H231-H60 (rev. 100/A00)

2U 2 Nodes - Rear access
440 x 87 x 820

MH61-HD5

2nd Generation Intel^® Xeon^® Scalable and Intel^® Xeon^® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor and Intel® Xeon® Bronze Processor
CPU TDP up to 165W
NOTE:
* If only 1 CPU is installed, some PCIe or memory functions might be unavailable
* This device does not support Intel Omni-Path function

Per Node:
2 x LGA 3647
Total:
4 x LGA 3647
Socket P

Intel^® C621 Express Chipset

Per node:
16 x DIMM slots

Total:
32 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel^® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MHz

Maximum verified DCPMM configuration:

* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
* DCPMM 256GB x2 pcs (Per Node)

DCPMM installation locations:
DIMM_P1_( G1, J1)

NOTE:
1. 2933MHz for 2nd Generation Intel^® Xeon^® Scalable Processors only
2. Intel^® Optane™ DC Persistent Memory for 2nd Generation Intel^® Xeon^® Scalable Processors only
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative

Per node:
1 x Dedicated management port

Total:
2 x Dedicated management ports
1 x 10/100/1000 *CMC global management port

* CMC: Chassis Management Controller, to monitor all status of computing nodes
* Please contact FAE if NCSI function of OCP mezzanine card is needed

Integrated in Aspeed^® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip in CMC board:
Integrated in Aspeed^® AST1250

-

Per node:
10 x 2.5" SAS/SATA hot-swappable HDD/SSD bays
2 x 2.5" U.2 or SAS/SATA hot-swappable HDD/SSD bays
1 x Broadcom SAS35x24R expander
Default configuration supports:
2 x U.2 and 0 x SAS/SATA drives
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)

Total:
24 x 2.5" SAS/SATA hot-swappable HDD/SSD bays
- 20 x 2.5" SAS/SATA hot-swappable HDD/SSD bays
- 4 x 2.5" U.2 or SAS/SATA hot-swappable HDD/SSD bays
2 x Broadcom SAS35x24R expander
Default configuration supports:
4 x U.2 and 0 x SAS/SATA drives
SAS card is required to enable the drive bays

For SATA drives:
Intel® SATA RAID 0/1/5/10
For U.2 drives:
Intel® Virtual RAID On CPU (VROC) RAID 0, 1
Note: VROC module is for Intel®SSD only

-

Per node:
1 x PCIe x16 slot (Gen3 x16 bus) for GPU
1 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus)
1 x Half-length low-profile slot with PCIe x8 (Gen3 x8 bus)
1 x OCP mezzanine slot with PCIe Gen3 x16 bus

Total:
2 x PCIe x16 slots (Gen3 x16 bus) for GPUs
2 x Half-length low-profile slot with PCIe x16 (Gen3 x16 bus)
2 x Half-length low-profile slot with PCIe x8 (Gen3 x8 bus)
2 x OCP mezzanine slot with PCIe Gen3 x16 bus

- For the latest GPU QVL, please contact your GIGABYTE representative

Per node:
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED

Total:
2 x Power button with LED
2 x ID button with LED
2 x Status LED
*1 x CMC status LED

*Only one CMC status LED per system

Per node:
2 x USB 3.0
1 x VGA
1 x RJ45 MLAN
1 x ID LED

Total:
4 x USB 3.0
2 x VGA
2 x RJ45 MLAN
2 x ID LEDs
*1 x CMC global management port

*Only one CMC global management port per system

24 x ports
12Gb/s & 6Gb/s compatible
PCIe Gen3 x4 U.2 port

1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000

2 x 2200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V
+12.12V/ 178.1A
+12Vsb/ 3.5A

NOTE:
* The system power supply requires C19 type power cord
* 2000W 80 PLUS Titanium PSU as an option

Aspeed^® AST2500 management controller
Avocent^® MergePoint IPMI 2.0 web interface:

• Network settings
• Network security settings
• Hardware information
• Users control
• Services settings
• IPMI settings
• Sessions control
• LDAP settings
• Power control
• Fan profiles
• Voltages, fans and temperatures monitoring
• System event log
• Events management (platform events, trap settings, email settings)
• Serial Over LAN
• vKVM & vMedia (HTML5)

For Skylake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 6.9 (x64) or later
Red Hat Enterprise Linux 7.3 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later

SUSE Linux Enterprise Server 11.4 (x64) or later
SUSE Linux Enterprise Server 12.2 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 16.04.1 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

For Cascade Lake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later

SUSE Linux Enterprise Server 12.3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later

30 kg (full packaging)

8 x 80x80x38mm (16,300rpm)

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

NOTE: Please contact Technical Support for more information about optimized GPU system operating temperature

1167 X 700 X 309 mm

1 x H231-H60
4 x CPU heatsinks
1 x Rail Kit
1 x VROC module
4 x Non-Fabric CPU carrier

Barebone package: 6NH231H60MR-00
Spare parts:
- Motherboard: 9MH61HD5NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-NJ2102-N1R
- CPU heatsink: 25ST1-253203-F2R/25ST1-253204-F2R
- Back plane board: 9CBPH0O0NR-00
- Power Supply: 25EP0-222001-D0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (in option)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (in option)
- C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (in option)
- Ring topology kit: 6NH23NR48SR-00 (in option)