H223-Z10
(rev. AAP1)

High Density Server - AMD EPYC™ 9004 - 2U 3-Node UP 6-Bay E1.S Gen4 NVMe

# Edge # Hybrid/Private Cloud Server

2U 3-node front access server system
AMD EPYC™ 9004 Series processors
AMD EPYC™ 9004 Series processors with AMD 3D V-Cache™ Technology
Single processor per node, 5nm technology
12-Channel RDIMM DDR5 per processor, 36 x DIMMs
Dual ROM Architecture
2 x CMC ports
6 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
3 x FHHL PCIe Gen5 x16 slots
3 x LP PCIe Gen5 x16 slots
3 x OCP 3.0 Gen5 x16 slots
1+1 3000W 80 PLUS Titanium redundant power supplies

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* Materialele oferite aici sunt doar pentru referinţă. GIGABYTE îşi rezervă dreptul de a modifica sau revizui continutul oricând fără notificare prealabilă.
* Perfomanţa prezentată este bazată pe valorile teoretice maxime ale interfeţei de la vendorii respectivi de Chipset-uri sau de la organizaţiile ce au definit specificaţiile interfeţei. Perfomanţele reale pot varia în funcţie de sistem.
* Toate mărcile inregistrate şi logo-urile sunt proprietatea deţinătorilor respectivi.
* Datorită arhitecturii standard PC, o anumită cantitate de memorie este rezervată pentru sistem şi de aceea mărimea actuală a memoriei este mai mică decât cea indicată.

SPECIFICATIONS

Dimensions (WxHxD, mm)

2U 3-Node - Front access
447.8 x 87.5 x 500

Motherboard

MZ13-HD0

CPU

AMD EPYC™ 9004 Series processors
AMD EPYC™ 9004 Series processors with AMD 3D V-Cache™ Technology
Single processor, 5nm technology
*Up to 128-core, 256 threads per processor
cTDP up to 240W at ambient 35°C

cTDP up to 300W at ambient 30°C

*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.

Socket

Per Node:
1 x LGA 6096

Total:
3 x LGA 6096

Socket SP5

Chipset

System on Chip

Memory

Per node:
12 x DIMM slots

Total:
36 x DIMM slots

DDR5 memory supported only
12-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz

LAN

Total:
2 x CMC ports

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed^® AST2520A2-GP

Storage

Per node:
2 x 9.5mm E1.S Gen4 NVMe hot-swappable bays

Total:
6 x 9.5mm E1.S Gen4 NVMe hot-swappable bays

SAS

N/A

RAID

N/A

Expansion Slots

Per node:
Riser Card CRSH01Q:
- 1 x PCIe x16 (Gen5 x16) low-profile slot

Riser Card CRSH01R:
- 1 x PCIe x16 (Gen5 x16) FHHL slot

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth
Supports NCSI function

Optional 1 x M.2 slot (CMTP192):
- M-key
- PCIe Gen4 x4
- Supports 2280/22110 cards

Total:
Riser Card CRSH01Q x 3:
- 3 x PCIe x16 (Gen5 x16) low-profile slots

Riser Card CRSH01R x 3:
- 3 x PCIe x16 (Gen5 x16) FHHL slots

3 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth
Support NCSI function

Optional 3 x M.2 slots (CMTP192):
- M-key
- PCIe Gen4 x4
- Support 2280/22110 cards

Internal I/O

Per node:
1 x TPM header

Front I/O

Per node:
2 x USB 3.2 Gen1
1 x VGA
1 x Power button with LED
1 x ID LED
1 x System status LED

Total:
6 x USB 3.2 Gen1
3 x VGA
3 x Power buttons with LED
3 x ID LEDs
3 x System status LEDs
2 x CMC ports
1 x CMC status LED

Rear I/O

N/A

Backplane Board

Speed and bandwidth:
PCIe Gen4 x4

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Power Supply

1+1 3000W 80 PLUS Titanium redundant power supplies

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input:
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+ 12.2V/ 81A
+ 12Vsb/ 3A
- Max 2600W/ 200-220V~
+ 12.2V/ 213A
+ 12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+ 12.2V/ 245A
+ 12Vsb/ 3A

Note: The system power supply requires C19 power cord

System Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS / BMC / CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

4 x 80x80x38mm (18,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 17.4 kg
Gross Weight: 28.4 kg

Packaging Dimensions

857 x 670 x 280 mm

Packaging Content

1 x H223-Z10
3 x CPU heatsinks
1 x L-shape Rail kit

Part Numbers

- Barebone package: 6NH223Z10DR000AAP1*
- Motherboard: 9MZ13HD0UR-000
- L-shape Rail kit: 25HB2-A86105-K0R
- CPU heatsink: 25ST1-553202-A0R
- Front panel board - CFPH030: 9CFPH030NR-00
- Backplane board - CBP2060: 9CBP2060NR-00
- Fan module: 25ST2-88382V-S1R
- Riser card - CRSH01Q: 9CRSH01QNR-00
- Riser card - CRSH01R: 9CRSH01RNR-00
- EDSFF Riser card - CSPP010: 9CSPP010NR-00
- LAN bridge board - CLSH13: 9CLSH13NR-00
- Power Supply: 25EP0-23000F-G1S

Optional parts:

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 expansion card - CMTP192: 9CMTP192NR-00
- RMA packaging: 6NH223Z10SR-RMA-A100

SUPPORT

Descărcări

Driver
BIOS
Utilitar
Firmware

Manual
Listă compatibilitate

Online Support

Driver

BIOS

Utilitar

Firmware

QVL

All
All
Windows Server 2022
Windows Server 2019
Linux

Chipset

Versiune

Mărime

Dată

AMD Chipset Driver

Version : 4.06.27.500

16.58 MB

Nov 11, 2022

H223-Z10 (rev. AAP1)

SPECIFICATIONS

SUPPORT

RESOURCES

H223-Z10 (rev. AAP1)

H223-Z10
(rev. AAP1)