H262-NO0

Rev. 100

HCI Server - 3rd Gen Intel^® Xeon^® Scalable - 2U 4-Node DP 24-Bay Gen4 NVMe/SATA/SAS

# 超融合伺服器 # 私有雲/混和雲伺服器

2U 4-node rear access server system
3rd Gen Intel^® Xeon^® Scalable Processors
Dual processor per node, 10nm technology
8-Channel DDR4 RDIMM/LRDIMM, 64 x DIMMs
Supports Intel^® Optane™ Persistent Memory 200 series
Dual ROM Architecture
Intel^® C621A Chipset
8 x 10Gb/s LAN ports via Intel^® X710-AT2
1 x CMC port
24 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays
8 x LP PCIe Gen4 x16 slots
4 x OCP 2.0 Gen3 x16 mezzanine slots
Dual 2200W 80 PLUS Platinum redundant power supply

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[#1] 本網站所提供之產品規格、圖片及其他資訊僅供參考，如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利，並不對因使用上述資料而導致的任何損失承擔責任。
[#2] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值，實際效能可能因系統配置及使用環境而有所不同。
[#3] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4-Node - Rear access
440 x 87.5 x 840

Motherboard

MH62-HD1

CPU

3rd Generation Intel^® Xeon^® Scalable Processors
Dual processor per node, 10nm technology
CPU TDP up to 270W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

Per Node:
2 x LGA 4189

Total:
8 x LGA 4189

Socket P+

Chipset

Intel^® C621A Chipset

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
8-channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
1.2V modules: 3200/2933/2666 MT/s

LAN

Per node:
2 x 10Gb/s LAN ports (1 x Intel^® X710-AT2)
Support NCSI function

1 x Dedicated management port

Total:
8 x 10Gb/s LAN ports (4 x Intel^® X710-AT2)
Support NCSI function

4 x Dedicated management ports
1 x CMC port

Video

Integrated in Aspeed^® AST2600 x 4
- 4 x VGA ports

Storage

Per node:
6 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1

Total:
24 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1

SAS card is required for SAS devices support

SAS

Depends on SAS add-in cards

RAID

Intel^® SATA RAID 0/1/5/10

Expansion Slots

Per node:
Riser Card CRSH01D:
- 1 x PCIe x16 (Gen4 x16) low-profile slot

Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot

1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth*

Total:
Riser Card CRSH01D x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots

Riser Card CRSH01E x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots

4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bandwidth*

*OCP 2.0 bandwidth is shared with onboard LAN. Onboard LAN would be disabled if OCP 2.0 utilizes Gen3 x16 bandwidth.

Internal I/O

Per node:
1 x COM header
1 x SATA 7-pin connectors
1 x TPM header
1 x VROC connector
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x Reset button

*1 x CMC Status LED
*1 x CMC Reset button

*Only one CMC Status LED and Reset button per system

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply^[#1]

Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input:
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+ 12.12V/ 95.6A
+ 12Vsb/ 3.5A
- Max 2200W/ 200-240V~
+ 12.12V/ 178.1A
+ 12Vsb/ 3.5A

Note: The system power supply requires C19 power cord.

System Management

Aspeed^® AST2600 Baseboard Management Controller
Aspeed^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP/AD/RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Citrix Hypervisor 8.2.0 or later

Red Hat Enterprise Linux 7.9 or later
Red Hat Enterprise Linux 8.2 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later

Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later

Windows Server 2016
Windows Server 2019
Windows Server 2022

System Fans

8 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 30°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Please leave one PCIe slot empty if using processor with 270W TDP

Weight

Net Weight: 26.2 kg
Gross Weight: 49.34 kg

Packaging Dimensions

1180 x 779 x 300 mm

Packaging Content

1 x H262-NO0
8 x CPU heatsinks
1 x 3-Section Rail kit

Part Numbers

- Barebone package: 6NH262NO0MR-00-1*
- Motherboard: 9MH62HD1NR-00
- 3-Section Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-453212-M1R/25ST1-453213-M1R
- Backplane board - CBPH7O0: 9CBPH7O0NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S

Optional parts:

- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 expansion card - CMTP16Z: 9CMTP16ZNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262NO0SR-RMA-A100

[#1] 伺服器產品未附帶電源線。客戶需自行選擇適當的電源線 (可選配件)，或聯繫業務協助客製化。
[#2] 本網站所提供之產品規格、圖片及其他資訊僅供參考，如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利，並不對因使用上述資料而導致的任何損失承擔責任。
[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值，實際效能可能因系統配置及使用環境而有所不同。
[#4] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。

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版本

檔案大小

日期

Intel^® Chipset Driver

Version : 10.1.18612.8252

3.08 MB

Jun 10, 2021

H262-NO0

SPECIFICATIONS

SUPPORT

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H262-NO0 (Rev. 100)