TO25-ZU4-AA01

ORV3 Compute Node - AMD EPYC 9005/9004 - 2OU 2-Node UP 2-Bay E1.S Gen5 NVMe + 4-Bay 2.5" Gen5 NVMe
  • Single AMD EPYC 9005/9004 Series Processors
  • 12-Channel DDR5 RDIMM, 12 x DIMMs
  • Dual ROM Architecture with integrated Platform Root of Trust
  • 2 x 10Gb/s LAN ports via Intel® X710-AT2
  • 2 x E1.S Gen5 NVMe hot-swap bays
  • 4 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swap bays
  • 2 x FHFL PCIe Gen5 x16 slots
  • 2 x OCP NIC 3.0 PCIe Gen5 x16 slots
  • 48V to 54V DC bus bar power solution
Ordering Numbers: 6NTO25ZU4DR000AC01*
儲存
此產品已儲存至最愛清單
詢價清單
  • 產品介紹
  • 產品規格
  • 支援與下載
  • 相關資源

產品規格

Dimensions (WxHxD, mm)
2OU 2-node
258 x 86 x 771
Open Rack Version
ORV3
Motherboard
MZU3-MG0
CPU
AMD EPYC 9005 Series Processors
AMD EPYC 9004 Series Processors

Single processor, cTDP up to 500W
Memory
12 x DIMM slots
DDR5 memory supported
12-Channel memory per processor

AMD EPYC 9005:
RDIMM: Up to 6400 MT/s

AMD EPYC 9004:
RDIMM: Up to 4800 MT/s
LAN
Front (I/O board - COFPA00):
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function

1 x 10/100/1000 Mbps Management LAN
Video
Integrated in ASPEED® AST2600
- 1 x Mini-DP
Storage
Front hot-swap:
2 x 9.5mm E1.S Gen5 NVMe
4 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]

[1] Storage card is required to support SATA and SAS drives.
SAS
Require SAS add-in cards
RAID
Require RAID add-in cards
PCIe Expansion Slots
PCIe Cable x 2:
- 2 x FHFL x16 (Gen5 x16)

2 x OCP NIC 3.0 (Gen5 x16)
- Support NCSI function
Front I/O
1 x USB 3.2 Gen1 port (Type-C)
1 x Micro USB port for BMC UART
1 x Mini-DP
2 x RJ45 ports
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010
System Management
ASPEED® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
N/A
Compatible Node Tray
TO25-BT1-AA01
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
Packaging Dimensions
1182 x 485 x 275 mm
Packaging Content
1 x TO25-ZU4-AA01
1 x CPU heatsink
Part Numbers
- Barebone package: 6NTO25ZU4DR000AC01*
- Motherboard: 9MZU3MG0UR-000-3*
- CPU heatsink: 25ST1-563400-C1R
- Backplane board - COBPU60: 9COBPU60NR-00*
- OCP module - COBGF0: 9COBGF0NR-00*
- OCP backplane board - COBPN21: 9COBPN21NR-00*
- I/O board - COFP340: 9COFP340NR-00*
- I/O board - COFPA00: 9COFPA00NR-00*
- DC-SCM board (A)+(B)+(C):
A) CDCX101: 9CDCX101NR-00*
B) CSC403: 9CSC403NR-00*
C) CSC1200: 9CSC1200NR-00*

[#1] 本網站所提供之產品規格、圖片及其他資訊僅供參考,如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利,並不對因使用上述資料而導致的任何損失承擔責任。

[#2] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值,實際效能可能因系統配置及使用環境而有所不同。

[#3] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。

支援與下載

下載
驅動程式 BIOS 公用程式 Firmware 使用手冊 DriverBIOSUtilityFirmwareManual

描述版本檔案大小日期