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C621-WD12 (Rev. 1.0)

Intel® C621 Chipset
المزايا الرئيسيةالمواصفاتالدعماعرف المزيد

المواصفات

  • المعالج
    1. Support for Intel® Xeon® Scalable Processors in the LGA 3647 package
    2. Dual Socket P (Square) with 2 UPI support of up to 10.4 GT/s, CPU TDP support up to 205W
  • الشريحة الرئيسية
    1. Intel® C621 Chipset
  • الذاكرة
    1. 12 x DDR4 DIMM sockets supporting up to 1.5 TB of system memory
    2. 6 channel memory architecture (6 channel per CPU)
    3. Support for DDR4 2666 MHz memory modules if use a Skylake CPU
    4. Support for DDR4 2933 MHz memory modules if use a Cascade lake CPU
    5. Support for ECC RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS memory modules
  • الصوت
    1. Realtek® ALC1220-VB2 codec
    2. High Definition Audio
    3. 2/4/5.1/7.1-channel
    4. Support for S/PDIF Out
  • الشبكة
    1. 2 x Intel® 210AT GbE LAN chips (10/100/1000 Mbit) (LAN2, LAN3)
  • واجهات تركيب الكروت
    1. 4 x PCI Express x16 slots, running at x16
    2. 3 x PCI Express x16 slots, running at x8
      (All of the PCI Express slots conform to PCI Express 3.0 standard.)
  • واجهات التخزين
  • Chipset:
    1. 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe x4/x2 SSD support)
    2. 8 x SATA 6Gb/s connectors (I-SATA0~I-SATA7)
    3. 2 x SATA 6Gb/s connectors (S-SATA0, S-SATA1)
    4. 2 x U.2 connectors
    5. Support for RAID 0, RAID 1, RAID 5, and RAID 10
  • واجهات USB
  • Chipset:
    1. 1 x USB Type-C™ port on the back panel, with USB 3.1 Gen 2 support
    2. 1 x USB 3.1 Gen 2 Type-A ports (red) on the back panel
    3. 7 x USB 3.1 Gen 1 ports (4 ports on the back panel, 1 port onboard, 2 ports available through the internal USB header)
    4. 2 x USB 2.0/1.1 ports available through the internal USB header
  • موصلات الدخل والخرج الداخلية
    1. 1 x 24-pin ATX main power connector
    2. 2 x 8-pin ATX 12V power connectors
    3. 1 x 6-pin ATX 12V power connector
    4. 2 x CPU fan headers
    5. 5 x system fan headers
    6. 1 x M.2 Socket 3 connector
    7. 10 x SATA 6Gb/s connectors
    8. 2 x U.2 connectors
    9. 2 x SATA DOM power headers
    10. 1 x PMBus connector
    11. 1 x Intel® VROC Upgrade Key header
    12. 1 x front panel header
    13. 1 x front panel audio header
    14. 1 x USB 3.1 Gen 1 header
    15. 1 x USB 3.1 Gen 1 port
    16. 1 x USB 2.0/1.1 header
    17. 1 x Trusted Platform Module(TPM) header (2x6 pin, for the GC-TPM2.0_S module only)
    18. 1 x serial port connector
    19. 1 x chassis intrusion header
    20. 3 x SATA SGPIO headers
    21. 1 x SMD_VMD header
    22. 1 x SMB connector
    23. 1 x TBT connector
    24. 1 x wake on LAN header
    25. 1 x speaker header
    26. 1 x Clear CMOS jumper
    27. 1 x VRM SMB Clock jumper
    28. 1 x VRM SMB Data jumper
    29. 1 x power button
    30. 1 x reset button
  • موصلات اللوحة الخلفية
    1. 1 x PS/2 keyboard/mouse port
    2. 1 x USB Type-C™ port, with USB 3.1 Gen 2 support
    3. 1 x USB 3.1 Gen 2 Type-A port (red)
    4. 4 x USB 3.1 Gen 1 ports
    5. 2 x USB 2.0/1.1 ports
    6. 2 x RJ-45 ports
    7. 1 x optical S/PDIF Out connector
    8. 5 x audio jacks
  • مراقبة المكونات
    1. Voltage detection
    2. Temperature detection
    3. Fan speed detection
    4. Fan speed control
      * Whether the fan speed control function is supported will depend on the fan you install.
  • وحدة التشغيل الرئيسية
    1. 1 x 256 Mbit flash
    2. Use of licensed AMI BIOS
    3. PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
  • Operating Properties
    1. Operating temperature: 10°C to 40°C
    2. Operating humidity: 8 - 80%
    3. Non-operating temperature: -40°C to 70°C
    4. Non-operating humidity: 5% - 95%
  • حجم المنتج
    1. EEB Form Factor; 30.5cm x 33.0cm
  • Support OS
    1. Windows server 2012/2016/2019
    2. Linux
    3. VMware EXSi 6.5/6.7
  • المعالج
    1. Support for Intel® Xeon® Scalable Processors in the LGA 3647 package
    2. Dual Socket P (Square) with 2 UPI support of up to 10.4 GT/s, CPU TDP support up to 205W
  • الشريحة الرئيسية
    1. Intel® C621 Chipset
  • الذاكرة
    1. 12 x DDR4 DIMM sockets supporting up to 1.5 TB of system memory
    2. 6 channel memory architecture (6 channel per CPU)
    3. Support for DDR4 2666 MHz memory modules if use a Skylake CPU
    4. Support for DDR4 2933 MHz memory modules if use a Cascade lake CPU
    5. Support for ECC RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS memory modules
  • الصوت
    1. Realtek® ALC1220-VB2 codec
    2. High Definition Audio
    3. 2/4/5.1/7.1-channel
    4. Support for S/PDIF Out
  • الشبكة
    1. 2 x Intel® 210AT GbE LAN chips (10/100/1000 Mbit) (LAN2, LAN3)
  • واجهات تركيب الكروت
    1. 4 x PCI Express x16 slots, running at x16
    2. 3 x PCI Express x16 slots, running at x8
      (All of the PCI Express slots conform to PCI Express 3.0 standard.)
  • واجهات التخزين
  • Chipset:
    1. 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe x4/x2 SSD support)
    2. 8 x SATA 6Gb/s connectors (I-SATA0~I-SATA7)
    3. 2 x SATA 6Gb/s connectors (S-SATA0, S-SATA1)
    4. 2 x U.2 connectors
    5. Support for RAID 0, RAID 1, RAID 5, and RAID 10
  • واجهات USB
  • Chipset:
    1. 1 x USB Type-C™ port on the back panel, with USB 3.1 Gen 2 support
    2. 1 x USB 3.1 Gen 2 Type-A ports (red) on the back panel
    3. 7 x USB 3.1 Gen 1 ports (4 ports on the back panel, 1 port onboard, 2 ports available through the internal USB header)
    4. 2 x USB 2.0/1.1 ports available through the internal USB header
  • موصلات الدخل والخرج الداخلية
    1. 1 x 24-pin ATX main power connector
    2. 2 x 8-pin ATX 12V power connectors
    3. 1 x 6-pin ATX 12V power connector
    4. 2 x CPU fan headers
    5. 5 x system fan headers
    6. 1 x M.2 Socket 3 connector
    7. 10 x SATA 6Gb/s connectors
    8. 2 x U.2 connectors
    9. 2 x SATA DOM power headers
    10. 1 x PMBus connector
    11. 1 x Intel® VROC Upgrade Key header
    12. 1 x front panel header
    13. 1 x front panel audio header
    14. 1 x USB 3.1 Gen 1 header
    15. 1 x USB 3.1 Gen 1 port
    16. 1 x USB 2.0/1.1 header
    17. 1 x Trusted Platform Module(TPM) header (2x6 pin, for the GC-TPM2.0_S module only)
    18. 1 x serial port connector
    19. 1 x chassis intrusion header
    20. 3 x SATA SGPIO headers
    21. 1 x SMD_VMD header
    22. 1 x SMB connector
    23. 1 x TBT connector
    24. 1 x wake on LAN header
    25. 1 x speaker header
    26. 1 x Clear CMOS jumper
    27. 1 x VRM SMB Clock jumper
    28. 1 x VRM SMB Data jumper
    29. 1 x power button
    30. 1 x reset button
  • موصلات اللوحة الخلفية
    1. 1 x PS/2 keyboard/mouse port
    2. 1 x USB Type-C™ port, with USB 3.1 Gen 2 support
    3. 1 x USB 3.1 Gen 2 Type-A port (red)
    4. 4 x USB 3.1 Gen 1 ports
    5. 2 x USB 2.0/1.1 ports
    6. 2 x RJ-45 ports
    7. 1 x optical S/PDIF Out connector
    8. 5 x audio jacks
  • مراقبة المكونات
    1. Voltage detection
    2. Temperature detection
    3. Fan speed detection
    4. Fan speed control
      * Whether the fan speed control function is supported will depend on the fan you install.
  • وحدة التشغيل الرئيسية
    1. 1 x 256 Mbit flash
    2. Use of licensed AMI BIOS
    3. PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
  • Operating Properties
    1. Operating temperature: 10°C to 40°C
    2. Operating humidity: 8 - 80%
    3. Non-operating temperature: -40°C to 70°C
    4. Non-operating humidity: 5% - 95%
  • حجم المنتج
    1. EEB Form Factor; 30.5cm x 33.0cm
  • Support OS
    1. Windows server 2012/2016/2019
    2. Linux
    3. VMware EXSi 6.5/6.7

* يراجتلا رهظملاو ،HDMI High-Definition Multimedia Interfaceو ،HDMI تاحلطصم دعُ ت HDMI Licensing ةكرشل ةلجسم ةيراجت تاملاع وأ ةيراجت تاملاع ،HDMI تاراعشو ،HDMI Administrator, Inc.
* كل المعلومات المذكورة للاطلاع فقط. وتحتفظ جيجابايت بالحق في تعديلها أو مراجعتها في أي وقت دون اخطار مسبق.
* مستوى الأداء المعروض اعتماداً على أقصي القيم الافتراضية للواجهات والتي زودنا بها المصنعين المختلفين والذين وضعوا المعايير القياسية لهذه الواجهات. وقد يختلف مستوى الأداء الفعلي باختلاف مواصفات الحاسب.
* كل العلامات التجارية والشعارات هي ملك لحامليها.
* نظرأً لخصائص الحاسب القياسية، فإن قدراً من السعة الكلية للذاكرة يتم استخدامه من قبل الحاسب ولذلك تصبح سعة الذاكرة الحقيقية أقل من السعة المذكورة على وحدات الذاكرة.

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