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H262-Z66
(rev. A00)
HCI Server - AMD EPYC™ 7003 - 2U-4 Node DP 24-Bay Gen3 NVMe/SATA/SAS
- 2U 4-node rear access server system
- AMD EPYC™ 7003 Series processors
- Dual processor per node, 7nm technology
- 8-Channel RDIMM/LRDIMM DDR4 per processor, 64 x DIMMs
- 8 x 1Gb/s LAN ports (Intel® I350-AM2)
- 4 x Dedicated management ports
- 1 x CMC port
- 12 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
- 12 x 2.5" SATA/SAS hot-swappable bays
- 8 x M.2 slots with PCIe Gen3 x4 interface
- 8 x LP PCIe Gen4 x16 slots
- 4 x OCP 2.0 Gen3 x16 mezzanine slots
- Aspeed® AST2500 remote management controller
- Dual 2200W (240V) 80 PLUS Platinum redundant power supply
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* Materialele oferite aici sunt doar pentru referinţă. GIGABYTE îşi rezervă dreptul de a modifica sau revizui continutul oricând fără notificare prealabilă.
* Perfomanţa prezentată este bazată pe valorile teoretice maxime ale interfeţei de la vendorii respectivi de Chipset-uri sau de la organizaţiile ce au definit specificaţiile interfeţei. Perfomanţele reale pot varia în funcţie de sistem.
* Toate mărcile inregistrate şi logo-urile sunt proprietatea deţinătorilor respectivi.
* Datorită arhitecturii standard PC, o anumită cantitate de memorie este rezervată pentru sistem şi de aceea mărimea actuală a memoriei este mai mică decât cea indicată.
* Perfomanţa prezentată este bazată pe valorile teoretice maxime ale interfeţei de la vendorii respectivi de Chipset-uri sau de la organizaţiile ce au definit specificaţiile interfeţei. Perfomanţele reale pot varia în funcţie de sistem.
* Toate mărcile inregistrate şi logo-urile sunt proprietatea deţinătorilor respectivi.
* Datorită arhitecturii standard PC, o anumită cantitate de memorie este rezervată pentru sistem şi de aceea mărimea actuală a memoriei este mai mică decât cea indicată.
SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 840
440 x 87.5 x 840
Motherboard
MZ62-HD0 Rev. 3.0
CPU
AMD EPYC™ 7003 Series processors
Dual processor per node, 7nm technology
Up to 64-core, 128 threads per processor
TDP up to 200W
NOTE:
1) If only 1 CPU is installed, some PCIe or memory functions might be unavailable
2) Contact GIGABYTE sales rep or technical support for more details about supporting cTDP 240W CPU
Compatible with AMD EPYC™ 7002 Series processors
Dual processor per node, 7nm technology
Up to 64-core, 128 threads per processor
TDP up to 200W
NOTE:
1) If only 1 CPU is installed, some PCIe or memory functions might be unavailable
2) Contact GIGABYTE sales rep or technical support for more details about supporting cTDP 240W CPU
Compatible with AMD EPYC™ 7002 Series processors
Socket
Per Node:
2 x LGA 4094
Total:
8 x LGA 4094
Socket SP3
2 x LGA 4094
Total:
8 x LGA 4094
Socket SP3
Chipset
System on Chip
Memory
Per node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHz
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHz
LAN
Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x Dedicated management ports
1 x CMC port
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
Support NCSI function
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (4 x Intel® I350-AM2)
Support NCSI function
4 x Dedicated management ports
1 x CMC port
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
3 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
3 x 2.5" SATA/SAS hot-swappable bays
Total:
12 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
12 x 2.5" SATA/SAS hot-swappable bays
3 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
3 x 2.5" SATA/SAS hot-swappable bays
Total:
12 x 2.5" Gen3 NVMe/SATA/SAS hot-swappable bays
12 x 2.5" SATA/SAS hot-swappable bays
SAS
Depends on SAS add-on card
RAID
N/A
Expansion Slots
Per node:
2 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth, from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Total:
8 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth, from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)
4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
2 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth, from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Total:
8 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0
4 x OCP 2.0 mezzanine slots with PCIe Gen3 x16 bandwidth, from CPU_0 (Type1, P1, P2, P3, P4 with NCSI supported)
4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_0
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
4 x M.2 slots:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Internal I/O
Per node:
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
2 x M.2 slots
1 x COM header
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*Only one CMC status LED per system
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*Only one CMC status LED per system
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
*1 x CMC port
*Only one CMC port per system
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
*1 x CMC port
*Only one CMC port per system
Backplane Board
Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
Dual 2200W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz
DC Input:
- 240Vdc/ 12.6A
DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~
+ 12.12V/ 178.1A + 12Vsb/ 3.5A
NOTE: System power supply requires C19 power cord
DC Input:
- 240Vdc/ 12.6A
DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~
+ 12.12V/ 178.1A + 12Vsb/ 3.5A
NOTE: System power supply requires C19 power cord
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
Windows Server 2019
Windows Server 2022
Red Hat Enterprise Linux 8.3 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 (x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 47.63 kg
Gross Weight: 49.63 kg
Gross Weight: 49.63 kg
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H262-Z66
8 x CPU heatsinks
1 x 3-Section Rail kit
8 x CPU heatsinks
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH262Z66MR-00-A*
- Motherboard: 9MZ62HD0NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R
- Backplane board - CFPH004: 9CFPH004NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 250V/15A (US): 25CP1-018300-Q0R
- M.2 expansion card - CMTP04R: 9CMTP04RNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262Z66SR-RMA-A100
- Motherboard: 9MZ62HD0NR-00
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R
- Backplane board - CFPH004: 9CFPH004NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- C19 power cord 250V/15A (US): 25CP1-018300-Q0R
- M.2 expansion card - CMTP04R: 9CMTP04RNR-00
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH262Z66SR-RMA-A100
* Materialele oferite aici sunt doar pentru referinţă. GIGABYTE îşi rezervă dreptul de a modifica sau revizui continutul oricând fără notificare prealabilă.
* Perfomanţa prezentată este bazată pe valorile teoretice maxime ale interfeţei de la vendorii respectivi de Chipset-uri sau de la organizaţiile ce au definit specificaţiile interfeţei. Perfomanţele reale pot varia în funcţie de sistem.
* Toate mărcile inregistrate şi logo-urile sunt proprietatea deţinătorilor respectivi.
* Datorită arhitecturii standard PC, o anumită cantitate de memorie este rezervată pentru sistem şi de aceea mărimea actuală a memoriei este mai mică decât cea indicată.
* Perfomanţa prezentată este bazată pe valorile teoretice maxime ale interfeţei de la vendorii respectivi de Chipset-uri sau de la organizaţiile ce au definit specificaţiile interfeţei. Perfomanţele reale pot varia în funcţie de sistem.
* Toate mărcile inregistrate şi logo-urile sunt proprietatea deţinătorilor respectivi.
* Datorită arhitecturii standard PC, o anumită cantitate de memorie este rezervată pentru sistem şi de aceea mărimea actuală a memoriei este mai mică decât cea indicată.
SUPPORT
Driver
BIOS
Utilitar
Firmware
QVL
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 64bit
Chipset
Chipset
Versiune
Mărime
Dată
AMD Chipset Driver
For AMD EPYC 7002/ 7003
For AMD EPYC 7002/ 7003
Version : 2.10.09.156
17.22 MB
Mar 05, 2021
sistemul de operare: Windows Server 2016 64bit,Windows Server 2019
AMD Chipset Driver
Version : 2.18.30.202
17.66 MB
Apr 21, 2022
sistemul de operare: Windows Server 2022
LAN
BIOS
Descriere
Versiune
Mărime
Dată
1. Updated Milan AGESA 1.0.0.A
2. Updated Rome AGESA 1.0.0.G
3. Updated Rome Microcode 0830107A for CVE-2023-20593 issue
2. Updated Rome AGESA 1.0.0.G
3. Updated Rome Microcode 0830107A for CVE-2023-20593 issue
Version : M12_R26
35.15 MB
Aug 16, 2023
1. Added H262-ZLB-NJ2 system support
2. Updated IR Version to 8534
2. Updated IR Version to 8534
Version : M10_R23
33.55 MB
Jun 22, 2022
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
Atenţie:
Deoarece rescrierea de BIOS este potential riscantă, dacă nu aveţi probleme folosind versiunea curentă de BIOS, este recomandat să nu rescrieţi BIOS-ul. Rescrieţi BIOS-ul cu atenţie. O rescriere incorecta de BIOS poate rezulta în erori de funcţionare a sistemului.
Ce înseamnă BETA?
BETA descrie o nouă versiune care este stabilă dar care este posibil sa nu includă toate caracteristicile produsului final. În timpul acestei faze testăm noi caracteristici şi adunăm date de la clienţi pentru a ne asigura ca produsele noastre ofera cea mai bună experienţă posibilă.
Deoarece rescrierea de BIOS este potential riscantă, dacă nu aveţi probleme folosind versiunea curentă de BIOS, este recomandat să nu rescrieţi BIOS-ul. Rescrieţi BIOS-ul cu atenţie. O rescriere incorecta de BIOS poate rezulta în erori de funcţionare a sistemului.
Ce înseamnă BETA?
BETA descrie o nouă versiune care este stabilă dar care este posibil sa nu includă toate caracteristicile produsului final. În timpul acestei faze testăm noi caracteristici şi adunăm date de la clienţi pentru a ne asigura ca produsele noastre ofera cea mai bună experienţă posibilă.
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
Utilitar
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Dată
GSM CLI
Version : 2.1.72
147.86 MB
Mar 05, 2024
sistemul de operare: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
sistemul de operare: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
sistemul de operare: Linux,Windows Server 2016 64bit,Windows Server 2019
BMC Restore Default Setting utility
Version : 1.0
0.15 MB
Mar 17, 2020
sistemul de operare: Ubuntu
Firmware
Descriere
Versiune
Mărime
Dată
BMC Firmware with embedded GIGABYTE Management Console
(AST2500 AMI)
(AST2500 AMI)
Version : 12.61.21
105.38 MB
Apr 11, 2024
Engleză
CMC Firmware (AST2520)
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Note: Please make sure the system CMC firmware version is 12.40.19 or later before updating BMC firmware
Version : 12.41.32
82.96 MB
Nov 02, 2023
Engleză
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