H223-S10
(rev. AAP1)
High Density Server - 5th/4th Gen Intel® Xeon® Scalable - 2U 3-Node UP 6-Bay E1.S Gen4 NVMe
- 2U 3-node front access server system
- Single 5th/4th Gen Intel® Xeon® Scalable Processors
- Single Intel® Xeon® CPU Max Series
- 8-Channel RDIMM DDR5, 24 x DIMMs
- Dual ROM Architecture
- 2 x CMC ports
- 6 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
- 3 x M.2 slots with SATA interface
- 6 x FHHL PCIe Gen5 x16 slots
- 3 x LP PCIe Gen5 x16 slots
- 3 x LP PCIe Gen5 x8 slots
- 1+1 3000W 80 PLUS Titanium redundant power supplies
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* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 3-Node - Front access
447.8 x 87.5 x 500
447.8 x 87.5 x 500
Motherboard
MS13-HD0
CPU
5th Generation Intel® Xeon® Scalable Processors
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Single processor per node
TDP up to 350W at ambient 35°C with 1 x PCIe slot occupied
TDP up to 350W at ambient 30°C with 2 x PCIe slots occupied
TDP up to 300W at ambient 35°C with 3 x PCIe slots occupied
TDP up to 300W at ambient 30°C with 4 x PCIe slots occupied
Please contact technical support for more details.
4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Single processor per node
TDP up to 350W at ambient 35°C with 1 x PCIe slot occupied
TDP up to 350W at ambient 30°C with 2 x PCIe slots occupied
TDP up to 300W at ambient 35°C with 3 x PCIe slots occupied
TDP up to 300W at ambient 30°C with 4 x PCIe slots occupied
Please contact technical support for more details.
Socket
Per Node:
1 x LGA 4677
Total:
3 x LGA 4677
Socket E
1 x LGA 4677
Total:
3 x LGA 4677
Socket E
Chipset
Intel® C741
Memory
Per node:
8 x DIMM slots
Total:
24 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
5th Gen Intel® Xeon®: Up to 5600 MT/s
4th Gen Intel® Xeon®: Up to 4800 MT/s
Intel® Xeon® Max Series: Up to 4800 MT/s
8 x DIMM slots
Total:
24 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
5th Gen Intel® Xeon®: Up to 5600 MT/s
4th Gen Intel® Xeon®: Up to 4800 MT/s
Intel® Xeon® Max Series: Up to 4800 MT/s
LAN
Total:
2 x CMC ports
2 x CMC ports
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
2 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
Total:
6 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
2 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
Total:
6 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
SAS
N/A
RAID
N/A
Expansion Slots
Per node:
Riser Card CRSH02D:
- 2 x PCIe x16 (Gen5 x16) FHHL slots
Riser Card CRSH02E:
- 1 x PCIe x16 (Gen5 x16) low-profile slot
- 1 x PCIe x16 (Gen5 x8) low-profile slot
1 x M.2 slot (CFPH010):
- M-key
- SATA, from PCH
- Supports 2242/2260/2280/22110 cards
Total:
Riser Card CRSH02D x 3:
- 6 x PCIe x16 (Gen5 x16) FHHL slots
Riser Card CRSH02E x 3:
- 3 x PCIe x16 (Gen5 x16) low-profile slots
- 3 x PCIe x16 (Gen5 x8) low-profile slots
3 x M.2 slots (CFPH010):
- M-key
- SATA, from PCH
- Support 2242/2260/2280/22110 cards
Riser Card CRSH02D:
- 2 x PCIe x16 (Gen5 x16) FHHL slots
Riser Card CRSH02E:
- 1 x PCIe x16 (Gen5 x16) low-profile slot
- 1 x PCIe x16 (Gen5 x8) low-profile slot
1 x M.2 slot (CFPH010):
- M-key
- SATA, from PCH
- Supports 2242/2260/2280/22110 cards
Total:
Riser Card CRSH02D x 3:
- 6 x PCIe x16 (Gen5 x16) FHHL slots
Riser Card CRSH02E x 3:
- 3 x PCIe x16 (Gen5 x16) low-profile slots
- 3 x PCIe x16 (Gen5 x8) low-profile slots
3 x M.2 slots (CFPH010):
- M-key
- SATA, from PCH
- Support 2242/2260/2280/22110 cards
Internal I/O
Per node:
1 x TPM header
1 x VROC connector
1 x TPM header
1 x VROC connector
Front I/O
Per node:
1 x USB 3.2 Gen1 Type-C
1 x Mini-DP
1 x Power button with LED
1 x System status LED
1 x ID LED
Total:
3 x USB 3.2 Gen1 Type-C
3 x Mini-DP
3 x Power buttons with LED
3 x System status LEDs
3 x ID LEDs
2 x CMC ports
1 x CMC status LED
1 x USB 3.2 Gen1 Type-C
1 x Mini-DP
1 x Power button with LED
1 x System status LED
1 x ID LED
Total:
3 x USB 3.2 Gen1 Type-C
3 x Mini-DP
3 x Power buttons with LED
3 x System status LEDs
3 x ID LEDs
2 x CMC ports
1 x CMC status LED
Rear I/O
N/A
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4
PCIe Gen4 x4
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
1+1 3000W 80 PLUS Titanium redundant power supplies
AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 15.5A
DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 15.5A
DC Output:
- Max 1000W/ 100-127V~
+12.2V/ 81A
+12Vsb/ 3A
- Max 2600W/ 200-220V~
+12.2V/ 213A
+12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+12.2V/ 245A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
Additional certifications:
Windows Server 2022 (x64)
Additional certifications:
Windows Server 2022 (x64)
System Fans
4 x 80x80x38mm (18,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 17.2 kg
Gross Weight: 29 kg
Gross Weight: 29 kg
Packaging Dimensions
857 x 670 x 280 mm
Packaging Content
1 x H223-S10-AAP1
3 x CPU heatsinks
1 x Mini-DP to D-Sub cable
9 x Carrier clips
1 x L-shape Rail kit
3 x CPU heatsinks
1 x Mini-DP to D-Sub cable
9 x Carrier clips
1 x L-shape Rail kit
Part Numbers
- Barebone package (5th/4th Gen): 6NH223S10DR000ABP1*
- Barebone package (4th Gen): 6NH223S10DR000AAP1*
- Motherboard: 9MS13HD0UR-000
- L-shape Rail kit: 25HB2-A86105-K0R
- CPU heatsink: 25ST1-453207-C1R
- Front panel board - CFPH030: 9CFPH030NR-00
- Backplane board - CBP2060: 9CBP2060NR-00
- Fan module: 25ST2-88382V-S1R
- Riser card - CRSH02D: 9CRSH02DNR-00
- Riser card - CRSH02E: 9CRSH02ENR-00
- EDSFF Bypass card - CSPP010: 9CSPP010NR-00
- I/O board with M.2 slot - CFPH010: 9CFPH010NR-00
- LAN bridge board - CLSH13: 9CLSH13NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power Supply: 25EP0-23000F-G1S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NH223S10SR-RMA-A100
- Barebone package (4th Gen): 6NH223S10DR000AAP1*
- Motherboard: 9MS13HD0UR-000
- L-shape Rail kit: 25HB2-A86105-K0R
- CPU heatsink: 25ST1-453207-C1R
- Front panel board - CFPH030: 9CFPH030NR-00
- Backplane board - CBP2060: 9CBP2060NR-00
- Fan module: 25ST2-88382V-S1R
- Riser card - CRSH02D: 9CRSH02DNR-00
- Riser card - CRSH02E: 9CRSH02ENR-00
- EDSFF Bypass card - CSPP010: 9CSPP010NR-00
- I/O board with M.2 slot - CFPH010: 9CFPH010NR-00
- LAN bridge board - CLSH13: 9CLSH13NR-00
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power Supply: 25EP0-23000F-G1S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
- RMA packaging: 6NH223S10SR-RMA-A100
* 產品規格會依各國家地區出貨而有所變動，應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
* 以上產品之規格、圖片及其他資訊僅供參考，如與實際產品有任何不相符之處，應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失，技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值，實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示，均為其合法所有人之財產。
* 基於PC基本架構，有部分記憶體空間須留作系統用途，故所偵測到之記憶體大小會比實際上較少。
SUPPORT
驅動程式
BIOS
工具程式
Firmware
OS
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
晶片組
晶片組
版本
檔案大小
日期
Intel® Chipset Driver
Version : 10.1.19485.8386
3.81 MB
Jan 04, 2024
作業系統: Windows Server 2019,Windows Server 2022
公用程式
BIOS
說明
版本
檔案大小
日期
Include INTEL-TA-01036 (CVE-2023-45745/CVE-2023-47855); AMI SA50232 (CVE-2023-45236/CVE-2023-45237), and multiple feature updates.
Version : R07
29.3 MB
Apr 12, 2024
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Warning:
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
更新BIOS有其潛在的風險，如果您使用目前版本的BIOS沒有問題，我們建議您不要任意更新BIOS。如需更新BIOS，請小心的執行，以避免不當的操作而造成系統毀損.
什麼是 BETA 版？
BETA版是正式推出前的試用版本。雖然該版本已經過測試，但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本，並請密切注意正式版本的推出。
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.74
147.86 MB
Mar 05, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
作業系統: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
說明
版本
檔案大小
日期
BMC firmware with embedded GIGABYTE Management Console
(AST2600)
(AST2600)
Version : 13.05.09
113.83 MB
Jan 26, 2024
英語
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.36
83.16 MB
Nov 02, 2023
英語
使用手冊
說明
版本
檔案大小
日期
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
17.39 MB
Aug 29, 2023
英語
說明
版本
檔案大小
日期
作業系統支援列表
Version : 1.5
0.22 MB
Jan 04, 2024
4th Generation Intel® Xeon® Scalable Processors
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
5th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
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