ORV3 GPU Server - Intel® Xeon® 6700/6500-Series Processors - 4OU DP NVIDIA HGX™ B300 DLC - TO46-SD3-LA07

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TO46-SD3-LA07

ORV3 GPU Server - Intel^® Xeon^® 6700/6500-Series Processors - 4OU DP NVIDIA HGX^™ B300 DLC

Liquid-cooled NVIDIA HGX^™ B300
Integrated-manifold DLC solution with leak detection
8 x 800 Gb/s OSFP XDR InfiniBand or dual 400 Gb/s Ethernet GPU networking ports via onboard NVIDIA ConnectX^®-8 SuperNIC^™
1.8 TB/s GPU-to-GPU bandwidth with NVIDIA NVLink^™ and NVIDIA NVLink^™ Switch
Dual Intel^® Xeon^® 6700/6500-Series Processors
8-Channel liquid-cooled DDR5 RDIMM/MRDIMM per CPU with 32 x DIMMs
Compatible with NVIDIA BlueField^®-3 DPUs
2 x 10 Gb/s LAN ports via Intel^® X710-AT2
2 x M.2 slots with PCIe Gen5 x4 and x2
8 x 2.5" Gen5 NVMe hot-swap bays
4 x FHHL PCIe x16 slots with Gen5 x16 lanes
48 V to 54 V DC Bus Bar power solution

Ordering Numbers: 6NTO46SD3DR000LA07*

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Boosting Individual Applications with On-Point Features

Intel^® Xeon^® 6 is a new generation of processors that has tailored its CPU lineup to target all uses cases such as Cloud Computing, AI, Analytics, and Edge & IOT. Whether it's high compute density that is dependent on core count and power efficiency or AI/HPC applications that heavily rely on strong single-core performance, this new platform covers them all with its Performance cores (P-cores) and Efficient-cores (E-cores). Along with flexible I/O options, integrated accelerators, and support for CXL 2.0 devices, Intel Xeon 6 fulfills customer needs across the broadest range of data center workloads, segments, and deployment models.

Core Technology Aligned with Aspirations

Accelerators

built-in*

Incredible performance and efficiency improvements with the easy adoption of on-chip accelerators

8 or 12

Channels

Increased memory frequency and throughput with DDR5 RDIMM support

PCIe 5.0

lanes

Up to 136 lanes for 1S designs, supporting all the latest drives and accelerators

CXL 2.0

support**

Flexible support between PCIe and CXL, utilizing DDR5 and CXL memory as one unified region

Up to 288

E-cores per CPU

Core dense and optimized efficiency for cloud-native and hyperscale workloads

Intel Xeon 6 Processors with E-cores

Up to 128

P-cores per CPU

Greater core performance with improved TCO, accelerating AI and compute intensive workloads

Intel Xeon 6 Processors with P-cores

MRDIMM

support

Unprecedented frequency on the advanced MRDIMM, boosting memory-intensive application to a whole new level

Intel Xeon 6 Processors with P-cores

* Different on-chip accelerators are supported depending on CPU SKUs, and they require a one-time activation. Please visit Intel's official website or contact technical support for details.

** CXL peripheral support varies by product. Please refer to the QVL list for validated configurations.

Why Choose GIGABYTE Liquid Cooling Servers?

Cool Performance

Servers will run incredibly stable and have high-performance from liquid cooled components that operate well below CPU TDP.

Power Saving

A liquid cooled server with less fans and running at lower speeds can achieve the same performance as an air-cooled server while consuming less power.

Noise Reduction

Servers require a lot of high-speed, high noise fans. GIGABYTE has found a way to reduce the noise by reducing the number of fans while using a liquid cooling solution.

Proven Track Record

The direct liquid cooling system supplier has 20 years of experience in cooling solutions for desktops PCs & data centers. GIGABYTE has 20+ years of experience as well.

Reliability

Liquid cooling solutions can be monitored with little need for maintenance. GIGABYTE manifold and cold plate components are covered under standard warranty.

Ease of Use

GIGABYTE servers paired with a liquid cooling kit can be mounted in a rack or connected to a building’s water system. And offers quick/easy/dry disconnects.

TO46-SD3-LA07 Block Diagram

High Performance

Supports NVIDIA HGX™ B300

NVIDIA HGX™ B300 is built for the age of AI reasoning with enhanced compute and increased memory. Featuring 7X more AI compute than Hopper platforms, 2.1TB of HBM3E memory, and high-performance networking integration with NVIDIA^® ConnectX^®-8 SuperNICs, Blackwell Ultra delivers breakthrough performance on the most complex workloads from agentic systems and reasoning, to real time video generation for every data center.

Empowering Innovation, Built for Open Compute

GIGABYTE OCP ORV3 Compliant Solutions

GIGABTYE is an active member of the OCP, regularly attending the OCP's annual summits and continuously designing and releasing new compute, storage and GPU server hardware based on the OCP Open Rack Standard specifications and providing the best performing mezzanine cards for your OCP solution. GIGABYTE’s latest OCP server product line is based on OCP Open Rack V3 specification. The products are designed for a OCP rack and feature a separate PSU system, with power supplied to each server node by a bus-bar system running along the rear of the rack.

GIGABYTE OCP ORV3 Compliant Solutions Advantages

Efficient Rack Density

Optimal design (2OU 2nodes / 2OU 3nodes) - balanced consideration between density and power consumption.

Thermal Optimization

Best thermal consideration to develop Rack and Nodes based on Cold Aisle/Hot Aisle concept.
Reduce power consumption of cooling.

Greater Power Efficiency

Low PUE helps reduce data center operating expense.
Central power shelf design to enhance power efficiency and optimize power consumption.

Easy Maintenance

Easier maintenance in front cold aisle instead of hot aisle.
Tool-less design for easy replacement and repair.
Less PSU quantities in whole rack to minimize maintenance efforts.

Higher MTBF

Centralizing power supplies and removing unnecessary components to enhance MTBF (Mean Time Between Failures).
Avoids system downtime caused by component failure and minimizes maintenance efforts.

Specificații

Dimensions (WxHxD, mm)

4OU
537 x 189.2 x 840

Motherboard

MSB4-PE3

CPU

Intel^® Xeon^® 6 Processors
- Intel^® Xeon^® 6700-Series Processors
- Intel^® Xeon^® 6500-Series Processors

^[DLC]Dual processors, TDP up to 350 W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 4710
Socket E2

Chipset

System on Chip

Memory

^[DLC]32 x DIMM slots
Support DDR5 RDIMM/MRDIMM^[1]
8-Channel memory per processor
RDIMM: Up to 6400 MT/s (1DPC), 6000 MT/s (2DPC)
MRDIMM: Up to 8000 MT/s

^[1]MRDIMMs are supported only on select Intel^® Xeon^® 6 processors with P-cores and only in a 1DPC configuration.

LAN

Front (I/O board):
2 x 10 Gb/s LAN (1 x Intel^® X710-AT2)
- Support NCSI function

1 x 10/100/1000 Mb/s Management LAN

Front:
8 x 800 Gb/s OSFP XDR InfiniBand or dual 400 Gb/s Ethernet, for GPU networking, via NVIDIA ConnectX^®-8 SuperNIC^™

Video

Integrated in ASPEED^® AST2600
- 1 x VGA port

Storage

Front hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89072)

Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen5 x2, from CPU_1

Modular GPU

^[DLC]NVIDIA HGX^™ B300 with 8 x SXM GPUs

PCIe Expansion Slots

PCIe Bridge Board x 2:
- 4 x FHHL x16 (Gen5 x16), from PEX89072

^[Note]The ambient temperature is limited to 30°C when NVIDIA BlueField^®-3 DPUs/SuperNIC^™ are installed.

Front I/O

8 x OSFP ports

I/O board:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED

Security Modules

1 x TPM header with SPI interface
- Optional TPM 2.0 kit: CTM012

System Fans

2 x 80x80x38mm
4 x 92x92x76mm

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)

^[Note]To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 45°C.

Weight

Net Weight: 91 kg
Gross Weight: 106 kg

Packaging Dimensions

1245 x 751 x 290 mm

Packaging Content

1 x TO46-SD3-LA07
4 x Carriers
1 x L-shape rail kit

Part Numbers

- Barebone with NVIDIA module: 6NTO46SD3DR000LA07*
- Motherboard: 9MSB4PE3UR-000*
- L-shape rail kit: 25HB4-DOA300-U1R
- Front panel board - CFPG440: 9CFPG440NR-00*
- Backplane board - CBPG680: 9CBPG680NR-00*

[#1] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.

[#2] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.

[#3] All trademarks and logos are the property of their respective owners.

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