Liquid Cooling | 液體冷卻

  • 液體冷卻是什麼?
    顧名思義,液體冷卻(liquid cooling)是以液體作為熱能傳導機制的散熱方式。市面上常見的兩種伺服器專用液體冷卻技術,分別為直接液冷(DLC),或稱直達晶片(D2C)液冷;以及浸沒式液冷(immersion cooling),而這類別又可分為單相浸沒式液冷與兩相浸沒式液冷。若想了解關於技嘉科技的浸沒式液冷解決方案,可直接參考我們的專屬詞彙,或是前往浸沒式液冷解決方案的專屬網頁

    直接液冷幫伺服器解熱的方法,是將裝滿冷卻液的密封管線(或稱封閉式冷卻迴路)環繞在伺服器內最容易發熱的關鍵零組件附近,零組件透過導熱銅片(或稱「冷板」)將熱能傳導到冷卻液,然後,冷卻液沿著管線流出伺服器,透過熱交換器進行散熱,最終流回伺服器內繼續使用。

    如果將熱交換器安裝在伺服器機櫃內,把熱能排放到空氣中,這是液冷技術中所謂的「液對氣」方案,優點在於液冷式伺服器能直接部署在氣冷式的資料中心使用。所謂的「液對液」方案,則是將冷卻液傳送到伺服器機房的液體冷卻管線,透過設施的冷卻管路與散熱機制統一排熱;強項在於解熱功力比「液對氣」方案更勝一籌,限制在於機房設計必須提供液體冷卻管線,也就是說,這必須是專為液冷伺服器所設計的特殊機房。

  • 為何需要?
    液體相較於傳統空氣冷卻熱傳導方面更有效率,故常常使用在一些高速運作發熱量較高的機器上,尤其是資料中心、或是進行大量高效能運算(HPC)人工智慧(AI)數位分生(digital twin)伺服器當中。相較於氣冷式伺服器需要使用風扇協助散熱,去除風扇模組和省卻熱流設計得到的空間提升,便可大幅增加CPU、GPU密度,在有限空間內增加更多的運算效能,降低能耗的同時就表示可以得到更好的電力使用效率(PUE)值,並且能保護伺服器產品,不讓其超過指定的熱設計功耗(TDP),增強伺服器的可靠程度、可用性,甚至能提升晶片運算效能。

  • 技嘉的特色
    技嘉科技與合作夥伴提出了多樣性的伺服器冷卻解決方案,從單相浸沒式液冷兩相浸沒式液冷,到直接液冷,針對不同客戶提供最符合需求的冷卻方案,擴充運算力同時,也能邁向節能減碳的綠色運算理想境界。

    使用技嘉直接液冷解決方案的成功案例,包括德國航太中心運用超融合基礎架構伺服器(HCI)系列中的H261-Z60高密度伺服器產品,建造新的運算叢集,該系統中的最大運算力,相較目前市場上其他產品多了兩倍效能,使資料中心的使用面積減少50%,在有限空間內滿足航太中心的高運算及高速儲存需求,並採用 CoolIT液冷設備,在均溫40°C的環境,不開空調降溫也能維持穩定運作,為航太中心設計出絕佳的機房冷卻解決方案。

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    [Video] GIGABYTE Server Liquid Cooling Solutions

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    [Video] GIGABYTE Server Liquid Cooling Solutions

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