First in the Market! GIGABYTE Releases AORUS DDR5 5200MHz 32GB Memory Kit

Innovative copper-aluminum heat spreader with nano-carbon coating provides users fast and excellent memory experience

2021/10/28

Oct. 28th, 2021–GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today announced AORUS DDR5 5200MHz 32GB Memory Kit to support the latest Intel® Z690 platform for the brand new level performance. AORUS Memory DDR5 32GB 5200 MHz features two 16GB DDR5 XMP 5200 MHz design to provide higher frequency and performance than native DDR5 memories. With GIGABYTE Z690 motherboards, it can further unlock the limitation of memory clock to enhance performance by DDR5 XMP Booster and XMP 3.0 User Profile. The new On-Die ECC feature of DDR5 highlights error correction which can detect and correct most common memory data damage to improve the stability of data. In addition, the copper-aluminum heat spreader with the nano-carbon coating can effectively reduce the heat generated by the memories under high-speed operation, offering excellent performance and avoiding instability from overheating.

AORUS DDR5 5200MHz 32GB Memory Kit features two 16GB DDR5 XMP 5200 MHz dual-channel design, and just fit the support of DDR5 memory on Intel® Z690 platform. The brand new memory architecture features high memory clock speed, low power consumption, which enable DDR5 XMP Booster function on AORUS DDR5 5200MHz 32GB Memory Kit with GIGABYTE Z690 AORUS motherboards. “DDR5 XMP Booster” can detect the brand of memory IC in the BIOS setting to allow users chose quickly from multiple built-in and pre-tuned memory overclocking profiles, boosting the native DDR or XMP DDR memory speed. Furthermore, “XMP 3.0 User Profile” enable users to create and store XMP profile on their own to unleash the extreme performance of memories.

AORUS DDR5 5200MHz 32GB Memory Kit equips robust thermal solutions of the copper-aluminum heat spreader with nano-carbon coating and high conductivity-thermal pad, so that users can rest assure of their memory overclocking. The heat generated from the power control IC and memory chip can be quickly carried out by the thermal pad and the copper bottom, then the heat exchanges through the air between nano-carbon coated copper-aluminum heat spreader. The groove cut by CNC on the spreader enlarge the heat dissipation area to fasten the heat blown away by the system fans and drop the temperature. Users have no more worry about overclocking failures caused by overheating from high-speed memory operation or overvoltage. As for data security, AORUS DDR5 5200MHz 32GB Memory Kit support “On-Die ECC” error correction function, which can detect and correct most common memory data damage for a more stable system operation compared to DDR4 to reduce unnecessary troubles.

In order to provide more superior stability, and ultimate performance of memory, AORUS DDR5 5200MHz 32GB Memory Kit was implemented with GIGABYTE ultra durable elements and verified with all GIGABYTE motherboard lineup. AORUS DDR5 5200MHz 32GB Memory Kit has been shipped and will be soon available in the market.

For more details, please visit the official GIGABYTE website: https://www.gigabyte.com/Memory