| Description | Version | Size | Date |
|---|
1/10
H263-V11-LAW1
HPC/AI Arm Server - NVIDIA GH200 Grace Hopper Superchip - 2U 4-Node 16-Bay Gen5 NVMe DLC
- Direct liquid cooling solution with leak detection
- CPU+GPU design for giant-scale AI and HPC
- 2U 4-node rear access server system
- NVIDIA GH200 Grace Hopper Superchip
- 900GB/s NVIDIA® NVLink®-C2C Interconnect
- 480GB CPU LPDDR5X ECC memory per module
- Up to 144GB GPU HBM3e per module
- 8 x 10Gb/s LAN ports via Intel® X550-AT2
- 1 x CMC port
- 16 x 2.5" Gen5 NVMe hot-swap bays
- 8 x 2.5" Gen5 NVMe hot-swap bays via NVIDIA BlueField®-3 DPUs (optional)
- 8 x M.2 slots with PCIe Gen5 x4 interface
- 4 x FHHL PCIe Gen5 x16 slots
- 4 x OCP NIC 3.0 PCIe Gen5 x16 slots
- Triple 3000W 80 PLUS Titanium redundant power supply
Ordering Numbers: 6NH263V11DR000LAW1*
Specifications
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 850
440 x 87.5 x 850
Motherboard
MV13-HD0
Superchip
Per node:
NVIDIA GH200 Grace Hopper Superchip:
- 1 x NVIDIA Grace™ CPU
- 1 x NVIDIA Hopper™ GPU
- Connected with NVIDIA® NVLink®-C2C
- TDP up to 1000W (CPU + GPU + memory)
NVIDIA GH200 Grace Hopper Superchip:
- 1 x NVIDIA Grace™ CPU
- 1 x NVIDIA Hopper™ GPU
- Connected with NVIDIA® NVLink®-C2C
- TDP up to 1000W (CPU + GPU + memory)
Memory
Per node:
NVIDIA Grace CPU:
- 480GB of LPDDR5X memory with ECC
- Memory bandwidth up to 512GB/s
NVIDIA Hopper GPU:
- 96GB HBM3 [1]
- Memory bandwidth up to 4TB/s [1]
[1] Modules with 144GB of HBM3e GPU memory and 4.9TB/s memory bandwidth are also available. Please contact our sales representatives for more details.
NVIDIA Grace CPU:
- 480GB of LPDDR5X memory with ECC
- Memory bandwidth up to 512GB/s
NVIDIA Hopper GPU:
- 96GB HBM3 [1]
- Memory bandwidth up to 4TB/s [1]
[1] Modules with 144GB of HBM3e GPU memory and 4.9TB/s memory bandwidth are also available. Please contact our sales representatives for more details.
LAN
Rear:
8 x 10Gb/s LAN (4 x Intel® X550-AT2)
- Support NCSI function
4 x 10/100/1000 Mbps Management LAN
1 x CMC Management LAN
8 x 10Gb/s LAN (4 x Intel® X550-AT2)
- Support NCSI function
4 x 10/100/1000 Mbps Management LAN
1 x CMC Management LAN
Video
Integrated in ASPEED® AST2600 x 4
- 4 x Mini-DP
- 4 x Mini-DP
Storage
Front hot-swap:
16 x 2.5" Gen5 NVMe
- (NVMe from PEX89048)
Optional front hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from NVIDIA BlueField®-3 DPUs) [1]
Internal M.2:
8 x M.2 (2280/22110), PCIe Gen5 x4, from PEX89048
[1] Requires optional NVIDIA BlueField®-3 DPUs, with each DPU supporting two drives.
16 x 2.5" Gen5 NVMe
- (NVMe from PEX89048)
Optional front hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from NVIDIA BlueField®-3 DPUs) [1]
Internal M.2:
8 x M.2 (2280/22110), PCIe Gen5 x4, from PEX89048
[1] Requires optional NVIDIA BlueField®-3 DPUs, with each DPU supporting two drives.
SAS
N/A
RAID
N/A
PCIe Expansion Slots
PCIe Cable x 4:
- 4 x FHHL x16 (Gen5 x16)
4 x OCP NIC 3.0 (Gen5 x16)
- Support NCSI function
- 4 x FHHL x16 (Gen5 x16)
4 x OCP NIC 3.0 (Gen5 x16)
- Support NCSI function
Front I/O
4 x Power buttons with LED
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
4 x ID buttons with LED
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
Rear I/O
8 x USB 3.2 Gen1 ports (Type-A)
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x ID LEDs
1 x CMC port
4 x Mini-DP
8 x RJ45 ports
4 x MLAN ports
4 x ID LEDs
1 x CMC port
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4
PCIe Gen5 x4
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM012
- Optional TPM2.0 kit: CTM012
Power Supply[#1]
Triple 3000W 80 PLUS Titanium redundant power supply [1]
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 16A, 50/60Hz
- 200-207V~/ 16A, 50/60Hz
- 208-240V~/ 16A, 50/60Hz
DC Input: (Only for China)
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+12.2V/ 98.36A
+12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+12.2V/ 213A
+12.2Vsb/ 3A
- Max 3000W/ 208-240V~ or 240Vdc Input
+12.2V/ 245.9A
+12.2Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Management
ASPEED® AST2600 Baseboard Management Controller
ASPEED® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
ASPEED® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 40°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.
Packaging Dimensions
1181 x 715 x 336 mm
Packaging Content
1 x H263-V11-LAW1
4 x Superchip cold plate loops
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit
4 x Superchip cold plate loops
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit
Part Numbers
- Barebone w/ NVIDIA module: 6NH263V11DR000LAW1*
- Motherboard: 9MV13HD0NR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- Superchip cold plate loop: 25ST7-3000Z7-C4R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH7O1: 9CBPH7O1NR-00*
- Fan module: 25ST2-888020-S1R
- M.2 riser card - CMTP0A2: 9CMTP0A2NR-00*
- LAN board - CLBH010: 9CLBH010NR-00*
- Leak sensor board - CDB86: 9CDB86NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000L-L0S
Optional parts:
- GIGABYTE Superchip cold plate loop: 25H26-3V10000-E29X (QPA:4)
- GIGABYTE 2U4N Manifold: 25H27-3Z80000-E07X (1 set per rack)
- Motherboard: 9MV13HD0NR-000*
- 3-Section Rail kit: 25HB2-A66125-K0R
- Superchip cold plate loop: 25ST7-3000Z7-C4R
- Front panel board - CFPH004: 9CFPH004NR-00*
- Backplane board - CBPH7O1: 9CBPH7O1NR-00*
- Fan module: 25ST2-888020-S1R
- M.2 riser card - CMTP0A2: 9CMTP0A2NR-00*
- LAN board - CLBH010: 9CLBH010NR-00*
- Leak sensor board - CDB86: 9CDB86NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000L-L0S
Optional parts:
- GIGABYTE Superchip cold plate loop: 25H26-3V10000-E29X (QPA:4)
- GIGABYTE 2U4N Manifold: 25H27-3Z80000-E07X (1 set per rack)
[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical interface values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.
