* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U
448 x 87.5 x 800
Motherboard
MG52-G20
CPU
3rd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
10nm technology, CPU TDP up to 270W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
2 x LGA 4189
Socket P+
Chipset
Intel® C621A Express Chipset
Memory
24 x DIMM slots
DDR4 memory supported only
8-channel memory architecture per processor
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
LAN
2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Audio
N/A
Storage
8 x 2.5" hot-swappable HDD/SSD bays
- 4 x blue HDD trays compatible with SATA/SAS devices only
- 4 x green HDD trays compatible with SATA/SAS/Gen4 NVMe devices

SAS card is required for SAS devices support
SAS
N/A
RAID
Intel® SATA RAID 0/1/10/5
Intel® Virtual RAID On CPU (VROC) RAID 0, 1, 10, 5
Note: VROC module is compatible for Intel®SSD only
Peripheral Drives
N/A
Expansion Slots
16 x PCIe x16 single slots (Gen4 x16 bus) for GPUs
2 x PCIe x16 (Gen4 x16 bus) Half-length low-profile slots

- Maximum limitation of GPU card: 285mm (L) x 111.5mm (W) x 39.5mm (H)
- System is validated for population with a uniform GPU model
- Support is not provided for mixed GPU populations
Internal I/O
1 x 18-pin power connector
1 x 14-pin power connector
2 x 8-pin power connectors
2 x 4-pin power connectors
1 x USB 3.0 header
1 x TPM header
1 x VROC connector
1 x HDD back plane board header
1 x 12-pin front panel header
1 x 23-pin front panel header
1 x JTAG header
2 x SATA SGPIO headers
1 x Front VGA header
1 x Serial header
1 x IPMB connector
1 x P12V standby connector
1 x PMBus selection jumper
1 x Clear CMOS jumper
1 x LT debug jumper
Front I/O
1 x Power button with LED
1 x ID button with LED
2 x LAN activity LEDs
1 x HDD activity LED
1 x System status LED
1 x Reset button
Rear I/O
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x NMI button
1 x System status LED
Backplane I/O
8 x SAS/SATA/Gen4 NVMe ports
Bandwidth: SATAIII 6Gb/s, SAS 12Gb/s or PCIe Gen4 x4 per port
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
2 x 2200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V
+12.12V/ 178.1A
+12Vsb/ 3.5A

NOTE: The system power supply requires C19 type power cord
System Management
Aspeed® AST2600 management controller
Avocent® MergePoint IPMI 2.0 web interface:
  • Network settings
  • Network security settings
  • Hardware information
  • Users control
  • Services settings
  • IPMI settings
  • Sessions control
  • LDAP settings
  • Power control
  • Fan profiles
  • Voltages, fans and temperatures monitoring
  • System event log
  • Events management (platform events, trap settings, email settings)
  • Serial Over LAN
  • vKVM & vMedia (HTML5)
OS Compatibility
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 8.3 ( x64) or later

SUSE Linux Enterprise Server 12 SP5 ( x64) or later
SUSE Linux Enterprise Server 15 SP2 ( x64) or later

Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later

Citrix Hypervisor 8.2.0 or later
System Fans
8 x 80x80x38mm (16300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

NOTE: Please contact Technical Support for more information about optimized GPU system operating temperature
Packaging Dimensions
TBD
Packaging Content
1 x G292-2G0
2 x CPU heatsinks
1 x Rail kit
Part Numbers
- Barebone with rail kit: 6NG2922G0MR-00
- Motherboard: 9MG52G20NR-00
- Tool-less rail kit: 25HB2-A86102-K0R
- Power supply: 25EP0-222001-D0S
- 2 x NVMe cable kits: 6N0ASP035PR-W6 (optional)
- 2 x 7mm internal SSD cable kit: 6NG291281SR-00-100 (optional)
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)
- C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (optional)
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

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