G363-ZR0- LAX1

Legacy | Software updates supported

Rev. 1.x Rev. 3.x

HPC/AI Server - AMD EPYC™ 9004 - 3U DP HGX™ H100 4-GPU DLC

Liquid-cooled NVIDIA HGX™ H100 4-GPU
CPU+GPU direct liquid cooling solution
4th-generation NVIDIA^® NVLink™ 900GB/s
Dual AMD EPYC™ 9004 Series Processors
12-Channel DDR5 RDIMM, 24 x DIMMs
Dual ROM Architecture
2 x 10Gb/s LAN ports via Broadcom^® BCM57416
2 x 1Gb/s LAN ports via Intel^® I350-AM2
4 x 2.5" Gen5 NVMe/SATA/SAS hot-swap bays
4 x 2.5" Gen5 NVMe hot-swap bays
1 x M.2 slot with PCIe Gen4 x4 interface
6 x LP PCIe Gen5 x16 slots
2+1 3000W 80 PLUS Titanium redundant power supplies

Ordering Numbers: 6NG363ZR0DR000LBX1*

[#1] 本網站所提供之產品規格、圖片及其他資訊僅供參考，如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利，並不對因使用上述資料而導致的任何損失承擔責任。
[#2] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值，實際效能可能因系統配置及使用環境而有所不同。
[#3] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。

SPECIFICATIONS

Dimensions (WxHxD, mm)

3U
448 x 130 x 800

Motherboard

MZ83-HD1

CPU

AMD EPYC™ 9005 Series Processors
AMD EPYC™ 9004 Series Processors

Dual processor, cTDP up to 400W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 6096
Socket SP5

Chipset

System on Chip

Memory

24 x DIMM slots
DDR5 memory supported
12-Channel memory per processor
RDIMM: Up to 4800 MT/s

LAN

Front (I/O board - CLBH160):
2 x 1Gb/s LAN (1 x Intel^® I350-AM2)
- Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Rear:
2 x 10Gb/s LAN (1 x Broadcom^® BCM57416)
- Support NCSI function

Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN

^[Note]When both MLAN ports are connected with cables, the front MLAN port will be set as the default.

Video

Integrated in ASPEED^® AST2600
- 1 x Mini-DP

Storage

Front hot-swap:
4 x 2.5" Gen5 NVMe/SATA/SAS^[1]
4 x 2.5" Gen5 NVMe
- (4 x NVMe from CPU_0, 4 x NVMe from CPU_1)
- (SATA from CPU_0)

Internal M.2 (CMTP192):
1 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_0

^[1]SAS card is required to support SAS drives.

SAS

Require SAS add-in cards

RAID

Require RAID add-in cards

Modular GPU

Liquid-cooled NVIDIA HGX™ H100 with 4 x SXM5 GPUs

PCIe Expansion Slots

Front:
1 x LP x16 (Gen5 x16), from CPU_0
1 x LP x16 (Gen5 x16), from CPU_1

1 x OCP NIC 3.0, from CPU_0, disabled

Rear:
4 x LP x16 (Gen5 x16), from PEX89144, support RDMA
- (Equipped with full-height brackets)

Front I/O

1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x Storage activity LED
1 x System status LED

I/O board - CLBH160:
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
2 x RJ45 ports (Intel I350)
1 x MLAN port (default)

Rear I/O

2 x RJ45 ports (Broadcom BCM57416)

MLAN board - CDB66:
1 x MLAN port

Backplane Board

Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS 12Gb/s

Security Modules

1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM010

Power Supply^[#1]

2+1 3000W 80 PLUS Titanium redundant power supplies^[1]

AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz

DC Input: (Only for China)
- 240Vdc/ 14A

DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Management

ASPEED^® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x80mm (17,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

^[Note]To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 40°C.

Weight

Net Weight: 50.44 kg
Gross Weight: 55.2 kg

Packaging Dimensions

1176 x 782 x 295 mm

Packaging Content

1 x G363-ZR0-LAX1
1 x Mini-DP to D-Sub cable
1 x L-shape Rail kit

Part Numbers

- Barebone w/ NVIDIA module (9005/9004): 6NG363ZR0DR000LBX1*
- Barebone w/ NVIDIA module (9004): 6NG363ZR0DR000LAX1*
- Motherboard: 9MZ83HD1UR-000*
- L-shape Rail kit: 25HB2-A86102-K0R
- CoolIT CPU cold plate loop: 25ST7-20000C-C4R
- CoolIT GPU cold plate loop: 25ST7-3000Z5-C4R
- Front panel board - CFP1000: 9CFP1000NR-00*
- Backplane board - CBP2081: 9CBP2081NR-00*
- Fan module: 25ST2-888030-S1R
- Fan module: 25ST2-888031-S1R
- M.2 expansion card - CMTP192: 9CMTP192NR-00*
- Riser card - CRSH01R: 9CRSH01RNR-00*
- OCP card - CNVC171: 9CNVC171NR-00*
- Front I/O board (incl. I350-AM2) - CLBH160: 9CLBH160NR-00*
- PCIe switch board - CPBG901: 9CPBG901NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Mini-DP to D-Sub cable: 25CRN-200801-K1R
- Power supply: 25EP0-23000A-D0S

Optional parts:

- RMA packaging: 6NG363ZR0SR-RMA-L100

[#1] 伺服器產品未附帶電源線。客戶需自行選擇適當的電源線 (可選配件)，或聯繫業務協助客製化。
[#2] 本網站所提供之產品規格、圖片及其他資訊僅供參考，如有差異應以實際產品為準。技嘉科技保留隨時修改內容的權利，並不對因使用上述資料而導致的任何損失承擔責任。
[#3] 本產品所標示之效能數據為晶片廠商或相關介面標準制定組織所公佈的最大理論值，實際效能可能因系統配置及使用環境而有所不同。
[#4] 本文所使用的所有商標及企業識別標誌均為其合法所有者的財產。

SUPPORT

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Firmware

QVL

BIOS

說明

版本

檔案大小

日期

Version : R07_F18

45.38 MB

Apr 18, 2025

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SPECIFICATIONS

SUPPORT

RESOURCES

G363-ZR0-LAX1 (Rev. 1.x)

G363-ZR0- LAX1