HPC/AI Server - Intel® Xeon® 6700/6500-Series Processors - 8U DP NVIDIA HGX™ B200 - G894-SD1-AAX5

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G894-SD1-AAX5

HPC/AI Server - Intel^® Xeon^® 6700/6500-Series Processors - 8U DP NVIDIA HGX^™ B200

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NVIDIA HGX^™ B200
1.8 TB/s GPU-to-GPU bandwidth with NVIDIA NVLink^™ and NVIDIA NVLink^™ Switch
Dual Intel^® Xeon^® 6700/6500-Series Processors
8-Channel DDR5 RDIMM/MRDIMM per CPU with 32 x DIMMs
Compatible with NVIDIA BlueField^®-3 DPUs and NVIDIA ConnectX^®-7 NICs
2 x 10 Gb/s LAN ports via Intel^® X710-AT2
2 x M.2 slots with PCIe Gen5 x4 and x2
8 x 2.5" Gen5 NVMe hot-swap bays
4 x FHHL dual-slot PCIe x16 slots with Gen5 x16 lanes
8 x FHHL single-slot PCIe x16 slots with Gen5 x16 lanes
Compatible with SupremeRAID^™ AE by Graid Technology
6+6 3000 W 80 PLUS Titanium redundant power supplies

Ordering Numbers: 6NG894SD1DR000AAX5*

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Boosting Individual Applications with On-Point Features

Intel^® Xeon^® 6 is a new generation of processors that has tailored its CPU lineup to target all uses cases such as Cloud Computing, AI, Analytics, and Edge & IOT. Whether it's high compute density that is dependent on core count and power efficiency or AI/HPC applications that heavily rely on strong single-core performance, this new platform covers them all with its Performance cores (P-cores) and Efficient-cores (E-cores). Along with flexible I/O options, integrated accelerators, and support for CXL 2.0 devices, Intel Xeon 6 fulfills customer needs across the broadest range of data center workloads, segments, and deployment models.

Core Technology Aligned with Aspirations

Accelerators

built-in*

Incredible performance and efficiency improvements with the easy adoption of on-chip accelerators

8 or 12

Channels

Increased memory frequency and throughput with DDR5 RDIMM support

PCIe 5.0

lanes

Up to 136 lanes for 1S designs, supporting all the latest drives and accelerators

CXL 2.0

support**

Flexible support between PCIe and CXL, utilizing DDR5 and CXL memory as one unified region

Up to 288

E-cores per CPU

Core dense and optimized efficiency for cloud-native and hyperscale workloads

Intel Xeon 6 Processors with E-cores

Up to 128

P-cores per CPU

Greater core performance with improved TCO, accelerating AI and compute intensive workloads

Intel Xeon 6 Processors with P-cores

MRDIMM

support

Unprecedented frequency on the advanced MRDIMM, boosting memory-intensive application to a whole new level

Intel Xeon 6 Processors with P-cores

* Different on-chip accelerators are supported depending on CPU SKUs, and they require a one-time activation. Please visit Intel's official website or contact technical support for details.

** CXL peripheral support varies by product. Please refer to the QVL list for validated configurations.

Select GIGABYTE for the latest Gen Intel Xeon Platform

High CPU Performance

The best in computational performance relies on a system well designed by our engineers to adequately dissipate heat to achieve peak performance.

Energy Efficiency

Our engineers have baked in features to achieve higher efficiency from power supplies and server fans. Along with Titanium and Platinum offerings.

Optimal Price

GIGABYTE releases multiple product models and configurations to target exactly what users want without paying for extra features that go unused.

Ease of Administration

GIGABYTE servers come with GIGABYTE Management Console for server management. Using a web based browser remotely is key to easing management.

Continuous Operation

Systems are rigorously designed and tested to ensure downtime will not occur. Customers have come to expect stable performance.

G894-SD1-AAX5 Product Overview

G894-SD1-AAX5 Block Diagram

High Performance

Supports NVIDIA HGX™ B200

The NVIDIA HGX™ B200 propels the data center into a new era of accelerating computing and generative AI, integrating NVIDIA Blackwell Tensor Core GPUs with a high-speed interconnect to accelerate AI performance at scale. Configurations of eight GPUs deliver unparalleled generative AI acceleration alongside a remarkable 1.4 TB of GPU memory and 64 TB/s of memory bandwidth for 15X faster real-time trillion-parameter-model inference, 12X lower cost, and 12X less energy. This extraordinary combination positions HGX B200 as a premier accelerated x86 scale-up platform designed for the most demanding generative AI, data analytics, and HPC workloads. HGX B200 supports advanced networking options—at speeds up to 400 Gb/s—delivering the highest AI performance with NVIDIA Quantum-2 InfiniBand and the Spectrum™-X Ethernet platform. HGX B200 with NVIDIA® BlueField®-3 DPUs enable cloud networking, composable storage, zero-trust security, and GPU compute elasticity in hyperscale AI clouds.

AI Storage Acceleration

Support SupremeRAID™ AE for AI Infrastructure

GIGABYTE servers have been tested and validated with Graid Technology SupremeRAID™ AE, a GPU-accelerated NVMe RAID solution designed to deliver high levels of storage performance for AI training, inference, KV Cache offloading, and high-performance computing. By leveraging existing GPU resources without requiring additional RAID hardware, SupremeRAID™ AE helps enterprises, data scientists, and engineers reduce storage bottlenecks, lower CPU overhead, and keep GPU workloads running efficiently.

Hardware Security

Optional TPM 2.0 Module

For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.

Power Efficiency

Automatic Fan Speed Control

GIGABYTE servers are enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.

User Friendly

Full-Height Add-In Cards

Support full-height add-in cards on all PCIe expansion slots to accommodate DPUs and SuperNICs.

Easy Maintenance

PCIe cage design and front-access motherboard/GPU trays for streamlined maintenance.

Flexible PSU Configuration

Hot-swappable, fully redundant PSUs with multiple connector options for enhanced flexibility.

Tool-less Drive Bays Design

Clipping mechanism secures the drive in place. Install or replace a new drive in seconds.

Certified Ready with Software Partners

Being a member of key software alliance partner programs enables GIGABYTE to rapidly develop and validate joint solutions, enabling our customers to modernize their data centers and implement IT infrastructure and application services with speed, agility, and cost optimization.

High Availability

Smart Ride Through (SmaRT)

To prevent server downtime and data loss as a result of loss of AC power, GIGABYTE implements SmaRT in all our server platforms. When such an event occurs, the system will throttle while maintaining availability and reducing power load. Capacitors within the power supply can supply power for 10-20ms, which is enough time to transition to a backup power source for continued operation.

Smart Crises Management and Protection (SCMP)

SCMP is a GIGABYTE patented feature which is deployed in servers with non-fully redundant PSU design. With SCMP, in the event of faulty PSU or overheated system, the system will force the CPU into an ultra-low power mode that reduces the power load, which prevents the system from unexpected shutdown and avoids component damage or data loss.

Dual ROM Architecture

If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version.

產品規格

Dimensions (WxHxD, mm)

8U
447 x 351 x 923

Motherboard

MSB4-PE0

CPU

Intel^® Xeon^® 6 Processors
- Intel^® Xeon^® 6700-Series Processors
- Intel^® Xeon^® 6500-Series Processors

Dual processors, TDP up to 350 W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 4710
Socket E2

Chipset

System on Chip

Memory

32 x DIMM slots
Support DDR5 RDIMM/MRDIMM^[1]
8-Channel memory per processor
RDIMM: Up to 6400 MT/s (1DPC), 6000 MT/s (2DPC)
MRDIMM: Up to 8000 MT/s

^[1]MRDIMMs are supported only on select Intel^® Xeon^® 6 processors with P-cores and only in a 1DPC configuration.

LAN

Front (I/O board):
2 x 10 Gb/s LAN (1 x Intel^® X710-AT2)
- Support NCSI function

1 x 10/100/1000 Mb/s Management LAN

Rear (MLAN board):
1 x 10/100/1000 Mb/s Management LAN

^[Note]When both MLAN ports are connected with cables, the front MLAN port will be set as the default.

Video

Integrated in ASPEED^® AST2600
- 1 x VGA port

Storage

Front hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89104)

Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen5 x2, from CPU_1

^[Note]Compatible with SupremeRAID^™ AE by Graid Technology.

Modular GPU

NVIDIA HGX^™ B200 with 8 x SXM GPUs

PCIe Expansion Slots

8 x FHHL x16 (Gen5 x16), from PEX89104
4 x FHHL x16 (Gen5 x16), from PEX89048

Front I/O

I/O board:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED

Rear I/O

MLAN board:
1 x MLAN port

Security Modules

1 x TPM header with SPI interface
- Optional TPM 2.0 kit: CTM012

Power Supply^[#1]

6+6 3000 W 80 PLUS Titanium redundant power supplies^[1]

AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 14A

DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Fans

Motherboard:
2 x 60x60x56mm
4 x 60x60x76mm

PCIe slots:
4 x 80x80x56mm

GPU tray:
15 x 80x80x80mm

Operating Properties

Operating temperature: 10°C to 30°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)

Weight

Net Weight: 91.6 kg
Gross Weight: 95 kg

Packaging Dimensions

1200 x 800 x 620 mm

Packaging Content

1 x G894-SD1-AAX5
2 x CPU heatsinks
4 x Carriers
1 x L-shape Rail kit

Part Numbers

- Barebone with NVIDIA module: 6NG894SD1DR000AAX5*
- Motherboard: 9MSB4PE0UR-000*
- L-shape Rail kit: 25HB2-UM6100-K0R
- Front panel board - CFPG440: 9CFPG440NR-00*
- Backplane board - CBPG641: 9CBPG641NR-00*

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[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值，實際效能可能因系統配置及使用環境而有所不同。

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