Blade Server - AMD EPYC™ 9006 SP7 Server Processors - 6U 10-Node DP 20-Bay E3.S Gen6 NVMe DLC - B685-D80-LS1

1/6

B685-D80-LS1

Blade Server - AMD EPYC^™ 9006 SP7 Server Processors - 6U 10-Node DP 20-Bay E3.S Gen6 NVMe DLC

HPC Networking Hybrid/Private Cloud Server

Integrated-manifold full-system DLC solution
6U 10-node front access server system
Dual AMD EPYC^™ 9006 SP7 Server processors per node
16-Channel liquid-cooled DDR5 RDIMM/MRDIMM per CPU with 32 x DIMMs per node
2 x liquid-cooled E3.S Gen6 NVMe bays per node
3 x liquid-cooled LP PCIe Gen6 x16 slots per node
7+5 3200 W 80 PLUS Titanium redundant power supplies

Ordering Numbers: 6NB685D80HR000LS1*

Compare

Save

Quote

6th Generation AMD EPYC™ Processors for SP7 Socket

DDR5 channels

Delivering up to 1.6TB/s memory bandwidth in 1DPC (MRDIMMs)

Up to 256

CPU cores

More VMs per rack and more tasks done with less real estate

Zen6 & Zen6c

Cores

Optimized core package to achieve high frequency or high density

CXL 3.1

Support

Multi-host memory sharing and P2P over fabric at double data rate

PCIe Gen6

Lanes

2x per-lane bandwidth vs Gen5, for next-gen GPUs, NICs, and storage

2nm

Architecture

Smaller process node boosts core density and efficiency per watt

Select GIGABYTE for the AMD EPYC™ 9006 Platform

High Performance

Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding workloads such as high frequency training and scientific simulation.

Advanced Cooling

GIGABYTE's cooling solutions utilize diverse technologies and system designs, purpose built to keep demanding workloads performing at their peak.

Fast and Stable Connectivity

Keeping pace with the challenges for next gen technology, GIGABYTE boards provide users the signal integrity for PCIe 6.0 speeds and I/O flexibility.

Optimal Price

A broad portfolio tailored to specific applications lets customers select only the features a workload needs, keeping total cost of ownership down.

Memory Bandwidth

GIGABYTE boards support the maximum 32-channel DDR5 subsystem EPYC 9006 offers running at up to 12800 MT/s (MRDIMMs). Expertly crafted layouts ensure bandwidth remains stable under heavy workloads.

B685-D80-LS1 Block Diagram

System Management

Enhanced HPC & AI Management with AST2700

The AST2700 delivers increased performance and efficiency over previous generations. It is built to support high-density multi-node HPC and AI systems, with enhanced CMC to BMC communication reducing retransmissions and IPMB signal interference. In addition, it comes equipped with the management and diagnostic tools operators need to recover quickly when issues arise.

Firmware rollback across the last five BMC and BIOS versions
Dual OS ISO storage for remote recovery and Virtual Media installation
Full BMC process logging for diagnostics

Hardware Security

Optional TPM 2.0 Module

For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.

Power Efficiency

Integrated Manifold Full-System DLC

A full-system direct liquid cooling solution with an integrated manifold design, supporting up to 92% Heat Capture Ratio (HCR). This architecture enables:

Reduced fan dependency
Lower air-conditioning demand
Improved Power Usage Effectiveness (PUE)
Higher computing stability and rack density

45°C Warm Water Cooling

Supports inlet coolant temperatures up to 45°C, improving overall cooling efficiency while minimizing condensation risk. Enables stable performance scaling even in environments with limited cooling capacity.

User Friendly

Flexible and Resilient Management Architecture

The integration of CMC technology and auto-IP detection enables seamless switching between star and resilient ring topologies for maximum deployment flexibility. The bi-directional ring design significantly enhances cluster stability by automatically rerouting traffic upon failure to ensure uninterrupted oversight and self-healing connectivity across the remaining nodes.

Star Topology Example

Ring Topology Example

High Availability

Smart Ride Through (SmaRT)

To prevent server downtime and data loss as a result of loss of AC power, GIGABYTE implements SmaRT in all our server platforms. When such an event occurs, the system will throttle while maintaining availability and reducing power load. Capacitors within the power supply can supply power for 10-20ms, which is enough time to transition to a backup power source for continued operation.

Smart Crises Management and Protection (SCMP)

SCMP is a GIGABYTE patented feature which is deployed in servers with non-fully redundant PSU design. With SCMP, in the event of faulty PSU or overheated system, the system will force the CPU into an ultra-low power mode that reduces the power load, which prevents the system from unexpected shutdown and avoids component damage or data loss.

Dual ROM Architecture

If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version.

Specifications

Dimensions (WxHxD, mm)

6U 10-Node - Front access
447 x 262.3 x 900

Motherboard

MD85-HD0

CPU

AMD EPYC^™ 9006 SP7 Server processors

^[DLC]Dual processors per node, PPT up to 500 W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

20 x LGA 7536
Socket SP7

Chipset

Integrated into SoC

Memory

^[DLC]32 x DIMM slots per node
Support DDR5 RDIMM/MRDIMM^[1]
16-Channel memory per processor

RDIMM: Up to 8000 MT/s
MRDIMM: Up to 12800 MT/s

^[1]MRDIMMs are supported only on select CPU SKUs.

LAN

Front:
1 x Management LAN per node

Rear (MLAN board):
2 x Chassis Management LAN^[1]

^[1]Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.

Video

Integrated in ASPEED^® AST2700
- 1 x Mini-DP per node

Storage

Front:
^[DLC]2 x E3.S Gen6 NVMe per node, from CPU_0

PCIe Expansion Slots

^[DLC]2 x LP x16 (Gen6 x16) per node, from CPU_0
^[DLC]1 x LP x16 (Gen6 x16) per node, from CPU_1

Front I/O

Per node:
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
1 x MLAN port
1 x Power button with LED
1 x System status LED
1 x ID LED

Rear I/O

MLAN board:
2 x CMC ports
1 x CMC status LED

Security Modules

1 x TPM header with SPI interface per node
- Optional TPM 2.0 kit: CTM012

Power Supply^[#1]

7+5 3200 W 80 PLUS Titanium redundant power supplies^[1]

AC Input:
- 100-127V~, 16A, 50-60Hz
- 200-220V~, 16A, 50-60Hz
- 220-240V~, 16A, 50-60Hz

DC Input: (Only for China)
- 240Vdc, 16A

DC Output:
- Max 1300W/ 100-127V~
+12.2V/ 106.6A
+12.2Vsb/ 3A
- Max 3000W/ 200-220V~
+12.2V/ 246A
+12.2Vsb/ 3A
- Max 3200W/ 220-240V~ or 240Vdc Input
+12.2V/ 262.3A
+12.2Vsb/ 3A

^[1]The system power supply requires C19 power cord.

System Fans

4 x 80x80x80mm

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)

^[Note]To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 45°C.

Weight

Net Weight: 92 kg
Gross Weight: 103 kg

Packaging Dimensions

1300 x 800 x 533 mm

Packaging Content

1 x B685-D80-LS1
10 x Cold plates
1 x Mini-DP to D-Sub cable
1 x L-shape Rail kit

Part Numbers

- Barebone package: 6NB685D80HR000LS1*
- Motherboard: 9MD85HD0ID-000*
- L-shape Rail kit: 25HB2-UM6100-K0R

[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.

[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.

[#3] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.

[#4] All trademarks and logos are the property of their respective owners.

Support

Description	Version	Size	Date

B685-D80-LS1

6th Generation AMD EPYC™ Processors for SP7 Socket

Select GIGABYTE for the AMD EPYC™ 9006 Platform

High Performance

Advanced Cooling

Fast and Stable Connectivity

Optimal Price

Memory Bandwidth

B685-D80-LS1 Block Diagram

System Management

Hardware Security

Power Efficiency

Integrated Manifold Full-System DLC

45°C Warm Water Cooling

User Friendly

Flexible and Resilient Management Architecture

Star Topology Example

Ring Topology Example

High Availability

Smart Ride Through (SmaRT)

Smart Crises Management and Protection (SCMP)

Dual ROM Architecture

Specifications

Support

Related Resources