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H261-3C0 (rev. 100)
HCI Server – Intel DP 2U 4 Nodes Server
| Application:
HCI
&
Hybrid/Private Cloud Server
Application:
- 2U - 4 nodes with rear access to the node trays
- 2nd Gen. Intel® Xeon® Scalable and Intel® Xeon® Scalable Processors
- 8 x LGA 3647 sockets
- Intel® C621 Chipset
- 6-Channel RDIMM/LRDIMM DDR4, 64 x DIMMs
- Supports Intel® Optane™ DC Persistent Memory
- 8 x 10Gb/s BASE-T LAN ports (Intel® X550-AT2)
- 4 x Dedicated management ports
- 1 x CMC global management port
- 12 x 3.5" SAS/SATA hot-swappable HDD/SSD bays
- 8 x Low profile PCIe Gen3 expansion slots
- 4 x OCP Gen3 x16 mezzanine slots
- Aspeed® AST2500 remote management controller
- 2200W 80 PLUS Platinum redundant PSU
- Optimized performance with Mellanox Infiniband EDR 100G or Ethernet 100G products
Request a Quote
1/7
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4 Nodes - Rear access
440 x 87 x 820
440 x 87 x 820
Motherboard
MH61-HD3
CPU
2nd Generation Intel® Xeon® Scalable and Intel® Xeon® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor and Intel® Xeon® Bronze Processor
CPU TDP up to 165W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor and Intel® Xeon® Bronze Processor
CPU TDP up to 165W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
Per Node:
2 x LGA 3647
Total:
8 x LGA 3647
Socket P
2 x LGA 3647
Total:
8 x LGA 3647
Socket P
Chipset
Intel® C621 Chipset
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MHz
Maximum verified DCPMM configuration:
* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
* DCPMM 256GB x2 pcs (Per Node)
DCPMM installation locations:
DIMM_P1_(G1, J1)
NOTE:
1. 2933MHz for 2nd Generation Intel® Xeon® Scalable Processors only
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MHz
Maximum verified DCPMM configuration:
* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
* DCPMM 256GB x2 pcs (Per Node)
DCPMM installation locations:
DIMM_P1_(G1, J1)
NOTE:
1. 2933MHz for 2nd Generation Intel® Xeon® Scalable Processors only
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative
LAN
Per node:
2 x 10Gb/s BASE-T LAN ports (Intel® X550-AT2)
1 x Dedicated management port
Total:
8 x 10Gb/s BASE-T LAN ports (Intel® X550-AT2)
4 x Dedicated management ports
1 x 10/100/1000 *CMC global management port
*CMC: Chassis Management Controller, to monitor all status of computing nodes
*Omni-Path is supported in option
2 x 10Gb/s BASE-T LAN ports (Intel® X550-AT2)
1 x Dedicated management port
Total:
8 x 10Gb/s BASE-T LAN ports (Intel® X550-AT2)
4 x Dedicated management ports
1 x 10/100/1000 *CMC global management port
*CMC: Chassis Management Controller, to monitor all status of computing nodes
*Omni-Path is supported in option
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip in CMC board:
Integrated in Aspeed® AST1250
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip in CMC board:
Integrated in Aspeed® AST1250
Integrated in Aspeed® AST2520A2-GP
Audio
N/A
Storage
Per node:
3 x 3.5" SATA/SAS hot-swappable HDD/SSD bays
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)
Total:
12 x 3.5" SATA/SAS hot-swappable HDD/SSD bays
2.5" HDD/SSD supported
SAS card is required for SAS devices support
3 x 3.5" SATA/SAS hot-swappable HDD/SSD bays
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)
Total:
12 x 3.5" SATA/SAS hot-swappable HDD/SSD bays
2.5" HDD/SSD supported
SAS card is required for SAS devices support
RAID
Intel® SATA RAID 0/1/5
Peripheral Drives
N/A
Expansion Slots
Per node:
1 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus)
1 x Half-length low-profile slot with PCIe x8 (Gen3 x8 bus)
1 x OCP mezzanine slot with PCIe Gen3 x16 bus
Total:
4 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus)
4 x Half-length low-profile slot with PCIe x8 (Gen3 x8 bus)
4 x OCP mezzanine slot with PCIe Gen3 x16 bus
1 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus)
1 x Half-length low-profile slot with PCIe x8 (Gen3 x8 bus)
1 x OCP mezzanine slot with PCIe Gen3 x16 bus
Total:
4 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus)
4 x Half-length low-profile slot with PCIe x8 (Gen3 x8 bus)
4 x OCP mezzanine slot with PCIe Gen3 x16 bus
Internal I/O
Per node:
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
*1 x CMC status LED
*Only one CMC status LED per system
1 x Power button with LED
1 x ID button with LED
1 x Status LED
Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
*1 x CMC status LED
*Only one CMC status LED per system
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x RJ45 MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x RJ45 MLAN
4 x ID LEDs
*1 x CMC global management port
*Only one CMC global management port per system
2 x USB 3.0
1 x VGA
2 x RJ45
1 x RJ45 MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x RJ45 MLAN
4 x ID LEDs
*1 x CMC global management port
*Only one CMC global management port per system
Backplane I/O
12 x ports
12Gb/s & 6Gb/s compatible
12Gb/s & 6Gb/s compatible
TPM
1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000
Optional TPM2.0 kit: CTM000
Power Supply
2 x 2200W redundant PSUs
80 PLUS Platinum
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input:
- 240Vdc/ 12.6A
DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~
+ 12.12V/ 178.1A + 12Vsb/ 3.5A
NOTE:
* The system power supply requires C19 type power cord
* 2000W 80 PLUS Titanium PSU as an option
DC Input:
- 240Vdc/ 12.6A
DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~
+ 12.12V/ 178.1A + 12Vsb/ 3.5A
NOTE:
* The system power supply requires C19 type power cord
* 2000W 80 PLUS Titanium PSU as an option
System Management
Aspeed® AST2500 management controller
Avocent® MergePoint IPMI 2.0 web interface:
Avocent® MergePoint IPMI 2.0 web interface:
- Network settings
- Network security settings
- Hardware information
- Users control
- Services settings
- IPMI settings
- Sessions control
- LDAP settings
- Power control
- Fan profiles
- Voltages, fans and temperatures monitoring
- System event log
- Events management (platform events, trap settings, email settings)
- Serial Over LAN
- vKVM & vMedia (HTML5)
OS Compatibility
For Skylake processors:
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 6.9 (x64) or later
Red Hat Enterprise Linux 7.3 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 11 SP4 (x64) or later
SUSE Linux Enterprise Server 12 SP2 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later
Ubuntu 16.04.1 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
For Cascade Lake processors:
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 6.9 (x64) or later
Red Hat Enterprise Linux 7.3 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 11 SP4 (x64) or later
SUSE Linux Enterprise Server 12 SP2 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later
Ubuntu 16.04.1 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later
For Cascade Lake processors:
Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019
Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
Weight
35 kg (full packaging)
System Fans
4 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
1167 X 700 X 309 mm
Packaging Content
1 x H261-3C0
8 x CPU heatsinks
1 x Rail Kit
8 x Non-Fabric CPU carrier
8 x CPU heatsinks
1 x Rail Kit
8 x Non-Fabric CPU carrier
Part Numbers
- Barebone package: 6NH2613C0MR-00
- Motherboard: 9MH61HD3NR-00
- Rail kit: 25HB2-NJ2102-N1R
- CPU heatsink: 25ST1-253208-F2R/25ST1-253209-F2R
- M.2 extension card: 9CMTP01LNR-00 (optional)
- Back plane board: 9CBPH0C1NR-00
- Fan module: 25ST2-883828-D0R
- Power Supply: 25EP0-222001-D0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)
- Ring topology kit: 6NH23NR48SR-00 (optional)
- Motherboard: 9MH61HD3NR-00
- Rail kit: 25HB2-NJ2102-N1R
- CPU heatsink: 25ST1-253208-F2R/25ST1-253209-F2R
- M.2 extension card: 9CMTP01LNR-00 (optional)
- Back plane board: 9CBPH0C1NR-00
- Fan module: 25ST2-883828-D0R
- Power Supply: 25EP0-222001-D0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)
- Ring topology kit: 6NH23NR48SR-00 (optional)
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
SUPPORT
Driver
BIOS
Utility
Firmware
- All
- All
- Windows Server 2019
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Linux
Chipset
Chipset
Version
Size
Date
Intel® Chipset Driver
Version : 10.1.17861.8101
3.34 MB
Apr 18, 2019
OS: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Intel® Chipset Driver
Version : 10.1.18228.8176
3.12 MB
Dec 29, 2019
OS: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
LAN
LAN
Version
Size
Date
Intel® LAN Driver and Utility
Version : 23.5
487.48 MB
Apr 18, 2019
OS: Windows Server 2012 R2 64bit,Linux,Windows Server 2016 64bit,Windows Server 2019
SATA RAID/AHCI
SATA RAID/AHCI
Version
Size
Date
Intel® SATA Preinstall driver
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
(For AHCI / RAID Mode)
Note: Windows setup to read from USB devices
Version : 6.0.0.1357
6.54 MB
Apr 19, 2019
OS: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Intel® Rapid Storage Technology enterprise (Intel® RSTe)
Version : 6.0.0.1357
265.09 MB
Apr 21, 2019
OS: Windows Server 2012 R2 64bit,Windows Server 2016 64bit,Windows Server 2019
Utility
BIOS
Description
Version
Size
Date
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.
What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.
Because BIOS flashing is potentially risky, if you do not encounter problems using the current version of BIOS, it is recommended that you not flash the BIOS. To flash the BIOS, do it with caution. Inadequate BIOS flashing may result in system malfunction.
What is a BETA?
BETA describes a new version that is reliable yet may not include all the features of the final product. During this phase we are previewing new features and gathering customer input to insure our product provides the best experience possible.
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
Utility
Description
Version
Size
Date
GSM CLI
Version : 2.1.61
111.38 MB
May 22, 2023
OS: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
Description
Version
Size
Date
BMC Firmware (AST2520) for CMC module
NOTE: Please make sure 2U-4Node system CMC firmware version is 12.40.19 or later before updating BMC firmware
NOTE: Please make sure 2U-4Node system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.21
78.82 MB
Dec 30, 2022
English
BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.60.39
101.48 MB
Dec 12, 2022
English
Manual
Description
Version
Size
Date
User Guide - GIGABYTE Management Console (Vertiv)
Version : 1.2
3.92 MB
Oct 26, 2018
English
User Guide - BIOS setup manual (Intel Purley platform)
Version : 1.0
19.52 MB
Aug 17, 2017
English
Support List
Description
Version
Size
Date
RESOURCES
Success Case
Articles
Video
News
Security & Technical Advisory
Others
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