1. Direct-Touch Heatpipe II
With an extra large 8mm heatpipe and made from a new manufacturing process that narrows the gap between
the heatpipe and heatsink, the new Direct-Touch Heatpipe II greatly help transfers heat on the MOSFET.
2X COPPER PCBs design effectively lower the component temperature by its high thermal conductivity and
M.2 Thermal Guard III constructed with 5.8X optimized heat dissipation surface and double-sided M.2 heatsinks to prevent throttling and bottlenecks on high-speed/ large capacity of PCIe 4.0 M.2 SSDs.
Fins-Array II use a new louvered stacked-fins design which not only increases surface area by 300% compared to traditional heatsinks but also improves thermal efficiency with better airflow and heat exchange.
By using 1.5mm thicker 9 W/mK thermal conductivity pads, it can transfer 5x more heat compared to traditional thermal pads at the same time.
6. Enlarged Thermal Guard
Enlarged double-sided M.2 heatsink prevents high-speed, large capacity PCIe 4.0/3.0 SSDs with double
side flash from throttling due to overheating.
ADVANCED THERMAL SOLUTION
Un-throttled performance is guaranteed by the enhanced thermal solution that incorporates Fins-Array, Heatpipe and Thermal Guards. The comprehensive solution delivers excellent heat dissipation. The Z690 AORUS Motherboards stays cool on VRMs and M.2 SSD even on full loading, making it most suitable for enthusiasts, overclockers and professional gamers.