Specificații
Dimensions (WxHxD, mm)
6U
438 x 264 x 805
CPU
Intel® Xeon® 6 processors
- Intel® Xeon® 6700-Series processors
- Intel® Xeon® 6500-Series processors
[DLC] Dual processors, TDP up to 350 W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4710
Socket E2
Memory
[DLC] 32 x DIMM slots
Support DDR5 RDIMM/MRDIMM [1]
8-Channel memory per processor
RDIMM: Up to 6400 MT/s (1DPC), 6000 MT/s (2DPC)
MRDIMM: Up to 8000 MT/s
[1] MRDIMMs are supported only on select Intel® Xeon® 6 processors with P-cores and only in a 1DPC configuration.
LAN
Front (ConnectX®-8 SuperNIC™ switch board):
8 x QSFP ports (400 Gb/s InfiniBand/Ethernet, for GPU networking)
Front (I/O board):
1 x 10/100/1000 Mb/s Management LAN
Video
Integrated in ASPEED® AST2600
- 1 x Mini-DP
Storage
Front hot-swap:
8 x E1.S Gen5 NVMe
- (4 x NVMe from CPU_0, 4 x NVMe from CPU_1)
Internal M.2 (M.2 expansion card):
2 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_0
PCIe Expansion Slots
ConnectX®-8 SuperNIC™ switch board:
- [DLC] 8 x NVIDIA RTX PRO™ 6000 Blackwell Server Edition GPUs
PCIe Cable x 3:
- 1 x NVIDIA BlueField®-3 DPU, from CPU_1
- 1 x FHFL x16 (Gen5 x16), from CPU_0
- 1 x FHFL x16 (Gen5 x16), from CPU_1
Front I/O
ConnectX®-8 SuperNIC™ switch board:
8 x QSFP ports
I/O board:
1 x USB 3.2 Gen1 port (Type-A)
1 x Mini-DP
1 x Debug port (Micro USB)
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x Reset button
Security Modules
1 x TPM header with SPI interface
-
Optional TPM 2.0 kit:
CTM012Power Supply[#1]
6 x 3200 W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 100-127V~, 16A, 50-60Hz
- 200-220V~, 16A, 50-60Hz
- 220-240V~, 16A, 50-60Hz
DC Input: (Only for China)
- 240Vdc, 16A
DC Output:
- Max 1300W/ 100-127V~
+12.2V/ 106.6A
+12.2Vsb/ 3A
- Max 3000W/ 200-220V~
+12.2V/ 246A
+12.2Vsb/ 3A
- Max 3200W/ 220-240V~ or 240Vdc Input
+12.2V/ 262.3A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Fans
6 x 60x60x56mm
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 45°C.
Weight
Net Weight: 108 kg
Gross Weight: 117 kg
Packaging Dimensions
1200 x 800 x 444 mm
Packaging Content
1 x XLS4-SX2-LAS1
4 x CPU carriers
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NXLS4SX2DR000LAS1*
- Motherboard: 9MSX4MG2NR-000*
- 3-Section Rail kit: 25HB2-U9DH00-K0R
- Backplane board - CBPX081: 9CBPX081NR-00*
- I/O board - CBG7J: 9CBG7JNR-00*
- DC-SCM board - CDCX102: 9CDCX102NR-00*
[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.