MS24-SU1

Motherboard - Intel® Xeon® 6700/6500-Series Processors R1S - CEB UP
  • Single Intel® Xeon® 6700/6500-series processors with 136 PCIe lanes
  • 8-Channel DDR5 RDIMM/MRDIMM per CPU with 8 x DIMMs
  • 2 x 1 Gb/s LAN ports via Intel® I210-AT
  • 1 x MCIO 8i connector supporting PCIe Gen5 x8
  • 4 x MCIO 8i connectors supporting PCIe Gen5 x8, require 136 PCIe lanes CPU
  • 3 x SlimSAS 4i connectors supporting SATA
  • 2 x M.2 slots with PCIe Gen5 x2
  • 4 x PCIe x16 slots with Gen5 x16 lanes
  • 2 x PCIe x8 slots with Gen5 x8 lanes, require 136 PCIe lanes CPU
Ordering Numbers:
Retail: 9MS24SU1DR-000-1*
Bulk: 9MS24SU1UR-000-1*
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Boosting Individual Applications with On-Point Features

Intel® Xeon® 6 is a new generation of processors that has tailored its CPU lineup to target all uses cases such as Cloud Computing, AI, Analytics, and Edge & IOT. Whether it's high compute density that is dependent on core count and power efficiency or AI/HPC applications that heavily rely on strong single-core performance, this new platform covers them all with its Performance cores (P-cores) and Efficient-cores (E-cores). Along with flexible I/O options, integrated accelerators, and support for CXL 2.0 devices, Intel Xeon 6 fulfills customer needs across the broadest range of data center workloads, segments, and deployment models.
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Core Technology Aligned with Aspirations

Accelerators
built-in*
Incredible performance and efficiency improvements with the easy adoption of on-chip accelerators
8 or 12
Channels
Increased memory frequency and throughput with DDR5 RDIMM support
PCIe 5.0
lanes
Up to 136 lanes for 1S designs, supporting all the latest drives and accelerators
CXL 2.0
support**
Flexible support between PCIe and CXL, utilizing DDR5 and CXL memory as one unified region
Up to 288
E-cores per CPU
Core dense and optimized efficiency for cloud-native and hyperscale workloads
Intel Xeon 6 Processors with E-cores
Up to 128
P-cores per CPU
Greater core performance with improved TCO, accelerating AI and compute intensive workloads
Intel Xeon 6 Processors with P-cores
MRDIMM
support
Unprecedented frequency on the advanced MRDIMM, boosting memory-intensive application to a whole new level
Intel Xeon 6 Processors with P-cores
* Different on-chip accelerators are supported depending on CPU SKUs, and they require a one-time activation. Please visit Intel's official website or contact technical support for details.

** CXL peripheral support varies by product. Please refer to the QVL list for validated configurations.

Select GIGABYTE for the latest Gen Intel Xeon Platform

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High CPU Performance

The best in computational performance relies on a system well designed by our engineers to adequately dissipate heat to achieve peak performance.

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Energy Efficiency

Our engineers have baked in features to achieve higher efficiency from power supplies and server fans. Along with Titanium and Platinum offerings.
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Optimal Price

GIGABYTE releases multiple product models and configurations to target exactly what users want without paying for extra features that go unused.

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Ease of Administration

GIGABYTE servers come with GIGABYTE Management Console for server management. Using a web based browser remotely is key to easing management.

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Continuous Operation

Systems are rigorously designed and tested to ensure downtime will not occur. Customers have come to expect stable performance.

MS24-SU1 Block Diagram

MS24-SU1 Product Overview

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Hardware Security

Optional TPM 2.0 Module
For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.
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High Availability

Dual ROM Architecture
If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version.

產品規格

Form Factor (WxD, mm)
CEB
304.8 x 266.7
CPU
Intel® Xeon® 6 processors
- Intel® Xeon® 6700-series processors
- Intel® Xeon® 6500-series processors

Single processor, TDP up to 350 W
Socket
1 x LGA 4710
Socket E2
Chipset
System on Chip
Memory
8 x DIMM slots
Support DDR5 RDIMM/MRDIMM [1]
8-Channel memory per processor
RDIMM: Up to 6400 MT/s
MRDIMM: Up to 8000 MT/s

[1] MRDIMMs are supported only on select Intel® Xeon® 6 processors with P-cores.
LAN
1 x 1 Gb/s LAN (1 x Intel® I210-AT)
- Support NCSI function

1 x 1 Gb/s LAN (1 x Intel® I210-AT)

1 x Management LAN
Video
Integrated in ASPEED® AST2600
- 1 x VGA port
Audio
N/A
Storage Interface
MCIO:
1 x MCIO 8i for 2 x Gen5 NVMe
4 x MCIO 8i for 8 x Gen5 NVMe [1]

SlimSAS:
3 x SlimSAS 4i for 12 x SATA

M.2:
2 x M.2 (2280/22110), PCIe Gen5 x2

[1] Require CPU with 136 PCIe lanes.
RAID
Onboard VROC key header
PCIe Expansion Slots
Slot_7: PCIe x16 (Gen5 x16)
Slot_6: PCIe x8 (Gen5 x8) [1]
Slot_5: PCIe x16 (Gen5 x16)
Slot_4: PCIe x8 (Gen5 x8) [1]
Slot_3: PCIe x16 (Gen5 x16)
Slot_1: PCIe x16 (Gen5 x16)

1 x MCIO 8i (Gen5 x8)
4 x MCIO 8i (Gen5 x8) [1]

[1] Require CPU with 136 PCIe lanes.
Internal I/O
1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors (for CPU)
1 x 6-pin ATX 12V power connector (for PCIe slot)
1 x 4-pin CPU fan header
1 x 3-pin CPU fan header
6 x System fan headers
1 x USB 3.2 Gen1 x2 header
2 x M.2 slots
5 x MCIO 8i connectors
3 x SlimSAS 4i connectors
1 x VROC connector
1 x NCSI connector
1 x Front panel header
1 x Backplane board header
1 x PMBus header
1 x IPMB header
1 x TPM header
1 x PRoT connector (only enabled on RoT SKU)
Rear I/O
4 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
1 x Serial port
2 x RJ45 ports
1 x MLAN port
1 x ID button with LED
Security Modules
1 x TPM header with SPI interface
- Optional TPM 2.0 kit: CTM012

1 x PRoT connector (only enabled on RoT SKU)
Board Management
ASPEED® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface
PSU Connectors
1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors (for CPU)
1 x 6-pin ATX 12V power connector (for PCIe slot)
Operating Properties
Operating temperature: 10°C to 40°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
Retail Packaging Content
1 x MS24-SU1
1 x I/O shield
2 x CPU carriers

Single Box dimensions: 360 x 330 x 80 mm
Carton dimensions: 674 x 424 x 385 mm
Quantity: 10 x single boxes in one carton
Bulk Packaging Content
10 x MS24-SU1
10 x I/O shields
20 x CPU carriers

Carton dimensions: 600 x 473 x 495 mm
Reference Numbers
Retail: 9MS24SU1DR-000-1*
Bulk: 9MS24SU1UR-000-1*

Part Numbers:

- I/O shield: 12AIO-MS04CE-00R

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