor E5-2600 V2 Product FamilyDeployable through a simple BIOS update, the support of the Intel Xeon processors E5-2600 V2 product family delivers the benefits of the 22nm tri-gate process technology to the high end server industry. Those benefits include, among others, higher frequencies, higher core counts (up to 12 cores / 24 threads) and larger last-level caches, but especially a much more varied mix of core/frequencies with notably the introduction of a new dual socket workstation segment. This new die shrink also allows for overall energy efficiency increase, with up to 30% average decrease in idle power consumption.
Finally, virtualization applications will benefit from increased performance thanks to the Advanced Programmable Interrupt Controller (APIC) technology, and more security features are included in the mix as well, such as the Intel® Platform Protection Technology with OS Guard, and Intel® Data Protection Technology with Secure Key. -
Dual GbE LANDual GbE LAN
-
Support of PCIe Generation 3.0
-
Server Management
-
HDMI™-The Next Generation Multimedia InterfaceHDMI™ is a High-Definition Multimedia Interface which provides up to 5Gb/s video transmitting bandwidth and 8-channel high quality audio all through a single cable. Able to transmit superior, uncompressed digital video and audio, HDMI™ ensures the crispest rendering of digital content up to 1080p without the quality losses associated with analog interfaces and their digital-to-analog conversion. In addition, HDMI™ is compatible with HDCP (High-bandwidth Digital Content Protection), allowing the playback of Blu-ray/HD DVD and other protected media content.
[#1] 本網站所提供之產品規格、圖片及其他資訊僅供參考,如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利,並不對因使用上述資料而導致的任何損失承擔責任。
[#2] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。
[#3] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。
[#2] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。
[#3] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U
447 x 87.2 x 780
447 x 87.2 x 780
Motherboard
4 x GA-6LISL
CPU
Supports Intel® Xeon® processor E3-1200 V3 & V4 product families
Supports 4th gen Intel® Core™ i3, Pentium® and Celeron® processors*
*If used with non-ECC memory, supported on client OS only. If used with ECC memory, supported on both client and server OS.
Supports 4th gen Intel® Core™ i3, Pentium® and Celeron® processors*
*If used with non-ECC memory, supported on client OS only. If used with ECC memory, supported on both client and server OS.
Socket
Per node:
1 x LGA 1150
Total:
4 x LGA 1150
4 x CPU heatsinks included
1 x LGA 1150
Total:
4 x LGA 1150
4 x CPU heatsinks included
Chipset
Per node:
Intel® C226
Intel® C226
Memory
Per node:
2 x DIMM slots
Total:
8 x DIMM slots
Supports unbuffered ECC or non-ECC UDIMM modules
Supports single rank and dual rank UDIMM modules
Up to 16GB
1333/1600/(1866*) MHz
*Supported by Intel® Xeon® E3-1200 V4 processors only
2 x DIMM slots
Total:
8 x DIMM slots
Supports unbuffered ECC or non-ECC UDIMM modules
Supports single rank and dual rank UDIMM modules
Up to 16GB
1333/1600/(1866*) MHz
*Supported by Intel® Xeon® E3-1200 V4 processors only
LAN
Per node:
2 x GbE LAN ports (Intel® I210-AT)
2 x GbE LAN ports (Intel® I210-AT)
Video
Per node:
Integrated in Aspeed® AST2300
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Integrated in Aspeed® AST2300
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Audio
-
Storage
Per node:
4 x 2.5" hot-swappable HDD/SSD bays
Total:
16 x 2.5" hot-swappable HDD/SSD bays
4 x 2.5" hot-swappable HDD/SSD bays
Total:
16 x 2.5" hot-swappable HDD/SSD bays
SATA
Per node:
5 x SATA III 6Gb/s ports
Total:
20 x SATA III 6Gb/s ports
5 x SATA III 6Gb/s ports
Total:
20 x SATA III 6Gb/s ports
SAS
-
RAID
Intel® SATA RAID 0/1/10/5
Peripheral Drives
-
Expansion Slots
Per node:
1 x PCIe x16 (Gen3 x16 bus) slot
Total:
4 x PCIe x16 (Gen3 x16 bus) slots
Supports:
1 x PCIe x16 (Gen3 x16 bus) slot
Total:
4 x PCIe x16 (Gen3 x16 bus) slots
Supports:
- NVIDIA GRID K340
- AMD FirePro S9150
Internal I/O
Per node:
1 x Front panel VGA header
1 x 24-pin ATX main power connector
1 x 4-pin 12V auxiliary power connector
1 x PCIe x16 and x8 bandwidth switch jumper
1 x CPU fan header
1 x Front panel header
3 x System fan headers
1 x PMBus connector
1 x USB 3.0 header
1 x USB 2.0 header
1 x SATA port 4 DOM support jumper
1 x Case open intrusion header
1 x Battery power cable connector
5 x SATA III 6Gb/s ports
1 x SATA SGPIO header
1 x Clear CMOS jumper
1 x ME update jumper
1 x BIOS recovery jumper
1 x BMC readiness LED
1 x IPMB connector
1 x TPM header
1 x Front panel VGA header
1 x 24-pin ATX main power connector
1 x 4-pin 12V auxiliary power connector
1 x PCIe x16 and x8 bandwidth switch jumper
1 x CPU fan header
1 x Front panel header
3 x System fan headers
1 x PMBus connector
1 x USB 3.0 header
1 x USB 2.0 header
1 x SATA port 4 DOM support jumper
1 x Case open intrusion header
1 x Battery power cable connector
5 x SATA III 6Gb/s ports
1 x SATA SGPIO header
1 x Clear CMOS jumper
1 x ME update jumper
1 x BIOS recovery jumper
1 x BMC readiness LED
1 x IPMB connector
1 x TPM header
Front I/O
Per node:
2 x USB 3.0
1 x VGA
1 x Power button with LED
1 x ID button with LED
1 x NMI LED
1 x BMC reset LED
1 x System status LED
Total:
8 x USB 3.0
4 x VGA
4 x Power buttons with LED
4 x ID buttons with LED
4 x NMI LEDs
4 x BMC reset LEDs
4 x System status LEDs
2 x USB 3.0
1 x VGA
1 x Power button with LED
1 x ID button with LED
1 x NMI LED
1 x BMC reset LED
1 x System status LED
Total:
8 x USB 3.0
4 x VGA
4 x Power buttons with LED
4 x ID buttons with LED
4 x NMI LEDs
4 x BMC reset LEDs
4 x System status LEDs
Rear I/O
Per node:
2 x USB 2.0
1 x VGA
1 x Serial
2 x RJ45
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
Total:
8 x USB 2.0
4 x VGA
4 x Serial
8 x RJ45
4 x Power buttons with LED
4 x ID buttons with LED
4 x NMI buttons
4 x Reset buttons
2 x USB 2.0
1 x VGA
1 x Serial
2 x RJ45
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
Total:
8 x USB 2.0
4 x VGA
4 x Serial
8 x RJ45
4 x Power buttons with LED
4 x ID buttons with LED
4 x NMI buttons
4 x Reset buttons
Backplane Board
4 x SATA III 6Gb/s ports
TPM
1 x TPM header
Power Supply[#1]
2 x 1600W PSU
80 PLUS Platinum
AC input:
- 100-127V/ 12A, 47-63Hz
- 200-240V/ 9.48A, 47-63Hz
DC output:
- 1000W@100-127V
- 1600W@200-240V
System Management
Aspeed® AST2300 management controller
Avocent® MergePoint IPMI 2.0 web interface:
Avocent® MergePoint IPMI 2.0 web interface:
- Network settings
- Network security settings
- Users control
- Services settings
- IPMI settings
- Sessions control
- LDAP settings
- Power control
- Voltages, fans and temperatures monitoring
- System event log
- Events management (platform events, trap settings, email settings)
- Serial Over LAN
- vKVM & vMedia (launch, configuration)
OS Compatibility
Windows Server 2012 R2 (x64)
Windows Server 2008 R2 (x64)
Red Hat Enterprise Linux 5.9 (x86/x64)
Red Hat Enterprise Linux 6.4 (x86/x64)
SUSE Linux Enterprise Server 11.3 (x86/x64)
VMware ESXi 5.0 / 5.1 / 5.1 U1 / 5.1 U2
Windows Server 2008 R2 (x64)
Red Hat Enterprise Linux 5.9 (x86/x64)
Red Hat Enterprise Linux 6.4 (x86/x64)
SUSE Linux Enterprise Server 11.3 (x86/x64)
VMware ESXi 5.0 / 5.1 / 5.1 U1 / 5.1 U2
System Fans
Per node:
4 x 40x40x56mm
1 x 38x38x48mm
Total:
16 x 40x40x56mm
4 x 38x38x48mm
4 x 40x40x56mm
1 x 38x38x48mm
Total:
16 x 40x40x56mm
4 x 38x38x48mm
Operating Properties
Operating temperature: 5°C to 30°C
Non-operating temperature: 0°C to 40°C
10-80% operating humidity at 30°C
Non-operating temperature: 0°C to 40°C
10-80% operating humidity at 30°C
Weight
32.6kg
Packaging Dimensions
1050x591x218 mm
Packaging Content
1 x Rackmount
1 x Rail kit
1 x Driver CD
1 x Manual
4 x Heatsinks
1 x Rail kit
1 x Driver CD
1 x Manual
4 x Heatsinks
Part Numbers
Rackmount: 6NR21FDNR-00
Rail kit: 25HB2-A86100-K0R
Heatsink: 12SP2-040091-00R
Rail kit: 25HB2-A86100-K0R
Heatsink: 12SP2-040091-00R
[#1] 伺服器產品未附帶電源線。客戶需自行選擇適當的電源線 (可選配件),或聯繫業務協助客製化。
[#2] 本網站所提供之產品規格、圖片及其他資訊僅供參考,如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利,並不對因使用上述資料而導致的任何損失承擔責任。
[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。
[#4] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。
[#2] 本網站所提供之產品規格、圖片及其他資訊僅供參考,如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利,並不對因使用上述資料而導致的任何損失承擔責任。
[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。
[#4] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。
SUPPORT
驅動程式
BIOS
工具程式
Firmware
QVL
- All
- All
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows Server 2008 R2 64bit
- Windows Server 2008 R2
- Windows Server 2008 64bit
- Windows Server 2008 32bit
- Windows 7 64bit
- Windows 7 32bit
- SuSE Linux Enterprise 11.3 64bit
- SuSE Linux Enterprise 11.3 32bit
- Red Hat Enterprise Linux Server 6.4 64bit
- Red Hat Enterprise Linux Server 6.4 32bit
晶片組
晶片組
版本
檔案大小
日期
Intel® INF Driver
Version : 9.4.0.1027
5.23 MB
Jul 01, 2014
作業系統: Windows 7 32bit,Windows 7 64bit,Windows Server 2008 32bit,Windows Server 2008 64bit,Windows Server 2008 R2,Windows Server 2012 64bit,Windows Server 2008 R2 64bit,Windows Server 2012 R2 64bit
網路介面
網路介面
版本
檔案大小
日期
Intel® LAN Driver and Utility
Version : 18.8
78.49 MB
Jul 01, 2014
作業系統: Windows 7 32bit,Windows 7 64bit,Windows Server 2008 32bit,Windows Server 2008 64bit,Windows Server 2008 R2,Windows Server 2012 64bit,Windows Server 2008 R2 64bit,Windows Server 2012 R2 64bit
Intel® LAN Driver and Utility
Version : 18.8
78.49 MB
Jul 01, 2014
作業系統: Red Hat Enterprise Linux Server 6.4 32bit,Red Hat Enterprise Linux Server 6.4 64bit,SuSE Linux Enterprise 11.3 32bit,SuSE Linux Enterprise 11.3 64bit
SATA RAID/AHCI
SATA RAID/AHCI
版本
檔案大小
日期
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 3.8.0.1111
16.07 MB
Jul 01, 2014
作業系統: Windows 7 32bit,Windows 7 64bit,Windows Server 2008 32bit,Windows Server 2008 64bit,Windows Server 2008 R2,Windows Server 2012 64bit,Windows Server 2008 R2 64bit,Windows Server 2012 R2 64bit
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 3.8.0.1111
3.55 MB
Jul 02, 2014
作業系統: Windows 7 32bit,Windows 7 64bit,Windows Server 2008 32bit,Windows Server 2008 64bit,Windows Server 2008 R2,Windows Server 2012 64bit,Windows Server 2008 R2 64bit,Windows Server 2012 R2 64bit
USB 3.0
USB 3.0
版本
檔案大小
日期
Intel® USB 3.0 Driver
Version : 3.0.0.16
5.2 MB
Jul 02, 2014
作業系統: Windows 7 32bit,Windows 7 64bit,Windows Server 2008 32bit,Windows Server 2008 64bit,Windows Server 2008 R2,Windows Server 2008 R2 64bit
顯示介面
顯示介面
版本
檔案大小
日期
ASPEED Graphic Driver
Version : 0.98
26.52 MB
Jul 01, 2014
作業系統: Windows 7 32bit,Windows 7 64bit,Windows Server 2008 32bit,Windows Server 2008 64bit,Windows Server 2008 R2,Windows Server 2012 64bit,Windows Server 2008 R2 64bit,Windows Server 2012 R2 64bit
ASPEED Graphic Driver
Version : 0.98
26.52 MB
Jul 01, 2014
作業系統: Red Hat Enterprise Linux Server 6.4 32bit,Red Hat Enterprise Linux Server 6.4 64bit,SuSE Linux Enterprise 11.3 32bit,SuSE Linux Enterprise 11.3 64bit
BIOS
說明
版本
檔案大小
日期
1.E3-1200 v4 CPU support
2.Correct CPU stepping information in setup menu
[NOTE]: MUST update ME Firmware, see update SOP in .zip file
2.Correct CPU stepping information in setup menu
[NOTE]: MUST update ME Firmware, see update SOP in .zip file
Version : R09
9.51 MB
May 10, 2016
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.
什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。
- All
- All
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows Server 2008 R2 64bit
- Ubuntu
- Linux CentOS
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 1.00
125.66 MB
Aug 01, 2017
作業系統: Windows Server 2012 64bit,Windows Server 2008 R2 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Ubuntu,Windows Server 2016 64bit
說明
版本
檔案大小
日期
RESOURCES
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台灣大學施吉昇教授率領的研究團隊,使用技嘉科技G242-P32伺服器及Arm HPC Developer Kit,開發能夠準確模擬路況的「高精準車流模型」。尖端科技加持的智慧交通解決方案,可用來測試即將上市的自駕車,也能用來觀察易肇事路段,找出引發事故的背後因素。以ARM處理器做為基石的這套開發平台,讓科學家工作效率提升200%,成功因素包括:「雲端原生」處理器和路測裝置使用相同的「指令語法」,減少裝置間溝通的延遲;Ampere® Altra®處理器內含八十顆核心,適合進行平行運算;CPU和GPU間可發揮異質運算的綜效,提升運算效率。ARM產品符合ISO 26262標準要求,這表示台大推出的電腦模型可以快速應用於車廠和政府機關,協助開創智慧型運輸的大未來。
Tech Guide | July 18, 2023
如何挑選適當的伺服器冷卻方案? 技嘉科技《科技指南》系列文章
隨著科技進步,新一代的處理器使用更多電力、產出更多熱能。選購伺服器時,應當留意溫控問題,好的冷卻方案可確保伺服器正常運作,且不至於太耗電、或是需要頻繁的維修。 技嘉科技是高性能伺服器的領導品牌,本篇《科技指南》針對市面上廣泛使用的三種散熱方法(氣冷式、液冷式和浸沒式)逐一說明,並介紹技嘉的相關產品,協助您挑選最適合的解決方案。
Tech Guide | May 31, 2022
私有雲的需要與必要:如何評估企業的雲端部署
雲端運算盛行的當下,想必「私有雲」和「公有雲」對讀者來說不是第一次聽到。很有可能,在您的日常生活中,您已經受惠於這兩種雲端服務,但您真的了解兩者之間的差異嗎?如果有必要,您能幫您的工作場所建構「私有雲」嗎?技嘉科技是伺服器技術和雲端運算解決方案的知名品牌,發表本篇《科技指南》,目的是說明私有雲和公有雲的差別,並且介紹私有雲的種種優勢與限制;最後,本篇文章將推薦適合用來建造私有雲的技嘉科技伺服器產品,讓您有機會享用專屬於您的私有雲。
Tech Guide | February 11, 2022
ARM架構處理器的由來與優勢:從智慧型手機到超級電腦
ARM架構處理器是主流x86處理器架構以外的不同選擇,原本在行動裝置上穩居市占龍頭,如今,也逐漸在伺服器和資料中心產品中出現。技嘉科技是高性能伺服器產品的知名品牌,發表本篇《科技指南》文章,回顧ARM處理器的發展過程,介紹ARM產品的優勢與特性,並且推薦適用於不同領域的技嘉科技伺服器解決方案,協助您解決在工作上可能遇到的問題。
Tech Guide | January 11, 2022
了解叢集(Cluster)、叢集運算(Cluster Computing)與分散式運算
叢集運算是分散式運算的一種,類似平行運算或網格計算;差別在於,叢集運算在高可用性、負載平衡、高效能運算HPC等各方面擁有獨特優勢,因此自成一格。技嘉科技是高性能伺服器產品業界領袖,發表本篇《科技指南》文章,企圖解釋叢集運算的由來,以及它的優勢,並推薦給您適當的伺服器解決方案,讓您有機會建造自己的叢集運算系統。
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