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Supercomputing Starts with Advanced Cooling in Data Centers

省很大!《 用最少成本,釋放資料中心最大的 「 錢 」 能 》

高算力、低碳排、少成本

技嘉科技能協助將液體冷卻、浸沒式冷卻或氣冷技術導入你的IT規劃。人工智慧(AI)和高效能運算(HPC)盛行的當下,伺服器對算力和電力需求持續增長,採用先進解熱方案,能釋放晶片最大潛能,同時維持伺服器穩定運作,並減少組織的碳足跡和營運成本。

極致效能

先進散熱可改善系統整體表現,確保穩定性,處理器的熱設計功耗(TDP)持續增長也不構成問題,充分發揮尖端運算的最大潛能。

永續經營

創新解熱方案可將資料中心的電力使用效率(PUE)大幅改善,降低到1.02的標準,有效減少排碳量,協助達成組織ESG目標。

競爭優勢

有效的散熱讓晶片發揮最大算力,同時降低能源損耗,長期下來能減少營業費用(OpEx),為組織注入勢不可擋的致勝戰力。

液體冷卻:適用於AI & HPC的主流解熱方案

直接液體冷卻(DLC),或稱直達晶片(D2C)液冷,是AI和HPC大戶廣泛採用的伺服器散熱技術,能解決機櫃功率持續提升衍生出的廢熱問題,進而改良資料中心的運算密度。技嘉提供全方位的液冷產品線,包括液冷伺服器及內部的液冷元件,也包含冷卻液分配器(CDU)、機架式分歧管及DLC機櫃等資料中心層級的散熱設備。



Liquid cooling in data centers

GIGAPOD:用DLC為AI加速

技嘉GIGAPOD是AI資料中心的算力泉源,強大的GPU運算叢集不但可根據客戶需求搭配AMD Instinct™ MI300系列、Intel® Gaudi®或NVIDIA H100/H200/B200加速器產品,更可透過DLC或背板熱交換器(RDHx)加強散熱,實現超算效能快速處理複雜的人工智慧訓練與推論工作。

探索技嘉液體冷卻產品

G4L3-SD1-LAX3

HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 4U DP NVIDIA HGX H200 DLC

G4L3-ZX1-LAX1

HPC/AI Server - AMD EPYC™ 9005/9004 - 4U DP AMD Instinct™ MI300X DLC

G593-SD1-LAX3

HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 5U DP NVIDIA HGX H200 DLC

G593-SD0-LAX1

HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 5U DP NVIDIA HGX™ H100 8-GPU 4-Root Port DLC

DL90-ST0

DLC Rack - 22U 9kW

R183-ZK0-LAJ1

Rack Server - AMD EPYC™ 9005/9004 - 1U DP 4 x Gen5 NVMe/SATA/SAS-4 DLC

H263-V60-LAW1

High Density Arm Server - NVIDIA Grace™ CPU Superchip - 2U 4-Node 16-Bay Gen5 NVMe DLC

G363-SR0-LAX1

HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 3U DP HGX™ H100 4-GPU DLC

H274-S61-LAW1

High Density Server - Intel® Xeon® 6 Processors - 2U 4-Node DP 8-Bay Gen5 NVMe/SATA/SAS-4 DLC

R183-S90-LAD1

Rack Server - 5th/4th Gen Intel® Xeon® Scalable - 1U DP 4-Bay Gen4 NVMe/SATA/SAS DLC

H262-ZL2

High Density Server - AMD EPYC™ 7003/7002 - 2U 4-Node DP 24-Bay Gen4 NVMe/SATA/SAS DLC

浸沒式冷卻:超前部署未來資料中心

浸沒式冷卻能進一步改善PUE,達到1.02的超低境界,比液體冷卻更有效釋放處理器的潛力,並有助於達成節能減碳目標。技嘉長年研發單相浸沒式冷卻、兩相浸沒式冷卻的兩條產品線,可為客戶提供浸沒式冷卻伺服器、浸沒式液冷槽等各項解決方案。

Immersion cooling in data centers

單相浸沒式冷卻給你更大算力、更多彈性

技嘉自家研發的一站式解決方案,涵蓋伺服器、液冷槽、配件和冷卻液,同時也提供客戶完善的服務與技術支援。使用者可根據實際需求挑選最新發表的AMD EPYC™或Intel® Xeon® Scalable中央處理器,還可選擇EIA或OCP規格的液冷槽,技嘉AIO產品則是直接將CDU裝在液冷槽內,賦予客戶無比的部署彈性。

探索技嘉浸沒式冷卻產品

G293-S45-IAP1

HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 2U DP 8 x PCIe Gen5 GPUs Immersion

A1P0-EA0

12U EIA Tank

A1O3-CC0

18OU OCP Tank

A1P0-EB0

25U EIA Tank

R183-SF2-IAL1

Rack Server - 5th/4th Gen Intel® Xeon® Scalable - 1U DP 4 x PCIe Gen5 GPUs Immersion

R283-ZF0-IAL1

Rack Server - AMD EPYC™ 9004 - 2U DP 4 x PCIe Gen5 GPUs Immersion

H263-S64-IAW1

High Density Server - 5th/4th Gen Intel® Xeon® Scalable - 2U 4-Node 8-Bay Gen4 NVMe/SATA/SAS Immersion

TO15-S41-IA01

ORv3 GPU Server - 5th/4th Gen Intel® Xeon® Scalable - 1OU DP 8 x PCIe Gen5 GPUs Immersion

進階氣冷:領先業界的獨門技術

技嘉氣冷式伺服器採用獨家設計,透過「優化氣流」的機殼架構和自動調整風扇速度的智慧型溫控程式,優化氣冷技術的冷卻效益,有效提升機櫃的運算密度。氣冷式伺服器機櫃亦可額外安裝RDHx協助散熱,進一步改善資料中心PUE。


技嘉氣冷式伺服器亮點產品

G893-SD1-AAX3

HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 8U DP NVIDIA HGX H200

G893-ZX1-AAX1

HPC/AI Server - AMD EPYC™ 9005/9004 - 8U DP AMD Instinct™ MI300X

G593-SX1-AAX1

HPC/AI Server - 5th/4th Gen Intel® Xeon® - 5U DP AMD Instinct™ MI300X 8-GPU

XH23-VG0-AAJ1

NVIDIA MGX™ Arm Server - NVIDIA GH200 Grace Hopper™ Superchip - 2U UP 4-Bay Gen5 NVMe

G383-R80-AAP1

HPC/AI Server - AMD Instinct MI300A APU - 3U 8-Bay Gen5 NVMe

G363-SR0-AAX1

HPC/AI Server - 5th/4th Gen Intel® Xeon® Scalable - 3U DP HGX™ H100 4-GPU

H223-V10-AAW1

HPC/AI Arm Server - NVIDIA GH200 Grace Hopper Superchip - 2U 2-Node 8-Bay Gen5 NVMe

S183-SH0-AAV1

Storage Server - 5th/4th Gen Intel® Xeon® Scalable - 1U DP 32-Bay E1.S NVMe 1600W

E163-S30-AAG1

Edge Server - 5th/4th Gen Intel® Xeon® Scalable - 1U UP 2-Bay Gen4 NVMe/SATA/SAS Titanium

資料中心冷卻技術問與答

資料中心的冷卻系統如何運作?

資料中心冷卻系統將伺服器排放的廢熱移除到資料中心以外,確保設施內的環境溫度能允許處理器穩定運作,發揮最大的運算效能。氣冷資料中心透過機房空調系統(CRAC)降溫,隨著人工智慧(AI)和高效能運算(HPC)晶片排放的廢熱愈來愈高,液體冷卻等先進冷卻技術已成為資料中心的主流選項,能更有效率地為伺服器散熱。
簡單來說,如果資料中心沒有冷卻系統,處理器就會因為過熱而停止運作,有效的散熱是高效能、高可用性資料中心的必備條件。現代社會一切都環繞著運算,如何讓運算設備有效降溫,將決定企業的碳足跡和在市場上的競爭力。
新建的資料中心逐步採用先進冷卻技術取代傳統的氣冷設備,例如使用直接液體冷卻(DLC),透過管線將冷卻液導入機台內幫關鍵元件降溫,或是使用浸沒式冷卻,將伺服器泡在不導電的冷卻液中降溫。節能且高效率的「綠色運算」方案,將大幅改善資料中心的電力使用效率(PUE),使用者降低營業費用(OpEx)和排碳量的同時,還能增強伺服器的算力,這是資料中心冷卻的未來發展方向。
採用新的冷卻技術,必須考量資料中心基礎建設的先天限制,例如氣冷資料中心缺乏液冷資料中心的設施冷卻管路,因此無法導入純粹「液對液」的冷卻方案,但可透過在伺服器機櫃上安裝背板熱交換器(RDHx)實現「液對氣」冷卻系統。資料中心的環境溫度可能受法規限制,這也是挑選散熱技術的關鍵考量因素,使用者應選擇和專業的資料中心解決方案供應商合作—例如技嘉科技—以確保資料中心冷卻系統真正符合實際的運算需求與安裝條件。

全球指標性企業,信任技嘉的先進冷卻

汽車產業: 空氣冷卻

享受極速駕馭,伺服器科技成就迎風馳騁的汽車設計

航太產業: 液體冷卻

德國航太中心的太空成就,技嘉伺服器也參與其中

5G: 單相浸沒式

技嘉藉由單相浸沒式液冷技術,助力日本電信龍頭KDDI開發新世代資料中心

半導體業: 兩相浸沒式

半導體龍頭樹立資料中心新標竿,技嘉助力打造兩相浸沒式液冷機房

先進冷卻新觀點

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GIGABYTE直接液體冷卻解決方案

技嘉科技自研的液體冷卻方案專注於高效能運算、人工智慧和雲端運算領域的創新突破,在提供卓越散熱效率的同時,更實現了系統的高度可用性及穩定性。
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Liquid Cooling

Liquid Cooling
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GIGABYTE Debuts Liquid Cooled High-density Servers

GIGABYTE announced two high-density servers, H262-ZL0 and H262-ZL2, with direct liquid cooling for CPUs and more. Engineered to cool up to eight CPUs in ...
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How to Get Your Data Center Ready for AI? Advanced Cooling

The proliferation of artificial intelligence has led to the broader adoption of innovative technology, such as advanced cooling and cluster computing, in data centers around the world. Specifically, the rollout of powerful AI processors with ever higher TDPs has made it all but mandatory for data centers to upgrade or even retrofit their infrastructure to utilize more energy-efficient and cost-effective cooling. In part one of GIGABYTE Technology’s latest Tech Guide, we explore the industry’s most advanced cooling solutions so you can evaluate whether your data center can leverage them to get ready for the era of AI.
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技嘉單相浸沒式冷卻運算方案

技嘉自主研發製造全方位的一站式解決方案,提供現貨單相浸沒式冷卻產品,讓客戶能夠降低資料中心能耗和最佳化電力使用效率,從基礎建設開始就降低營運成本並提供對環境更友善的數位轉型設施。
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GIGABYTE’s One Stop Solution—Single-phase Immersion Cooling 18OU OCP Tank

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GIGABYTE’s One Stop Solution—Single-phase Immersion Cooling 25U EIA Tank

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Proposing the solution to the ultimate challenge: increasing processing power while reducing the environmental footprint.

Proposing the solution to the ultimate challenge: increasing processing power while reducing the environmental footprint.
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Two-phase and Single-phase Liquid Immersion Cooling

Two-phase and Single-phase Liquid Immersion Cooling
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Immersion Cooling

Immersion Cooling
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Immersion Cooling in 60 Seconds

Two-Phase Immersion cooling is a new type of cooling technology for data centers. In a two-phase immersion cooled system, electronic components are submerged into a bath of dielectric heat transfer liquid, which is a much better heat conductor than air, water or oil. With a low boiling point (56°C vs. 100°C in water), the fluid boils on the surface of heat generating components, and rising vapor passively takes care of heat transfer. In contrast to submersion oil cooling, two-phase immersion cooling liquids are clean, environmentally friendly and non-flammable. No pumps and jets are required to keep hardware cool. Circulation happens passively by the natural process of evaporation and without spending any extra energy. It is this simplicity that eliminates conventional cooling hardware and results in better cooling efficiency. Compared to traditional air, water or oil cooling, this passive process results in the use of much less energy.
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From Air to Liquid & Immersion Cooling - A Perfect Fit for Your Data Center

From Air to Liquid &Immersion Cooling a Perfect Fit for Your Data Center Find out more at ...
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GIGABYTE Highlights HPC and Liquid/Immersion Cooling at ISC 2022

Greater compute density creates next gen cooling solutions for performance focused data centers. At ISC 2022 (Hamburg, ...

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