1. Fins-Array II with NanoCarbon Coating
Fins-Array II use a new louvered stacked-fins design which not
only increases surface area by 300% compared to
traditional heatsinks but also improves thermal efficiency with
better airflow and heat exchange.
Direct-Touch Heatpipe II
With an extra large 8mm heatpipe and made from a new
manufacturing process that narrows the gap between the Heatpipe and
heatsink, the new Direct-Touch Heatpipe II greatly help
transfers heat on the MOSFET.
IO Cover is made from aluminum and is connected with Fins-Array
to help overall MOSFET heat dissipation.
4. 3X M.2
Thermal Guard II
Enlarged double-sided M.2 heatsink prevents high-speed, large
capacity PCIe 3.0 SSDs with double side flash from
throttling due to overheating.
5. LAIRD 7.5
W/mK Thermal Pad
By using 1.5mm thicker 7.5 W/mK thermal conductivity pads, it
can transfer 4x more heat compared to traditional thermal
pads in the same time.
A thin layer of NanoCarbon is coated on the baseplate through
electrostatic adhesion to enhance thermal radiation
Over 90% of connectors on Z590 AORUS XTREME are specifically
designed to be right angled for easy cable management and
clean airflow in the chassis.