H262-Z66 (rev. 100)

(rev.A00)

HCI Server – AMD DP 2U 4 Nodes Server | Application: HCI & Hybrid/Private Cloud Server

Application:

HCI Hybrid/Private Cloud Server

2U - 4 nodes rear access server system
Dual AMD EPYC™ 7002 series processor family
8 x LGA 4094 sockets
8-Channel RDIMM/LRDIMM DDR4 per processor, 64 x DIMMs
8 x 1Gb/s LAN ports (Intel^® I350-AM2)
4 x Dedicated management ports
1 x CMC global management port
12 x 2.5" NVMe/SATA hot-swappable SSD bays
12 x 2.5" SATA/SAS hot-swappable HDD/SSD bays
8 x M.2 with PCIe Gen3 x4 interface
8 x Low profile PCIe Gen4 x16 expansion slots
4 x OCP 2.0 Gen3 x16 mezzanine slots
Aspeed^® AST2500 remote management controller
2200W 80 PLUS Platinum redundant PSU

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VERGLEICHSLISTE

H262-Z66 (rev. 100) - High Density Servers

1/9

* Das vorliegende Material dient nur zur Referenz. GIGABYTE behalt sich das Recht vor, ohne Vorwarnung Inhalte zu verandern oder zu entfernen.
* Die beworbene Leistung basiert auf den maximal theoretischen Werten der Chipsatzhersteller oder von Organisationen, die die Interface-Spezifikationen erstellt haben. Die aktuelle Performance kann je nach Systemkonfiguration variieren.
* Alle Trademarks und Logos sind Eigentum der Markeninhaber.
* Aufgrund der Standard-PC-Architektur ist ein Teil des Speichers fur die Nutzung des Systems reserviert und daher kann die aktuelle Speichergrose von der Speicherangabe abweichen.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 4 Nodes - Rear access
440 x 87.5 x 840

Motherboard

MZ62-HD0

CPU

AMD EPYC™ 7002 series processor family
Dual processors, 7nm technology
Up to 64-core, 128 threads per processor
TDP up to 200W

NOTE:
1) If only 1 CPU is installed, some PCIe or memory functions might be unavailable
2) Contact GIGABYTE sales rep or technical support for more details about supporting cTDP 240W CPU

Compatible with AMD EPYC™ 7001 series processor family

Socket

Per Node:
2 x LGA 4094
Total:
8 x LGA 4094
Socket SP3

Chipset

System on Chip

Memory

Per node:
16 x DIMM slots

Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory per processor architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
Memory speed: Up to 3200 MHz

LAN

Per node:
2 x 1GbE LAN ports (1 x Intel^® I350-AM2)
1 x Dedicated management port

Total:
8 x 1GbE LAN ports (1 x Intel^® I350-AM2)
4 x Dedicated management ports
1 x 10/100/1000 *CMC global management port

*CMC: Chassis Management Controller, to monitor all status of computing nodes

Video

Integrated in Aspeed^® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Audio

Storage

Per node:
3 x 2.5" NVMe/SATA hot-swappable SSD bays
3 x 2.5" SATA/SAS hot-swappable HDD/SSD bays

Total:
12 x 2.5" NVMe/SATA hot-swappable SSD bays
12 x 2.5" SATA/SAS hot-swappable HDD/SSD bays

All storage bays are compatible with SATA devices

RAID

Peripheral Drives

Expansion Slots

Per node:
2 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) from CPU_0
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)

2 x M.2 slots from CPU_0 and CPU_1:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

Total:
8 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus) from CPU_0
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)

8 x M.2 slots from CPU_0 and CPU_1:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

Internal I/O

Per node:
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector

Front I/O

Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x System reset button
*1 x CMC status LED

*Only one CMC status LED per system

Rear I/O

Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x RJ45 MLAN

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x RJ45 MLAN
*1 x CMC global management port

*Only one CMC global management port per system

Backplane I/O

24 x ports
Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s or PCIe Gen3 x4 per port

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Power Supply

2 x 2200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Output:
- Max 1200W/ 100-127V~
+12.12V/ 95.6A
+12Vsb/ 3.5A
- Max 2200W/ 200-240V
+12.12V/ 178.1A
+12Vsb/ 3.5A

System power supply requires C19 type power cord

System Management

Aspeed^® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
JAVA Based Serial Over LAN
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Windows Server 2016 ( X2APIC/256T not supported)
Windows Server 2019

Red Hat Enterprise Linux 7.6 ( x64) or later
Red Hat Enterprise Linux 8.0 ( x64) or later

SUSE Linux Enterprise Server 12 SP4 ( x64) or later
SUSE Linux Enterprise Server 15 SP1 ( x64) or later

Ubuntu 16.04.6 LTS (x64) or later
Ubuntu 18.04.3 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.5 EP15 or later
VMware ESXi 6.7 Update3 or later
VMware ESXi 7.0 or later

Citrix Hypervisor 8.1.0 or later

Weight

Net Weight: 28 kg
Gross Weight: 50 kg

System Fans

8 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

1180 X 779 X 300 mm

Packaging Content

1 x H262-Z66
8 x CPU heatsinks
1 x Rail Kit

Part Numbers

Barebone package: 6NH262Z66MR-00
Spare parts:
- Motherboard: 9MZ62HD0NR-00
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R
- Back plane board: 5CFPH004NR-00
- NVMe M.2 extension card for Slot_R: 9CMTP04RNR-00 (optional extra)
- Power Supply: 25EP0-222003-D0S
- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional extra)
- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional extra)
- C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (optional extra)
- Ring topology kit: 6NH262Z65SR-00-100 (optional extra)

* Das vorliegende Material dient nur zur Referenz. GIGABYTE behält sich das Recht vor, ohne Vorwarnung Inhalte zu verändern oder zu entfernen.
* Die beworbene Leistung basiert auf den maximal theoretischen Werten der Chipsatzhersteller oder von Organisationen, die die Interface-Spezifikationen erstellt haben. Die aktuelle Performance kann je nach Systemkonfiguration variieren.
* Alle Trademarks und Logos sind Eigentum der Markeninhaber.
* Aufgrund der Standard-PC-Architektur ist ein Teil des Speichers für die Nutzung des Systems reserviert und daher kann die aktuelle Speichergröße von der Speicherangabe abweichen.

SUPPORT

Downloads

Treiber
BIOS
Utility
Firmware

Handbuch
Kompatibilitätsliste

Online Support

Treiber

BIOS

Utility

Firmware

Choose your OS
Choose your OS
Windows Server 2019
Windows Server 2016 64bit

Chipset

Version

Größe

Datum

AMD Chipset Driver
For AMD EPYC 7001/ 7002

Version : 1.07.12.1102

17.05 MB

2019.08.06