H252-3C0

HCI Server - 3rd Gen Intel® Xeon® Scalable - 2U 4-Node UP 12-Bay SATA/SAS
  • 2U 4-node rear access server system
  • 3rd Gen Intel® Xeon® Scalable Processors
  • Single processor per node, 10nm technology
  • 8-Channel DDR4 RDIMM/LRDIMM, 32 x DIMMs
  • Supports Intel® Optane™ Persistent Memory 200 series
  • Dual ROM Architecture
  • Intel® C621A Chipset
  • 8 x 1Gb/s LAN ports via Intel® I350-AM2
  • 1 x CMC port
  • 12 x 3.5"/2.5" SATA/SAS hot-swappable bays
  • 8 x LP PCIe Gen4 x16 slots
  • 4 x OCP 2.0 Gen3 x8 mezzanine slots
  • Dual 1600W 80 PLUS Platinum redundant power supply
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詢價清單

產品規格

Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 695
Motherboard
MH12-HD0
CPU
3rd Generation Intel® Xeon® Scalable Processors
Single processor per node, 10nm technology
CPU TDP up to 270W
Socket
Per Node:
1 x LGA 4189

Total:
4 x LGA 4189

Socket P+
Chipset
Intel® C621A Chipset
Memory
Per node:
8 x DIMM slots

Total:
32 x DIMM slots

DDR4 memory supported only
8-Channel memory architecture
RDIMM up to 128GB supported
LRDIMM up to 128GB supported
3DS RDIMM/LRDIMM up to 256GB supported
Memory speed: Up to 3200 MT/s
LAN
Per node:
2 x 1Gb/s LAN ports (1 x Intel® I350-AM2)
Support NCSI function

1 x Dedicated management port

Total:
8 x 1Gb/s LAN ports (4 x Intel® I350-AM2)
Support NCSI function

4 x Dedicated management ports
1 x CMC port
Video
Integrated in Aspeed® AST2500 x 4
- 4 x VGA ports
Storage
Per node:
3 x 3.5"/2.5" SATA/SAS hot-swappable bays

Total:
12 x 3.5"/2.5" SATA/SAS hot-swappable bays

SAS card is required for SAS devices support
SAS
Depends on SAS add-in cards
RAID
Intel® SATA RAID 0/1/5
Expansion Slots
Per node:
2 x PCIe x16 (Gen4 x16) low-profile slots
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x8 bandwidth (Type1, P1, P2 with NCSI supported)

Total:
8 x PCIe x16 (Gen4 x16) low-profile slots
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x8 bandwidth (Type1, P1, P2 with NCSI supported)
Internal I/O
Per node:
1 x USB 3.0 header
1 x SATA DOM
1 x TPM header
1 x OCP 2.0 mezzanine slots
1 x Front panel header
1 x Back plane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button

Total:
4 x Power buttons with LED
4 x ID button with LED
4 x Status LED
4 x Reset buttons
1 x CMC status LED
1 x CMC Reset button
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system
Backplane Board
Speed and bandwidth:
SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
Power Supply[#1]
Dual 1600W 80 PLUS Platinum redundant power supply

AC Input:
- 100-120V~/ 12A, 50-60Hz
- 200-240V~/ 10.0A, 50-60Hz

DC Input:
- 240Vdc/ 10A

DC Output:
- Max 1000W/ 100-120V~
+ 12V/ 81.5A
+ 12Vsb/ 2.5A
- Max 1600W/ 200-240V~ or 240Vdc Input
+ 12V/ 133A
+ 12Vsb/ 2.5A
System Management
Aspeed® AST2500 Baseboard Management Controller
Aspeed® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Citrix Hypervisor 8.2.0 or later

Red Hat Enterprise Linux 7.9 or later
Red Hat Enterprise Linux 8.2 or later
Red Hat Enterprise Linux 9.0 or later

SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later

Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later

VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later

Windows Server 2016
Windows Server 2019
Windows Server 2022
System Fans
4 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 22.2 kg
Gross Weight: 37.22 kg
Packaging Dimensions
1167 x 700 x 309 mm
Packaging Content
1 x H252-3C0
4 x CPU heatsinks
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH2523C0MR-00-1*
- Motherboard: 9MH12HD0NR-00
- 3-Section Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-453213-M1R
- Backplane board - CBPH0C3: 9CBPH0C3NR-00
- Fan module: 25ST2-883828-D0R
- CMC Lan card - CLBH020: 9CLBH020NR-00
- Riser card - CRSH01D: 9CRSH01DNR-00
- Riser card - CRSH01E: 9CRSH01ENR-00
- Power Supply: 25EP0-216008-L0S

Optional parts:

- Ring topology kit: 6NH23NR48SR-00
- RMA packaging: 6NH2523C0SR-RMA-A100

[#1] 伺服器產品未附帶電源線。客戶需自行選擇適當的電源線 (可選配件),或聯繫業務協助客製化。

[#2] 本網站所提供之產品規格、圖片及其他資訊僅供參考,如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利,並不對因使用上述資料而導致的任何損失承擔責任。

[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。

[#4] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。

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