GA-EX58-UD5 ‏(rev. 1.0)‏

The EX58-UD5 is the latest high performance X58 Series motherboards of GIGABYTE, designed from the ground up to unleash the awesome power of Intel’s new Core i7 processors. Equipped with a host of new features including the new QPI interface, 3 channel DDR3 support, 3 Way SLI™ and CrossFireX™ support, Ultra Durable 3 technology and the industry’s most extensive range of overclocking features, the EX58-UD5 is bringing excitement back into the high performance motherboard industry.

The EX58-UD5 was designed specifically to take advantage of the raw power of the next generation Intel^® Core™ i7 processors and the Intel^® X58 Express chipset, whose new evolution in computing architecture is able to deliver an amazing performance break through from past processor generations. Replacing the Front Side Bus is the new Quick Path Interconnect, or QPI, whose 25.6 GB/sec transfer rate (double the bandwidth of the 1600MHz FSB) eliminates the communication bottleneck between the processor and chipset.
Intel^® Core™ i7 processors also feature an integrated memory controller inside the processor die and support 192bit 3-channel DDR3 memory that delivers a 50% memory bandwidth enhancement and lower memory latency for incredibly fast memory access. Additionally, The EX58-UD5 features Intel^® Turbo Boost Technology, which is able to power down idle processor cores and dynamically reroute the power to the active cores for significant performance boosts, and at the same time, maintain greater energy efficiency.

The motherboard qualified for WHQL (Windows Hardware Quality Labs) certification of Windows 7 from Microsoft^®, setting the standard for future Windows 7 certified motherboards...more

GIGABYTE Ultra Durable 3 design, featuring 2 ounces of copper for both the Power and Ground layers which dramatically lowers system temperature by delivering a more efficient spreading of heat from critical areas of the motherboard such as the CPU power zone throughout the entire PCB. GIGABYTE’s Ultra Durable 3 also lowers the PCB impedance by 50%, which helps to reduce electrical waste and further lowers component temperatures. A 2oz Copper layer design also provides improved signal quality and lower EMI (Electromagnetic Interference), providing better system stability and allowing for greater margins for overclocking...more

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In addition, doubling the amount of copper lowers the PCB impedance by 50%. Impedance is a measure of how much the circuit impedes the flow of current. The less the flow of current is impeded, the less amount of energy is wasted. For GIGABYTE Ultra Durable 3 motherboards, this means total PCB electrical waste is reduced by 50%, which also means less heat is generated. 2 ounces of copper also provides improved signal quality, providing better system stability and allowing for greater margins for overclocking.

Onboard Power, Clear CMOS and Reset buttons allow for quick and easy tweaking for power users working in an in chassis environment.