With an extra large 8mm heatpipe and made from a new manufacturing process that narrows the
gap between the heatpipe and
heatsink, the new Direct-Touch Heatpipe II greatly help transfers heat on the MOSFET.
2X Copper PCBs design effectively lower the component temperature by its high thermal
conductivity and low impedance.
Fins-Array II use a new louvered stacked-fins design which not only increases surface area
by 300% compared to
traditional heatsinks but also improves thermal efficiency with better airflow and heat
4. 7.5 W/mK Thermal
By using 1.5mm thicker 7.5 W/mK thermal conductivity pads, it can transfer 4x more heat
compared to traditional thermal
pads in the same time.
5. 3X M.2 Thermal
Enlarged double-sided M.2 heatsink prevents high-speed, large capacity PCIe 3.0 SSDs with
double side flash from
throttling due to overheating.
aDVANCED THERMAL SOLUTION
Unthrottled performance is guaranteed by the enhanced thermal solution that incorporates Fins-Array II, Heatpipe II and
Thermal Guards II. The comprehensive solution delivers excellent heat dissipation. The Z590 AORUS ULTRA stays cool on
VRMs and M.2 SSD even on full loading, making it most suitable for enthusiasts, overclockers and professional gamers.