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H252-3C0 (rev. 100)
HCI Server – Intel UP 2U 4 Nodes Server with 12 x SATA/SAS
| Application:
HCI
&
Hybrid/Private Cloud Server
Application:
- 3rd Gen. Intel® Xeon® Scalable Processors
- 8-Channel RDIMM/LRDIMM DDR4 per processor, 32 x DIMMs
- Intel® C621A Express Chipset
- Dual ROM technology supported
- Supports Intel® Optane™ Persistent Memory 200 series
- 8 x 1Gb/s LAN ports (Intel® I350-AM2)
- 4 x Dedicated management ports
- 1 x CMC global management port
- 12 x 3.5" or 2.5" SATA/SAS hot-swappable SSD bays
- 8 x Low profile PCIe Gen4 x16 expansion slots
- 4 x OCP 2.0 Gen3 x8 mezzanine slots
- 1600W 80 PLUS Platinum redundant PSU
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* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4 Nodes - Rear access
440 x 87.5 x 695
440 x 87.5 x 695
Motherboard
MH12-HD0
CPU
3rd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
10nm technology, CPU TDP up to 270W
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
10nm technology, CPU TDP up to 270W
Socket
Per Node:
1 x LGA 4189
Total:
4 x LGA 4189
Socket P+
1 x LGA 4189
Total:
4 x LGA 4189
Socket P+
Chipset
Intel® C621A Express Chipset
Memory
Per node:
8 x DIMM slots
Total:
32 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHz
8 x DIMM slots
Total:
32 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHz
LAN
Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (1 x Intel® I350-AM2)
4 x Dedicated management ports
1 x 10/100/1000 *CMC global management port
*CMC: Chassis Management Controller, to monitor all status of computing nodes
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (1 x Intel® I350-AM2)
4 x Dedicated management ports
1 x 10/100/1000 *CMC global management port
*CMC: Chassis Management Controller, to monitor all status of computing nodes
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Audio
N/A
Storage
Per node:
3 x 3.5" SATA/SAS hot-swappable SSD bays
1 x SATA DOM
Total:
12 x 3.5" SATA/SAS hot-swappable SSD bays
4 x SATA DOM
3 x 3.5" SATA/SAS hot-swappable SSD bays
1 x SATA DOM
Total:
12 x 3.5" SATA/SAS hot-swappable SSD bays
4 x SATA DOM
SAS
N/A
RAID
N/A
Peripheral Drives
N/A
Expansion Slots
Per node:
2 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth (Type1, P1, P2 with NCSI supported)
Total:
8 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bandwidth (Type1, P1, P2 with NCSI supported)
2 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth (Type1, P1, P2 with NCSI supported)
Total:
8 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bandwidth (Type1, P1, P2 with NCSI supported)
Internal I/O
Per node:
1 x USB 3.0 header
1 x SATA DOM
1 x TPM header
1 x OCP 2.0 mezzanine slots
1 x Front panel header
1 x Back plane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
1 x USB 3.0 header
1 x SATA DOM
1 x TPM header
1 x OCP 2.0 mezzanine slots
1 x Front panel header
1 x Back plane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
*1 x CMC status LED
*Only one CMC status LED per system
1 x Power button with LED
1 x ID button with LED
1 x Status LED
Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
*1 x CMC status LED
*Only one CMC status LED per system
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC global management port
*Only one CMC global management port per system
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC global management port
*Only one CMC global management port per system
Backplane I/O
12 x ports
Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s per port
Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s per port
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
2 x 1600W redundant PSUs
80 PLUS Platinum
AC Input: - 100-127V~/ 12A, 47-63Hz - 200-219V~/ 10A, 47-63Hz - 220-240V~/ 10A, 47-63Hz DC Output: - Max 1000W/ 100-127V~ +12V/ 83A +12Vsb/ 3A - Max 1800W/ 200-240V
+12V/ 148A +12Vsb/ 3A
- Max 1968W/ 200-240V
+12V/ 162A +12Vsb/ 3A
80 PLUS Platinum
AC Input: - 100-127V~/ 12A, 47-63Hz - 200-219V~/ 10A, 47-63Hz - 220-240V~/ 10A, 47-63Hz DC Output: - Max 1000W/ 100-127V~ +12V/ 83A +12Vsb/ 3A - Max 1800W/ 200-240V
+12V/ 148A +12Vsb/ 3A
- Max 1968W/ 200-240V
+12V/ 162A +12Vsb/ 3A
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 8.3 ( x64) or later
SUSE Linux Enterprise Server 12 SP5 ( x64) or later
SUSE Linux Enterprise Server 15 SP2 ( x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
Citrix Hypervisor 8.2.0 or later
Windows Server 2019
Red Hat Enterprise Linux 8.3 ( x64) or later
SUSE Linux Enterprise Server 12 SP5 ( x64) or later
SUSE Linux Enterprise Server 15 SP2 ( x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
Citrix Hypervisor 8.2.0 or later
System Fans
4 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1167 x 700 x 309 mm
Packaging Content
1 x H252-3C0
4 x CPU heatsinks
1 x Rail Kit
4 x CPU heatsinks
1 x Rail Kit
Part Numbers
Barebone package: 6NH2523C0MR-00
Spare parts:
- Motherboard: 9MZ12HD0NR-00
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320J-A0R
- Back plane board: 9CBPH0O4NR-00
- Power Supply: 25EP0-220008-D0S
- Ring topology kit: 6NH262Z65SR-00-100 (optional extra)
Spare parts:
- Motherboard: 9MZ12HD0NR-00
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320J-A0R
- Back plane board: 9CBPH0O4NR-00
- Power Supply: 25EP0-220008-D0S
- Ring topology kit: 6NH262Z65SR-00-100 (optional extra)
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
SUPPORT
Support List
Description
Version
Size
Date
Resources
Video
Others
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