| Description | Version | Size | Date |
|---|
Specifications
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
440 x 87.5 x 840
Motherboard
MH62-HD1
CPU
3rd Generation Intel® Xeon® Scalable Processors
Dual processor per node, TDP up to 270W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Dual processor per node, TDP up to 270W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
8 x LGA 4189
Socket P+
Socket P+
Chipset
Intel® C621A
Memory
64 x DIMM slots
Support DDR4 RDIMM/LRDIMM
8-channel memory per processor
Up to 3200/2933/2666 MT/s
Support DDR4 RDIMM/LRDIMM
8-channel memory per processor
Up to 3200/2933/2666 MT/s
LAN
Rear:
8 x 10Gb/s LAN (4 x Intel® X710-AT2)
- Support NCSI function
4 x 10/100/1000 Mbps Management LAN
1 x CMC port
8 x 10Gb/s LAN (4 x Intel® X710-AT2)
- Support NCSI function
4 x 10/100/1000 Mbps Management LAN
1 x CMC port
Video
Integrated in ASPEED® AST2600 x 4
- 4 x VGA ports
- 4 x VGA ports
Storage
Front hot-swap:
24 x 2.5" Gen4 NVMe/SATA/SAS [1]
- (NVMe from CPU_1)
[1] SAS card is required to support SAS drives.
24 x 2.5" Gen4 NVMe/SATA/SAS [1]
- (NVMe from CPU_1)
[1] SAS card is required to support SAS drives.
SAS
Require SAS add-in cards
RAID
Intel® SATA RAID 0/1/5/10
Onboard VROC key header
Onboard VROC key header
PCIe Expansion Slots
Riser Card CRSH01D x 4:
- 4 x LP x16 (Gen4 x16)
Riser Card CRSH01E x 4:
- 4 x LP x16 (Gen4 x16)
4 x OCP 2.0 mezzanine (Gen3 x8) [1]
[1] OCP 2.0 bandwidth is shared with onboard LAN. Onboard LAN would be disabled if OCP 2.0 utilizes Gen3 x16 bandwidth.
- 4 x LP x16 (Gen4 x16)
Riser Card CRSH01E x 4:
- 4 x LP x16 (Gen4 x16)
4 x OCP 2.0 mezzanine (Gen3 x8) [1]
[1] OCP 2.0 bandwidth is shared with onboard LAN. Onboard LAN would be disabled if OCP 2.0 utilizes Gen3 x16 bandwidth.
Front I/O
4 x Power button with LEDs
4 x ID button with LEDs
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
4 x ID button with LEDs
4 x Reset buttons
4 x System status LEDs
1 x CMC status LED
1 x CMC reset button
Rear I/O
8 x USB 3.0 ports (Type-A)
4 x VGA ports
8 x RJ45 ports
4 x MLAN ports
4 x ID LEDs
1 x CMC port
4 x VGA ports
8 x RJ45 ports
4 x MLAN ports
4 x ID LEDs
1 x CMC port
Backplane Board
Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
- Optional TPM2.0 kit: CTM010
Power Supply[#1]
Dual 2200W 80 PLUS Platinum redundant power supply [1]
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input:
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+ 12.12V/ 95.6A
+ 12Vsb/ 3.5A
- Max 2200W/ 200-240V~
+ 12.12V/ 178.1A
+ 12Vsb/ 3.5A
[1] The system power supply requires C19 power cord.
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input:
- 240Vdc/ 12.6A
DC Output:
- Max 1200W/ 100-127V~
+ 12.12V/ 95.6A
+ 12Vsb/ 3.5A
- Max 2200W/ 200-240V~
+ 12.12V/ 178.1A
+ 12Vsb/ 3.5A
[1] The system power supply requires C19 power cord.
System Management
ASPEED® AST2600 Baseboard Management Controller
ASPEED® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
ASPEED® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP/AD/RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Citrix Hypervisor 8.2.0 or later
Red Hat Enterprise Linux 7.9 or later
Red Hat Enterprise Linux 8.2 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later
Windows Server 2016
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 7.9 or later
Red Hat Enterprise Linux 8.2 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later
Windows Server 2016
Windows Server 2019
Windows Server 2022
System Fans
8 x 80x80x38mm
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
[Note] Please leave one PCIe slot empty if using processors with 270W TDP.
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
[Note] Please leave one PCIe slot empty if using processors with 270W TDP.
Weight
Net Weight: 26.2 kg
Gross Weight: 49.34 kg
Gross Weight: 49.34 kg
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H262-NO0
8 x CPU heatsinks
1 x 3-Section Rail kit
8 x CPU heatsinks
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH262NO0MR-00-1*
- Motherboard: 9MH62HD1NR-00*
- 3-Section Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-453212-M1R/25ST1-453213-M1R
- Backplane board - CBPH7O0: 9CBPH7O0NR-00*
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S
Optional parts:
- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 expansion card - CMTP16Z: 9CMTP16ZNR-00*
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262NO0SR-RMA-A100
- Motherboard: 9MH62HD1NR-00*
- 3-Section Rail kit: 25HB2-A66122-K0R
- CPU heatsink: 25ST1-453212-M1R/25ST1-453213-M1R
- Backplane board - CBPH7O0: 9CBPH7O0NR-00*
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S
Optional parts:
- VROC module: 25FD0-R181N0-10R (Supported for Intel SSD only)
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 expansion card - CMTP16Z: 9CMTP16ZNR-00*
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262NO0SR-RMA-A100
[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.
