X
비교하기
삭제
제품 모델을 최대 5 개까지 비교할 수 있습니다. 목록을 지운 다음 다시 선택해주십시오.
Close
 
OVERVIEW
PERFORMANCE
THERMAL
CONNECTIVITY
PERSONALIZATION
ULTRA DURABLE
Key Feature
GIGABYTE X570S motherboards feature upgraded power solution, passive and silent thermal design, and PCIe 4.0 components to keep your gaming system up to fast and powerful, even under heavy workloads.
OVERVIEW
PERFORMANCE
THERMAL
CONNECTIVITY
PERSONALIZATION
ULTRA DURABLE
1
AMD WiFi 6E 802.11ax & BT 5.2
2
HDMI
3
Q-Flash Plus Button
4
Rear USB 3.2 Gen2x2 Type-C®
5
Intel® 2.5GbE LAN
6
Advanced Thermal Design
  1. Fins-Array II
  2. Direct-Touch Heatpipe II
  3. 9 W/mK Thermal Conductivity Pad
  4. 2x Copper PCB
7
3* M.2 Connectors
  1. NVMe PCIe 4.0/3.0 x4
  2. 1X M.2 Thermal Guard III
  3. 2X M.2 Thermal Guard II
8
Audio Solutions
  1. ALC1220-VB Audio
  2. Audiophile Grade WIMA Capacitors
9
RGB FUSION 2.0
  1. Addressable LED Header*2
  2. RGB LED Header*3
10
12+2 Phases Digital Twin Power Design
  1. 60A DrMOS
  2. 6 Layer PCB
  3. PCIe 4.0 Ready Mid-Loss PCB
11
Solid Pin Power Connectors
  1. 24 pin ATX Power Connector
  2. 8+4 pin CPU Power Connector
12
Supports AMD Ryzen™ Series Processors
  1. Supports Active OC Tuner*
    * Only available on selected AMD Ryzen™ processors with P.B.O. function featured
13
Dual Channel DDR4, 4 DIMMs with Ultra Durable Memory Armor
14
Front USB 3.2 Gen2 Type-C®
15
Thunderbolt™ Add-in Card Connector
16
Ultra Durable PCIe Armor
  1. Running 1 x16 or 2 x8 Bandwidth
  2. 2X PCIe 4.0 Slots
*Click here to view AM4 Overclocking Guidance
Twin Power Design
Active OC Tuner
XMP 5400+
PCIe 4.0 Design
UNPARALLELED PERFORMANCE
To unleash the full potential of the latest AMD Ryzen™ 5000 series processors, the motherboard requires the best CPU power, memory and IO design. With the best quality components and GIGABYTE R&D design capability, X570S AORUS PRO AX is a true beast among motherboards.
GIGABYTE X570S Motherboards are equipped with best in class power solution to release the full potential of the latest AMD Ryzen™ 5000 Series CPUs. The VRM power design includes MOSFETs which Vcore and SOC accompanied by digital PWM, premium chokes and high quality capacitors to offer extraordinary stability and precision to the high performance CPU. In addition, Six-layered PCB and comprehensive thermal solution allows enthusiasts to enjoy the extreme overclocking performance without compromise. 
Twin and Digital Power for CPU Vcore
Digital Power for CPU SOC
GIGABYTE Active OC Tuner
With GIGABYTE's exclusive Active OC Tuner BIOS function, CPU* can work with AMD P.B.O. for gaming and other light workload applications with the highest CPU boost clock, but when the applications require all CPU cores horsepower, it automatically switches to the Manual OC mode where it can utilize the high frequency for all the CPU cores.
ㆍActive OC Tuner switches profile based on user scenario automatically ㆍ5% performance increase
* Only available on selected AMD Ryzen™ processors with P.B.O. function featured.

*Click here to view GIGABYTE Active OC Tuner Guidance
Active OC Tuner with Auto Switching
AMD P.B.O.
Manual
AMD P.B.O. mode for fewer cores with the highest CPU boost clock, better for gaming.
Manual OC mode for all cores with high CPU clock, better for content creation.
Fins-Array II
Direct Touch II
Thermal Guard III
Smart Fan 6
1. Fins-Array II
Fins-Array II uses brand new louvered stacked-fins design which not only increases surface area by 300% compared to traditional heatsinks, but also improves thermal efficiency with better airflow and heat dissipation.
2. 2X Copper PCB
2X Copper PCBs design effectively lower the component temperature by its high thermal conductivity and low impedance.
3. Direct-Touch Heatpipe II
With an extra large 8mm heatpipe and made by a new manufacturing process which has narrowed down the gap between the heatpipe and heatsink. The new Direct-Touch Heatpipe II greatly helps to dissipate the heat on MOSFETs.
4. 9 W/mK Thermal Conductivity Pad
By using 1.5mm thicker 9 W/mK thermal conductivity pads, it can transfer 4x more of heat dissipation compared to traditional thermal pads in same time.
5. M.2 Thermal Guard III
M.2 Thermal Guard III constructed with 2.6X optimized heat dissipation surface and double-sided M.2 heatsinks to prevent throttling and bottlenecks on high-speed/ large capacity of PCIe 4.0 M.2 SSDs.
ADVANCED THERMAL SOLUTION
X570S AORUS PRO AX uses an unprecedented and innovative thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full loading application and gaming.
Fins-Array II
Fins-Array II uses brand new louvered stacked fins technology which is usually only used on industrial equipment that need compact heat exchangers. It has a special secondary fins structure that enhances heat transfer performance.
Circulation Zone
Because of pressure difference and flow separation, a circulation zone will be formed between louvered fins. This circulation will cause flow entrain and eject in the vortice form which improves thermal efficiency.
* Flow simulation of louvered fins
Direct-Touch Heatpipe II
With an extra large 8mm heatpipe and made by a new manufacturing process which has narrow down the gap between the heatpipe and heatsink. The new Direct-Touch Heatpipe II greatly helps to dissipate the heat on MOSFETs.
Intel® 2.5GbE LAN
AMD WiFi 6E 802.11ax
USB 3.2 Gen 2x2 Type-C®
HDMI
Hi-Fi Audio
NEXT GENERATION CONNECTIVITY
A Flagship product needs to be future-proof so your system stays up-to-date with the latest technology. X570S AORUS PRO AX provides all next generation network, storage, and WIFI connectivity to keep you up to speed.
First adopter on 2.5GbE LAN onboard
2X Faster than ever
ㆍAdoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least 2X faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience.
ㆍSupport Multi-Gig(10/100/1000/2500Mbps) RJ-45 Ethernet
Connecting the Future - USB 3.2 Gen 2x2 Type-C®
Featuring the USB 3.2 Gen 2x2 design which is doubled the performance than previous generation of USB 3.2 Gen 2. It works up to 20Gbps ultra-fast data transfer while connecting to USB 3.2 compliant peripherals. Through the USB Type-C® connector, users can enjoy the flexibility of reversible connection to access and store massive amounts of data rapidly.
HDMI 2.1 for 4K / 60P / 21:9 / HDCP 2.3 Support
HDMI 2.1, which is backwards compatible with HDMI 2.0/ 1.4 and offering 48 Gb/s of bandwidth – twice times more than previous generation. This unlocks the potential for users to transfer multiple video streams, as well as a native cinematic 21:9 ratio (which most movies are shot in), Full HDR and HDCP 2.3 support, to offer the best visual experience for viewers.
Note: Only AMD Ryzen™ 4000 G series/ 3000 G series/ 2000 G series APUs are capable for display function support.
RGB FUSION
BIOS
Easy Tune
System Information Viewer
DEFINITIVE AESTHETICS
X570S AORUS PRO AX features RGB FUSION 2.0 to offer lighting effected options and customized settings with outstanding aesthetics, and able to let enthusiasts building a stylish and unique gaming PC.
BIOS
New User Interface
All new EASY MODE shows important hardware information in one page including CPU clock, Memory, Storage, Fan.
My Favorites
Add constantly used items into the favorite menu for quick access.
Storage Information
Show all kinds of storage information including SATA, PCIE and M.2 interface.
Changelog
List all changes before saving and exiting bios. Quickly review overall settings modification.
Intuitive Load Line Curve
Clearly show each loadline calibration setting in an intuitive curve graph.
EasyTune™
GIGABYTE's EasyTune™ is a simple and easy-to-use interface that allows users to fine-tune their system settings or adjust system and memory clocks and voltages in a Windows environment. With Smart Quick Boost, one click is all it takes to automatically overclock your system, giving an added performance boost when you need it the most.
System Information Viewer
GIGABYTE System Information Viewer is a central location that gives you access to your current system status. Monitor components such as the clocks and processor, set your preferred fan speed profile, create alerts when temperatures get too high or record your system's behavior; these are the possibilities of the System Information Viewer.
Q-Flash Plus
PCIe Armor
4X Memory Armor
Solid Pin
ULTRA DURABLE
GIGABYTE is reputable for its product durability and high quality manufacturing process. Needless to say, we use the best components we can find for the GIGABYTE Motherboard and reinforce every slot to make each of them solid and durable.
Ultra Durable™ PCIe Armor
Industry Leading Ultra Durable™ PCIe Armor
The innovative one piece stainless steel shielding design from GIGABYTE reinforces the PCIe connectors to provide the extra strength required to support heavy graphics cards.
Ultra Durable™ Memory Armor
AORUS' exclusive one piece stainless steel shielding design prevents against PCB distortion/twisting and plate bending, in addition to preventing any possible ESD interference.
Solid Pin Power Connectors
AORUS motherboards feature solid plated ATX 24pin & ATX 12V 8pin + 4pin power connectors to offer a stable power supply during CPU overloading.
Solid Pin Power connector advantages
  1. Larger contact area for electricity
  2. More metal quantity to sustain higher power and generated heat
  3. Ultra durable and longer lifespan
Photo for reference only.
Key Feature
  • Supports AMD Ryzen™ 5000 Series/ Ryzen™ 5000 G Series/ Ryzen™ 4000 G Series/ Ryzen™ 3000 Series/ Ryzen™ 3000 G Series/ Ryzen™ 2000 Series/ Ryzen™ 2000 G Series Processors
  • Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
  • Active OC Tuner features Dynamic Change Between P.B.O. and Manual OC Settings
  • Twin 12+2 Phases Digital VRM Solution with 60A DrMOS
  • Advanced Thermal Solution with Fins-Array II, Direct Touch Heatpipe II and M.2 Thermal Guard III
  • AMD WiFi 6E 802.11ax & BT 5.2
  • Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Thermal Guards
  • Blazing Fast Intel® 2.5GbE LAN with cFosSpeed
  • SuperSpeed USB 3.2 Gen2x2 TYPE-C® delivers up to 20Gb/s transfer speeds
  • AMP-UP Audio with ALC1220-VB and WIMA Audio Capacitors
  • Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP
  • RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
  • Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card
* Product specifications and product appearance may differ from country to country. We recommend that you check with your local dealers for the specifications and appearance of the products available in your country. Colors of products may not be perfectly accurate due to variations caused by photographic variables and monitor settings so it may vary from images shown on this site. Although we endeavor to present the most accurate and comprehensive information at the time of publication, we reserve the right to make changes without prior notice.