H262-NO0

2U 4-Node - Rear access
440 x 87.5 x 840

MH62-HD1

3rd Generation Intel^® Xeon^® Scalable Processors
Dual processor per node, 10nm technology
CPU TDP up to 270W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Per Node:
2 x LGA 4189

Total:
8 x LGA 4189

Socket P+

Intel^® C621A Chipset

Per node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR4 memory supported only
8-channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
1.2V modules: 3200/2933/2666 MT/s

Per node:
2 x 10Gb/s LAN ports (1 x Intel^® X710-AT2)
Support NCSI function

1 x Dedicated management port

Total:
8 x 10Gb/s LAN ports (4 x Intel^® X710-AT2)
Support NCSI function

4 x Dedicated management ports
1 x CMC port

Integrated in Aspeed^® AST2600 x 4
- 4 x VGA ports

Per node:
6 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1

Total:
24 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1

SAS card is required for SAS devices support

Depends on SAS add-in cards

Intel^® SATA RAID 0/1/5/10

Per node:
Riser Card CRSH01D:
- 1 x PCIe x16 (Gen4 x16) low-profile slot

Riser Card CRSH01E:
- 1 x PCIe x16 (Gen4 x16) low-profile slot

1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth*

Total:
Riser Card CRSH01D x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots

Riser Card CRSH01E x 4:
- 4 x PCIe x16 (Gen4 x16) low-profile slots

4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bandwidth*

*OCP 2.0 bandwidth is shared with onboard LAN. Onboard LAN would be disabled if OCP 2.0 utilizes Gen3 x16 bandwidth.

Per node:
1 x COM header
1 x SATA 7-pin connectors
1 x TPM header
1 x VROC connector
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x Reset button

*1 x CMC Status LED
*1 x CMC Reset button

*Only one CMC Status LED and Reset button per system

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system

Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Dual 2200W 80 PLUS Platinum redundant power supply

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input:
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+ 12.12V/ 95.6A
+ 12Vsb/ 3.5A
- Max 2200W/ 200-240V~
+ 12.12V/ 178.1A
+ 12Vsb/ 3.5A

Note: The system power supply requires C19 power cord.

Aspeed^® AST2600 Baseboard Management Controller
Aspeed^® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

• Dashboard
• HTML5 KVM
• Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
• Sensor Reading History Data
• FRU Information
• SEL Log in Linear Storage / Circular Storage Policy
• Hardware Inventory
• Fan Profile
• System Firewall
• Power Consumption
• Power Control
• Advanced power capping
• LDAP/AD/RADIUS Support
• Backup & Restore Configuration
• Remote BIOS/BMC/CPLD Update
• Event Log Filter
• User Management
• Media Redirection Settings
• PAM Order Settings
• SSL Settings
• SMTP Settings

Citrix Hypervisor 8.2.0 or later

Red Hat Enterprise Linux 7.9 or later
Red Hat Enterprise Linux 8.2 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later

Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later

Windows Server 2016
Windows Server 2019
Windows Server 2022

8 x 80x80x38mm (16,300rpm)

Operating temperature: 10°C to 30°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Please leave one PCIe slot empty if using processor with 270W TDP

Net Weight: 26.2 kg
Gross Weight: 49.34 kg

1180 x 779 x 300 mm

1 x H262-NO0
8 x CPU heatsinks
1 x 3-Section Rail kit

- Barebone package: 6NH262NO0MR-00-1*
- Motherboard: 9MH62HD1NR-00
- 3-Section Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-453212-M1R/25ST1-453213-M1R
- Backplane board - CBPH7O0: 9CBPH7O0NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S

Optional parts:

- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 expansion card - CMTP16Z: 9CMTP16ZNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262NO0SR-RMA-A100