With an extra large 8mm heatpipe and made from a new manufacturing
process that narrows
the gap between the Heatpipe and heatsink, the new Direct-Touch
Heatpipe II greatly help
transfers heat on the MOSFET.
2. Fins-Array III
Fins-Array III upgraded thermal performance by using new extended
Irregular fins which
not only increases surface area by incredible 900% compared to traditional
heatsinks but also
improves thermal efficiency with better airflow and heat exchange.
IO Cover is made from aluminum and is connected with Fins-Array to
help overall MOSFET
4. M.2 Thermal
This ultimate M.2 SSD solution contains Fins-Array, heatpipe,
baseplate and NanoCarbon
Coating, and provides throttle-free SSD performance with incredible
12X more surface
By using 1.5mm thicker 9 W/mK thermal conductivity pads, it can
transfer 5X more heat
compared to traditional thermal pads in the same time.
A thin layer of NanoCarbon is coated on the baseplate through
electrostatic adhesion to
enhance thermal radiation capability.
7. Right Angled
Over 90% of connectors on Z690 AORUS XTREME are specifically
designedto be right angled
for easy cable management and clean airflow in the chassis.