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H263-V60
(rev. AAW1)
To be released
(rev.LAW1)
High Density Arm Server - NVIDIA Grace CPU Superchip - 2U 4-Node 16-Bay Gen5 NVMe
| Application:
HPC
&
Hybrid/Private Cloud Server
Application:
- High-performance CPU for HPC and cloud computing
- 2U 4-node rear access server system
- NVIDIA Grace CPU Superchip
- 900GB/s NVLink-C2C Interconnect
- Up to 960GB LPDDR5X ECC memory per module
- Compatible with NVIDIA BlueField-2 / BlueField-3 DPUs
- 4 x Dedicated management ports
- 16 x 2.5" Gen5 NVMe hot-swappable bays
- 8 x M.2 slots with PCIe Gen5 x4 interface
- 8 x LP PCIe Gen5 x16 slots
- 4 x OCP 3.0 Gen5 x16 slots
- 2+1 3000W (240V) 80 PLUS Titanium redundant power supplies
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SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 850
440 x 87.5 x 850
Motherboard
MV63-HD0
Superchip
NVIDIA Grace CPU Superchip:
- 2 x Grace CPUs
- Connected with NVLink-C2C
- TDP up to 500W (CPU + memory) at ambient 20°C
- 2 x Grace CPUs
- Connected with NVLink-C2C
- TDP up to 500W (CPU + memory) at ambient 20°C
Memory
Per node:
Up to 960GB of LPDDR5X memory with ECC
Memory bandwidth up to 1TB/s
Up to 960GB of LPDDR5X memory with ECC
Memory bandwidth up to 1TB/s
LAN
Per node:
1 x Dedicated management port
Total:
4 x Dedicated management ports
1 x CMC port
1 x Dedicated management port
Total:
4 x Dedicated management ports
1 x CMC port
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
4 x 2.5" Gen5 NVMe hot-swappable bays
- (2 x from CPU_0, 2 x from CPU_1)
Total:
16 x 2.5" Gen5 NVMe hot-swappable bays
- (8 x from CPU_0, 8 x from CPU_1)
4 x 2.5" Gen5 NVMe hot-swappable bays
- (2 x from CPU_0, 2 x from CPU_1)
Total:
16 x 2.5" Gen5 NVMe hot-swappable bays
- (8 x from CPU_0, 8 x from CPU_1)
SAS
N/A
RAID
N/A
Expansion Slots
Per node:
PCIe cable x 2:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_1
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function
2 x M.2 slots:
- M-key
- PCIe Gen5 x4, from CPU_1
- Supports 2280/22110 cards
Total:
PCIe cable x 8:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_1
4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function
8 x M.2 slots:
- M-key
- PCIe Gen5 x4, from CPU_1
- Supports 2280/22110 cards
PCIe cable x 2:
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_1
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function
2 x M.2 slots:
- M-key
- PCIe Gen5 x4, from CPU_1
- Supports 2280/22110 cards
Total:
PCIe cable x 8:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_1
4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function
8 x M.2 slots:
- M-key
- PCIe Gen5 x4, from CPU_1
- Supports 2280/22110 cards
Internal I/O
Per node:
2 x M.2 slots
1 x COM
1 x TPM header
1 x OCP 3.0 slot
2 x M.2 slots
1 x COM
1 x TPM header
1 x OCP 3.0 slot
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system
Rear I/O
Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x ID button with LED
Total:
8 x USB 3.2 Gen1
4 x VGA
4 x MLAN
4 x ID buttons with LED
*1 x CMC port
*Only one CMC port per system
2 x USB 3.2 Gen1
1 x VGA
1 x MLAN
1 x ID button with LED
Total:
8 x USB 3.2 Gen1
4 x VGA
4 x MLAN
4 x ID buttons with LED
*1 x CMC port
*Only one CMC port per system
Backplane I/O
Speed and bandwidth:
PCIe Gen5 x4
PCIe Gen5 x4
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM012
Optional TPM2.0 kit: CTM012
Power Supply
2+1 3000W (240V) 80 PLUS Titanium redundant power supplies
AC Input:
- 100-127V~/ 16A, 50-60Hz
- 200-240V~/ 16A, 50-60Hz
DC Input:
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+ 12.2V/ 98.36A
+ 12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+ 12.2V/ 213A
+ 12.2Vsb/ 3A
- Max 3000W/ 208-240V~
+ 12.2V/ 245.9A
+ 12.2Vsb/ 3A
NOTE: The system power supply requires C19 power cord
AC Input:
- 100-127V~/ 16A, 50-60Hz
- 200-240V~/ 16A, 50-60Hz
DC Input:
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+ 12.2V/ 98.36A
+ 12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+ 12.2V/ 213A
+ 12.2Vsb/ 3A
- Max 3000W/ 208-240V~
+ 12.2V/ 245.9A
+ 12.2Vsb/ 3A
NOTE: The system power supply requires C19 power cord
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
TBD
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 10-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-90% (non-condensing)
Operating humidity: 10-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-90% (non-condensing)
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H263-V60
1 x 3-Section Rail kit
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH263V60DR000AAW1*
- 3-Section Rail kit: 25HB2-A66125-K0R
- 3-Section Rail kit: 25HB2-A66125-K0R
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
RESOURCES
Articles
Tech Guide | September 11, 2023
How to Pick the Right Server for AI? Part One: CPU & GPU
With the advent of generative AI and other practical applications of artificial intelligence, the procurement of “AI servers” has become a priority for industries ranging from automotive to healthcare, and for academic and public institutions alike. In GIGABYTE Technology’s latest Tech Guide, we take you step by step through the eight key components of an AI server, starting with the two most important building blocks: CPU and GPU. Picking the right processors will jumpstart your supercomputing platform and expedite your AI-related computing workloads.
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