Specifications
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 695
CPU
AMD EPYC™ 7002 Series Processors
AMD EPYC™ 7001 Series Processors
Single processor per node, 7nm technology
Up to 64 cores, 128 threads
TDP up to 225W, cTDP up to 240W
Supports cTDP 280W at ambient 30°C
M.2 devices not supported if using 280W CPU
Socket
Per Node:
1 x LGA 4094
Total:
4 x LGA 4094
Socket SP3
Memory
Per node:
8 x DIMM slots
Total:
32 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
Memory speed: Up to 3200 MT/s
LAN
Per node:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x 10/100/1000 Mbps Management port
Total:
8 x 1Gb/s LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x 10/100/1000 Mbps Management ports
1 x CMC port
Video
Integrated in Aspeed® AST2500 x 4
- 4 x VGA ports
Storage
Per node:
6 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
Total:
24 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
SAS
Depends on SAS add-in cards
Expansion Slots
Per node:
1 x PCIe x16 (Gen4 x16) low-profile slot
1 x PCIe x16 (Gen3 x16) low-profile slot
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Total:
4 x PCIe x16 (Gen4 x16) low-profile slots
4 x PCIe x16 (Gen3 x16) low-profile slots
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
8 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Internal I/O
Per node:
1 x TPM header
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x System status LED
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x System status LEDs
*1 x CMC status LED
*Only one CMC status LED per system.
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port
*Only one CMC port per system.
Backplane Board
Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
-
Optional TPM2.0 kit:
CTM010Power Supply[#1]
Dual 2000W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 12A, 47-63Hz
- 200-219V~/ 10A, 47-63Hz
- 220-240V~/ 10A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 10A
DC Output:
- Max 1000W/ 100-127V~
+12V/ 83A
+12Vsb/ 3A
- Max 1800W/ 200-219V~
+12V/ 148A
+12Vsb/ 3A
- Max 1968W/ 220-240V~ or 240Vdc Input
+12V/ 162A
+12Vsb/ 3A
System Management
Aspeed
® AST2500 Baseboard Management Controller
Aspeed
® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Citrix Hypervisor 8.1.0 or later
Red Hat Enterprise Linux 7.6 or later
Red Hat Enterprise Linux 8.0 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP4 or later
SUSE Linux Enterprise Server 15 SP1 or later
Ubuntu 16.04.6 LTS or later
Ubuntu 18.04.3 LTS or later
Ubuntu 20.04 LTS or later
VMware ESXi 6.5 EP15 or later
VMware ESXi 6.7 Update3 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 25.2 kg
Gross Weight: 43.6 kg
Packaging Dimensions
1167 x 700 x 309 mm
Packaging Content
1 x H252-Z10
4 x CPU heatsinks
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH252Z10MR-00-1*
- Motherboard: 9MZ12HD0NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320J-A0R
- Backplane board - CBPH0O4: 9CBPH0O4NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-220008-D0S
Optional parts:
- Power cord 125V/15A (JP): 25CPA-018304-Q0R
- M.2 expansion card - CMTP051: 9CMTP051NR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH252Z10SR-RMA-A100
[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical interface values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.