Specifications
Dimensions (WxHxD, mm)
2U
449.6 x 87 x 808
CPU
AMD EPYC™ 9006 SP7 Server processors
[DLC] Dual processors, PPT up to 600 W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 7536
Socket SP7
Chipset
Integrated into SoC
Memory
[DLC] 32 x DIMM slots
Support DDR5 RDIMM/MRDIMM [1]
16-Channel memory per processor
RDIMM: Up to 8000 MT/s
MRDIMM: Up to 12800 MT/s
[1] MRDIMMs are supported only on select CPU SKUs.
LAN
Front:
[DLC] 8 x 800 Gb/s OSFP InfiniBand or Ethernet, for GPU networking, via NVIDIA ConnectX®-9 VPI
Front (DC-SCM - CDCG300):
1 x 1 Gb/s LAN (1 x Intel® I210-AT)
- Supports NCSI function
1 x Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
Video
Integrated in ASPEED® AST2700
- 1 x Mini-DP
Storage
Front hot-swap:
[DLC] 8 x E1.S Gen6 NVMe, from CX-9
Internal M.2:
2 x M.2 (2280), PCIe Gen4 x4, from CPU_1
Modular GPU
[DLC] NVIDIA HGX™ Rubin NVL8
PCIe Expansion Slots
PCIe Cable:
[DLC] 1 x FHFL x16 (Gen6 x16), from CX-9
Front I/O
8 x OSFP ports
DC-SCM - CDCG300:
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
1 x RJ45 port
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x Storage activity LED
1 x System status LED
Security Modules
1 x TPM header with SPI interface
-
Optional TPM 2.0 kit:
CTM012Power Supply[#1]
1 x 54 V DC Bus Bar Connector
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 45°C.
Packaging Content
1 x G2L5-DR4-L08
1 x Rail kit
Part Numbers
- Barebone with NVIDIA module: 6NG2L5DR4DR000L08*
[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.