Specifications
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 695
Motherboard
MZ12-HD0 Rev. 3.0
CPU
AMD EPYC™ 7003 Series Processors
AMD EPYC™ 7002 Series Processors
Single processor per node, cTDP up to 240W
- At 30°C ambient, cTDP up to 280W
[Note] M.2 devices not supported if using 280W CPU.
Socket
4 x LGA 4094
Socket SP3
Memory
32 x DIMM slots
DDR4 memory supported
8-Channel memory per processor
RDIMM/LRDIMM: Up to 3200 MT/s
LAN
Rear:
8 x 1Gb/s LAN (4 x Intel® I350-AM2)
- Support NCSI function
4 x 10/100/1000 Mbps Management LAN
1 x CMC port
Video
Integrated in ASPEED® AST2500 x 4
- 4 x VGA ports
Storage
Front hot-swap:
24 x 2.5" Gen3 NVMe/SATA/SAS [1]
Internal M.2:
8 x M.2 (2242/2260/2280/22110), PCIe Gen3 x4 [1]
[1] CPU TDP is limited to 155W when using M.2 drives.
SAS
Require SAS add-in cards
RAID
Require RAID add-in cards
PCIe Expansion Slots
4 x LP x16 (Gen4 x16)
4 x LP x16 (Gen3 x16)
4 x OCP 2.0 mezzanine (Gen3 x16)(Type1, P1, P2, P3, P4)
- Support NCSI function
Front I/O
4 x Power buttons with LED
4 x ID buttons with LED
4 x System status LEDs
1 x CMC status LED
Rear I/O
8 x USB 3.0 ports (Type-A)
4 x VGA ports
8 x RJ45 ports
4 x MLAN ports
4 x ID LEDs
1 x CMC port
Backplane Board
Speed and bandwidth:
PCIe Gen3 x4 or SATA 6Gb/s or SAS 12Gb/s
Security Modules
1 x TPM header with SPI interface
-
Optional TPM2.0 kit:
CTM010Power Supply[#1]
Dual 2000W 80 PLUS Platinum redundant power supply
AC Input:
- 100-127V~/ 12A, 47-63Hz
- 200-219V~/ 10A, 47-63Hz
- 220-240V~/ 10A, 47-63Hz
DC Input: (Only for China)
- 240Vdc/ 10A
DC Output:
- Max 1000W/ 100-127V~
+12V/ 83A
+12Vsb/ 3A
- Max 1800W/ 200-219V~
+12V/ 148A
+12Vsb/ 3A
- Max 1968W/ 220-240V~ or 240Vdc Input
+12V/ 162A
+12Vsb/ 3A
System Management
ASPEED
® AST2500 Baseboard Management Controller
ASPEED
® AST2520 Chassis Management Controller
GIGABYTE Management Console web interface
- Dashboard
- JAVA Based Serial Over LAN
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Citrix Hypervisor 8.2.0 or later
Red Hat Enterprise Linux 8.3 or later
Red Hat Enterprise Linux 9.0 or later
SUSE Linux Enterprise Server 12 SP5 or later
SUSE Linux Enterprise Server 15 SP2 or later
Ubuntu 18.04.5 LTS or later
Ubuntu 20.04 LTS or later
Ubuntu 22.04 LTS or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
VMware ESXi 8.0 or later
Windows Server 2016 (X2APIC/256T not supported)
Windows Server 2019
Windows Server 2022
System Fans
8 x 80x80x38mm (16,300rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 25.2 kg
Gross Weight: 43.6 kg
Packaging Dimensions
1167 x 700 x 309 mm
Packaging Content
1 x H252-Z10
4 x CPU heatsinks
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH252Z10MR-00-A*
- Motherboard: 9MZ12HD0NR-00*
- 3-Section Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320J-A0R
- Backplane board - CBPH0O4: 9CBPH0O4NR-00*
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power supply: 25EP0-220008-D0S
Optional parts:
- Power cord 125V/15A (JP): 25CPA-018304-Q0R
- M.2 expansion card - CMTP051: 9CMTP051NR-00*
- Ring topology kit: 6NH262Z65SR-00-100
- RMA packaging: 6NH252Z10SR-RMA-A100
[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical interface values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.