H253-Z10
(rev. AAP1)

High-Density Server - AMD EPYC™ 9004 - 2U 4-Node UP 8-Bay E1.S Gen4 NVMe
  • 2U 4-Node front access server system
  • AMD EPYC™ 9004 Series processors
  • AMD EPYC™ 9004 Series processors with AMD 3D V-Cache™ Technology
  • Single processor per node, 5nm technology
  • 12-Channel RDIMM DDR5 per processor, 96 x DIMMs
  • Dual ROM Architecture
  • 8 x 1Gb/s LAN ports (Intel® I350-AM2)
  • 4 x Dedicated management ports
  • 2 x CMC ports
  • 8 x E1.S Gen4 NVMe hot-swappable bays
  • 12 x M.2 slots with PCIe Gen5 x4 and SATA interface
  • 4 x LP PCIe Gen5 x16 slots
  • 4 x OCP 3.0 Gen5 x16 slots
  • Dual 3000W 80 PLUS Titanium redundant power supply
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* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
2U 4-Node - Front access
447 x 86.8 x 902
Motherboard
MZ13-SH0
CPU
AMD EPYC™ 9004 Series processors
AMD EPYC™ 9004 Series processors with AMD 3D V-Cache™ Technology
Single processor, 5nm technology
*Up to 128-core, 256 threads per processor
cTDP up to 300W at ambient 35°C

*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.
Socket
Per Node:
1 x LGA 6096

Total:
4 x LGA 6096

Socket SP5
Chipset
System on Chip
Memory
Per node:
24 x DIMM slots

Total:
96 x DIMM slots

DDR5 memory supported only
12-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz (1DPC), 3600 MHz (2DPC)
LAN
Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
Support NCSI function

1 x Dedicated management port

Total:
8 x 1GbE LAN ports (4 x Intel® I350-AM2)
Support NCSI function

4 x Dedicated management ports
2 x CMC ports

*Spanning Tree Protocol (STP) must be enabled in LAN switch function if using ring topology.
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
2 x 9.5mm E1.S Gen4 NVMe hot-swappable bays

Total:
8 x 9.5mm E1.S Gen4 NVMe hot-swappable bays
SAS
N/A
RAID
N/A
Expansion Slots
Per node:
Riser Card CRSH01Q:
- 1 x PCIe x16 (Gen5 x16) low-profile slot

1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth
Supports NCSI function

1 x M.2 slot:
- M-key
- PCIe Gen5 x4
- Supports 2280/22110 cards

2 x M.2 slots:
- M-key
- SATAIII via ASM1062R
- Support 2280 cards
- Support Hardware RAID 0/1

Total:
Riser Card CRSH01Q x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots

4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth
Support NCSI function

4 x M.2 slots:
- M-key
- PCIe Gen5 x4
- Support 2280/22110 cards

8 x M.2 slots:
- M-key
- SATAIII via ASM1062R
- Support 2280 cards
- Support Hardware RAID 0/1
Internal I/O
Per node:
1 x COM
1 x TPM header
Front I/O
Per node:
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button

Total:
8 x USB 3.2 Gen1
4 x Mini-DP
8 x RJ45
4 x MLAN
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
Rear I/O
2 x CMC ports
Backplane Board
N/A
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
Dual 3000W 80 PLUS Titanium redundant power supply

AC Input:
- 100-127V~/ 15.5A, 50-60Hz
- 200-220V~/ 15.5A, 50-60Hz
- 220-240V~/ 15.5A, 50-60Hz

DC Input:
- 240Vdc/ 15.5A

DC Output:
- Max 1000W/ 100-127V~
+ 12.2V/ 81A
+ 12Vsb/ 3A
- Max 2600W/ 200-220V~
+ 12.2V/ 213A
+ 12Vsb/ 3A
- Max 3000W/ 220-240V~ or 240Vdc Input
+ 12.2V/ 245A
+ 12Vsb/ 3A

Note: The system power supply requires C19 power cord
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x80mm (16,500rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 29.4 kg
Gross Weight: 46.8 kg
Packaging Dimensions
1180 x 779 x 300 mm
Packaging Content
1 x H253-Z10
4 x CPU heatsinks
1 x L-shape Rail kit
Part Numbers
- Barebone package: 6NH253Z10DR000AAP1*
- Motherboard: 9MZ13SH0UR-000
- L-shape Rail kit: 25HB2-A86104-K0R
- CPU heatsink: 25ST1-553202-A0R
- Fan module: 25ST2-888020-S1R
- Riser card - CRSH01Q: 9CRSH01QNR-00
- EDSFF Riser card - CRSH01X: 9CRSH01XNR-00
- CMC module - CMBH42: 9CMBH42NR-00
- Power Supply: 25EP0-23000H-G1S

Optional parts:

- E1.S Latch with dummy tray (24 in 1): 6NH253Z10S1000AAP11
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- RMA packaging: 6NH253Z10SR-RMA-A100
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SUPPORT

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Linux
網路介面
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.

什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.74
147.86 MB
Mar 05, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
使用手冊
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檔案大小
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