ORV3 Server - Intel® Xeon® 6900E+/6900-Series Processors - 1OU 2-Node DP 4-Bay E3.S Gen5 NVMe DLC - TO16-A81-LA01

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TO16-A81-LA01

ORV3 Server - Intel^® Xeon^® 6900E+/6900-Series Processors - 1OU 2-Node DP 4-Bay E3.S Gen5 NVMe DLC

Direct liquid cooling solution with leak detection
1OU 2-node front access server system
Dual Intel^® Xeon^® 6900E+/6900-Series processors per node
12-Channel DDR5 RDIMM/MRDIMM per CPU with 24 x DIMMs per node
2 x E3.S Gen5 NVMe hot-swap bays per node
3 x LP PCIe x16 slots with Gen5 x16 lanes per node
48 V to 54 V DC bus bar power solution

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Boosting Individual Applications with On-Point Features

Intel^® Xeon^® 6/6+ is a new generation of processors that has tailored its CPU lineup to target all uses cases such as Cloud Computing, AI, Analytics, and Edge & IOT. Whether it's high compute density that is dependent on core count and power efficiency or AI/HPC applications that heavily rely on strong single-core performance, this new platform covers them all with its Performance cores (P-cores) and Efficient-cores (E-cores). Along with flexible I/O options, integrated accelerators, and support for CXL 2.0 devices, Intel Xeon 6 fulfills customer needs across the broadest range of data center workloads, segments, and deployment models.

Core Technology Aligned with Aspirations

Accelerators

built-in*

Incredible performance and efficiency improvements with the easy adoption of on-chip accelerators

8 or 12

Channels

Increased memory frequency and throughput with DDR5 RDIMM support

PCIe 5.0

lanes

Up to 136 lanes for 1S designs, supporting all the latest drives and accelerators

CXL 2.0

support**

Flexible support between PCIe and CXL, utilizing DDR5 and CXL memory as one unified region

Up to 288

E-cores per CPU

Core dense and optimized efficiency for cloud-native and hyperscale workloads

Intel Xeon 6/6+ Processors with E-cores

Up to 128

P-cores per CPU

Greater core performance with improved TCO, accelerating AI and compute intensive workloads

Intel Xeon 6 Processors with P-cores

MRDIMM

support

Unprecedented frequency on the advanced MRDIMM, boosting memory-intensive application to a whole new level

Intel Xeon 6 Processors with P-cores

* Different on-chip accelerators are supported depending on CPU SKUs, and they require a one-time activation. Please visit Intel's official website or contact technical support for details.

** CXL peripheral support varies by product. Please refer to the QVL list for validated configurations.

Select GIGABYTE for the Intel Xeon 6/6+ Platform

Emphasis on AI

Real-time AI breakthroughs are possible with AI enabled CPUs in GIGABYTE servers supporting AMD Instinct, NVIDIA HGX, and Intel Gaudi accelerators.

Energy Efficient

Single-phase immersion cooling and direct liquid cooling (DLC) solutions by GIGABYTE allow data centers to achieve their future green goals today.

Scalability

From a single server to a supercomputing cluster, GIGABYTE has the experience, partners, and advanced cooling options to achieve efficient growth.

Fast & Stable

Keeping pace with the challenges in evolving workloads, GIGABYTE ensures PCIe Gen5 signal integrity and performance for GPUs and NVMe drives.

High Performance

Servers and boards by GIGABYTE are tested to ensure peak performance for demanding CPU compute, GPU acceleration, and memory-intensive workloads.

Collaboration

Intel and GIGABYTE have maintained a healthy relationship that values shared knowledge in order to expedite the latest technology into data centers.

TO16-A81-LA01 Block Diagram

TO16-A81-LA01 Product Overview

GIGABYTE OCP ORV3 Compliant Solutions Advantages

Efficient Rack Density

Balanced consideration between density and power consumption.

Thermal Optimization

Best thermal consideration to develop Rack and Nodes based on Cold Aisle/Hot Aisle concept.
Reduce power consumption of cooling.

Greater Power Efficiency

Low PUE helps reduce data center operating expense.
Central power shelf design to enhance power efficiency and optimize power consumption.

Easy Maintenance

Easier maintenance in front cold aisle instead of hot aisle.
Tool-less design for easy replacement and repair.
Less PSU quantities in whole rack to minimize maintenance efforts.

Higher MTBF

Centralizing power supplies and removing unnecessary components to enhance MTBF (Mean Time Between Failures).
Avoids system downtime caused by component failure and minimizes maintenance efforts.

Hardware Security

Optional TPM 2.0 Module

For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.

Power Efficiency

Automatic Fan Speed Control

GIGABYTE servers are enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.

Especificación

Dimensions (WxHxD, mm)

1OU 2-Node
537 x 45.2 x 928.2

Motherboard

MA84-HD3

CPU

Intel^® Xeon^® 6+ processors
- Intel^® Xeon^® 6900E+ processors

Intel^® Xeon^® 6 processors
- Intel^® Xeon^® 6900-Series processors

^[DLC]Dual processors per node, TDP up to 500 W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

4 x LGA 7529
Socket BR

Chipset

System on Chip

Memory

24 x DIMM slots per node
Support DDR5 RDIMM/MRDIMM^[1]
12-Channel memory per processor

Intel Xeon 6900E+:
RDIMM: Up to 8000 MT/s

Intel Xeon 6900-series:
RDIMM: Up to 6400 MT/s
MRDIMM: Up to 8800 MT/s

^[1]MRDIMMs are supported only on select Intel^® Xeon^® 6 processors with P-cores.

LAN

Front:
1 x 10/100/1000 Mb/s Management LAN per node

Video

Integrated in ASPEED^® AST2600
- 1 x Mini-DP per node

Storage

Front hot-swap:
2 x E3.S Gen5 NVMe per node, from CPU_0

PCIe Expansion Slots

2 x LP x16 (Gen5 x16) per node, from CPU_0
1 x LP x16 (Gen5 x16) per node, from CPU_1

Front I/O

Per node:
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
1 x MLAN port
1 x Power button with LED
1 x System status LED
1 x ID LED

Security Modules

1 x TPM header with SPI interface per node
- Optional TPM 2.0 kit: CTM012

System Fans

4 x 40x40x56mm per node

Liquid Cooling Interface

Connector type: UQD06
Blind mate: Not supported
Hose length: Not included

^[Note]Requires additional server-to-manifold UQD hoses.

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)

Packaging Dimensions

1172 x 776 x 305 mm

Packaging Content

1 x TO16-A81-LA01
2 x CPU cold plate loops
1 x Mini-DP to D-Sub cable
4 x Carriers

Part Numbers

- Barebone package: 6NTO16A81DR000LA01*
- Motherboard: 9MA84HD3UR-000*

[#1] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.

[#2] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.

[#3] All trademarks and logos are the property of their respective owners.

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