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  • Revolution energy saving design with DES Advanced featuring hardware based Dynamic 6-Gear switching
  • Supports 45nm Intel® Core™ 2 multi-core processors with FSB 1600 MHz
  • Supports both DDR2 and DDR3 memory for great flexibility
  • 2 PCI-E 2.0 x16 graphic interface with CrossFireXTM support for ultimate graphics performance
  • 2 Gigabit Ethernet LAN with Teaming functionality
  • DualBIOS solution gives a multiple security to the system
  • Hardware Overvoltage Control IC Provides more voltage control options on CPU, North bridge and memory
  • Blu-ray playback outputs supported by high quality 106dB SNR ALC889A HD audio
(Note) This motherboard is designed with VRD11.1 power phase, and cannot be compatible with VRD10 designed CPU. Please refer to "CPU Support List" for details.
  • Introduction


    Based on the new Intel P45 chipset, GA-EP45C-DS3 delivers a record setting 1600MHz Front Side Bus for the latest Intel® Core 2™ multi-core processors, including 45nm CPUs. In addition, the GA-EP45C-DS3 ultimate scalability with both DDR2 and DDR3 memory support for running next generation applications. GA-EP45C-DS3 is equipped to support ATI CrossFireX™ Technology with dual PCI Express 2.0 x8 interfaces, delivering double the PCI Express bandwidth of 5 Gbit/s for the ultimate in extreme gaming performance. GA-EP45C-DS3 also delivers several advanced GIGABYTE innovations including the DES Advanced, Ultra Durable 2 which provide optimized power savings, ultra cooling for extreme system performance.
  • Qualified for Windows® 7
    The motherboard qualified for WHQL (Windows Hardware Quality Labs) certification of Windows 7 from Microsoft®, setting the standard for future Windows 7 certified motherboards...more
  • Smaller, Faster and More Efficient
    GA-EP45C-DS3 motherboards paired with Intel 45nm CPUs deliver the very best platform for multitasking, multimedia and high performance gaming. Not only do GIGABYTE's latest motherboards based on Intel Eaglelake chipsets all support Intel's new generation, 45nm multi-core processors.
  • Supports both Dual Channel DDR2 and DDR3
    Experience the advanced memory combination technology, featuring ultimate scalability with both DDR2 and DDR3 memory support for running next generation applications with lower power consumption, which delivers superior performance for the most demanding applications.
    * Please refer "Memory Support List" for memory support information
  • PCI-E 2.0 Graphics Interface
    PCI-E 2.0 doubles the bus standard's bandwidth from 2.5 Gbit/s to 5 Gbit/s, meaning a x32 connector can transfer data at up to 16 GB/s in each direction. PCI-E 2.0 also features improvements to the point-to-point data transfer protocol and its software architecture.
  • Multi-display support with ATI CrossFireX™

    ATI® CrossFireX™ delivers the ultimate graphics performance for gaming enthusiasts who demand the highest frame rates without compromising on resolution.


  • Dynamic Energy Saver Advanced
    GIGABYTE Dynamic Energy Saver Advanced provides better energy saving capabilities and enhanced system performance. GIGABYTE Dynamic Energy Saver Advanced is the world’s only motherboard energy saving technology with hardware-based Dynamic 6-Gear* Switching. With support for VRD 11.1, GIGABYTE’s DES Advanced allows the motherboard to switch to 1 Gear phase switching during idle, allowing for a dramatic increase in power savings.

    GIGABYTE has also retooled Dynamic Energy Saver to allow overclockers to experience the benefits of multi-gear power phase switching while overclocking, providing ultra stable, ultra smooth overclocking performance.
    * The 6-Gear feature may vary by model. Gear 1 phase switching requires 45nm processors with PSI signal enabled.


  • High Velocity 2X Bandwidth Boost
    The dual Gigabit LAN with Teaming functionality enabled allows 2 single connections to act as 1 single connection for double bandwidth, improving overall throughput.

    Prevents network downtime by transferring the workload from a failed port to a working port.

    Receive Side Scaling balances the network traffic load evenly between 2 CPU cores in order to improve performance.

    Adjusts power consumption automatically according to your LAN cable lengths, up to 10% power savings.
    (Note) To enable Teaming or Bonding (IEEE 802.3ad Link Aggregation) feature, it is required the connected network switch or router device supports the IEEE 802.3ad LACP standard. Please refer to your network switch or router device manual for further details.
  • Hardware Overvoltage Control ICs
    Hardware Overvoltage Control ICs which provide more voltage control options than before for the CPU North Bridge and memory. The overvoltage controllers also provide hardware linear real-time voltage control. In addition, Hardware Overvoltage Controller ICs also allow for much finer voltage control, allowing power users to adjust voltage in as little increments as 20mV for better overclocking performance.
  • EasyTune6
    GIGABYTE has completely redesigned EasyTune6 from the ground up to make it easier than ever to manage and monitor your hardware resources as well as tweak your system settings in order to achieve maximum system performance. Whether you are an overclocking enthusiast, or a computer novice, EasyTune6 provides the tools you need to quickly and effortlessly fine tune your system.


  • DualBIOS™ - Patented Dual Hardware BIOS Protection
    DualBIOS™ is a GIGABYTE patented technology that automatically recovers BIOS data when main BIOS has crashed or failed. Featuring 2 physical BIOS ROMs integrated onboard, GIGABYTE DualBIOS™ allows quick and seamless recovery from BIOS damage or failure due to viruses or improper BIOS updating.
  • Ultra Durable 2 -Designed with Top Quality Highly Efficient Components


    Ultra Cooling - Low RDS(on) MOSFET Design
    Low RDS(on) MOSFETs specially designed to produce lower switching resistance for faster electric current charging and discharging.

    Ultra Cooling

    Low Power Loss - Ferrite Core Choke Design
    Ferrite core chokes comprised of a compound of iron oxide and other metal elements whose properties hold energy much longer than common iron core at high frequency.

    Low Power Loss





    Longer Life - All-Solid Capacitor Design
    Solid capacitors contain a solid organic polymer, while electrolytic capacitors use a common liquid electrolyte, hence, the terms solid capacitor versus electrolytic capacitors.

    Longer Life

  • 50,000 Hours Japanese Solid Capacitors
    GIGABYTE Ultra Durable motherboards are equipped with solid capacitors developed by leading Japanese manufacturers. With an average lifespan of 50,000 hours, these solid capacitors provide the stability, reliability and longevity essential to meet the power needs of high-end processors and other components running today's most demanding applications and games...more


    * 50000 hours of work time is calculated at 85℃ ambient temperature.
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.