| Description | Version | Size | Date |
|---|
1/6
A1O3-CC0
18OU OCP Tank
- Supports up to 18OU OCP servers with 2 x 1U EIA space for switch and a 2OU space for powershelf
- Minimum PUE reaching 1.02
- Up to 80 kW of heat dissipation capacity
- Supports server length up to 900 mm
Ordering Numbers: 9NA1O3CC0KR-000-2*
仕様
Hardware Capacity
18OU + 2OU (power shelf, 24kW) + 1U (EIA) x 2
Heat Dissipation Capacity
80 kW with 25℃ inlet water
60 kW with 35℃ inlet water
60 kW with 35℃ inlet water
Dimensions (L x W x H)
Tank (0.91 m x 1.16 m x 1.49 m)
CDU (0.86 m x 0.48 m x 1.62 m)
CDU (0.86 m x 0.48 m x 1.62 m)
Weight
Tank: 450 kg (w/o coolant); 1065 kg (w/ coolant)
CDU: 325 kg
CDU: 325 kg
CDU Power Consumption
0.75 kW
Coolant Volume
750 L
Electrical Connection
PDU: IEC 60309 32A-3P+N+E, 6H, Plug x1
Power Shelf: IEC 60309 63A-3P+N+E, 6H, Plug x1
CDU: IEC 60320 C19, Plug x1
Power Shelf: IEC 60309 63A-3P+N+E, 6H, Plug x1
CDU: IEC 60320 C19, Plug x1
Footprint
2.1 m x 0.9 m
Server Depth Supported
900 mm
Cooling Water Inlet
20°C to 35°C
[Note] The Facility Water System (FWS) loop must meet the water quality values specified in ASHRAE Liquid Cooling Guidelines for Datacom Equipment Centers, 2nd ed., Chapter 5, as reproduced in OCP Immersion Requirements Rev. 2.10, Section 7.4 "FWS Water quality."
[Note] The Facility Water System (FWS) loop must meet the water quality values specified in ASHRAE Liquid Cooling Guidelines for Datacom Equipment Centers, 2nd ed., Chapter 5, as reproduced in OCP Immersion Requirements Rev. 2.10, Section 7.4 "FWS Water quality."
Water Flow Rate
240 LPM
PUE
1.02
Ordering Information
Tank: 9NA1O3CC0KR-000-2*
IT Lift: 25FT3-000000-T0R
IT Dry Rack: 25FT5-000000-U0R
Drain Oil Pump: 25FT4-000000-K0R
IT Lift: 25FT3-000000-T0R
IT Dry Rack: 25FT5-000000-U0R
Drain Oil Pump: 25FT4-000000-K0R
[#1] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#2] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#3] All trademarks and logos are the property of their respective owners.
