GIGABYTE Unleash AMD X570S Series Motherboards with Extreme Silent Cooling
Integrated up to 16 phases direct digital power design with four PCIe 4.0 M.2 for high performance, silence, and stability.
Jun 17, 2021

June 17th, 2021 – GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the launch of the newest X570S AORUS series motherboards primed to unleash the potential of the recently released AMD Ryzen™ 5000 series desktop processors with enhanced DrMOS direct power design and 6 layers and above ultra cool PCB for higher stability. The whole series equip with a brand new passive chipset thermal design and up to four sets of high thermal efficiency armored PCIe 4.0 M.2 slots with M.2 Thermal Guard III, which ensures effective heat dissipation of full operation on chipsets and 7000MB/s high speed operating on NVMe SSDs without throttling by overheating. The brand new X570S series motherboards kick off the PCIe 4.0 era with extensive feature sets. The flagship X570S AORUS MASTER motherboard is fitted with a 16-phase direct digital power design for the more solid power management and optimized overclocking performance. With advanced heat dissipation technology of Fins-Array II Stacked Fins Heatsink, Direct Touch Heatpipe II and Smart Fan 6, GIGIABYTE X570S motherboards can maintain cool and high performance under high loading operation. Furthermore, GIGABYTE Active OC Tuner technology integrated in select motherboards to provide a more flexible performance improvement.

“AMD is excited for the launch of new and innovative X570 motherboards, bringing even more offerings to the AMD socket AM4 platform,” said Chris Kilburn, corporate vice president and general manager, client component business unit, AMD. “These new motherboards will continue to showcase the groundbreaking performance of the AMD Ryzen™ 5000 Series processors, maximizing the potential for enthusiasts, gamers, and content creators alike.”

The entire X570S lineup integrates a 2.5 GbE high speed LAN while select X570S AORUS motherboards feature WIFI 6 with blazing fast 2.4 Gbps connection speeds, and even WIFI 6E 802.11ax wireless network, as well as front USB 3.2 Type-C® interface for more convenient usage. Moreover, select X570S AORUS motherboards equip USB 3.2 Gen 2x2 Type-C® for a more speedy data transfer up to 20 Gbps. GIGABYTE also release X570S AERO G for creators. With built-in the same level power materials, thermal planning, high-speed network, and 4 sets of PCIe 4.0 M.2 interfaces as other X570S motherboards, X570S AERO G also features the VisionLINK function that is well-received by the creators to provide them a more effective transform from ideas to creation.

“Providing users with the best product has always been Gigabyte’s mission, while the top-quality AMD platform motherboards with excellent compatibility, high efficiency and low temperature demonstrates our strong strength in the development of AMD motherboards. “said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division. “ GIGABYTE’s X570S series motherboards are developed by gamers and professional designers who pursue performance, and are enhanced by the features of 16-phase direct digital power design, advanced VRM thermal design, silent cooling design without chipset fan, several PCIe 4.0 interfaces, blazing fast LAN, updated BIOS, and R&D’s adjustment. This series definitely impress the performance chaser by the performance and stability and become the perfect choice for high-end users who plans to assemble AMD platforms. ”

Silent Thermal Design Demonstrates The Strong Hardware Design Power
With optimized hardware layouts design, GIGABYTE X570S motherboards equip with enlarged-surface chipset heatsink which enable the lineup upgrading to passive thermal design while maintain the same heat dissipation efficiency. This passive thermal design solve the noise problem of the X570 chipset fan, and further avoid dusting of the cooling fan which proves again GIGABYTE’s leading role in the industry. The X570S motherboards features several optimized thermal designs of Fins-ArrayII, Direct Touch Heatpipe II, exclusive M.2 Thermal Guard III with doubled-thickness and double-sided heighten heatsinks on the M.2 SSD, which can boost thermal performance in a silent way. Further enhanced by Hybrid fans, multiple temperature detections, dual fan curves of 7-phase adjustment modes, and smart fan control of Smart Fan 6 Technology, promising the processor, VRM, chipset, or even the highest speed of 7000MB/s Gen4 M.2 SSD with no throttling or performance reduce by overheating.

Enhanced Stability Of Power Supply And The Convenience Of Dynamic Overclocking
In addition to the improvements on thermal design, GIGABYTE also greatly enhanced the power supply design of the X570S motherboards to perfectly release the ultimate performance of AMD Ryzen™ 5000 series processors. GIGABYTE packs at least 14 phases digital power design on each ATX board in X570S AORUS Series. Applying to different requests of power consumption, GIGABYTE uses MOSFETs of upmost 90A Smart Power Stage or DrMOS to ensure a more stable current flow, better power and thermal management while the CPU is running at its full potential, which can perfectly unleash the extreme performance and overclocking power of processors.

The high-end model X570S AORUS MASTER boasts a 16-phase direct digital power design with each Power Stage phase capable of managing up to 70A for lower impedance and improved loading balance of power phases, just like the flagship model X570 AORUS XTREME motherboard. With 16-phase to work with, the power demand is evenly processed by each phase to avoid long-time high loading operation of one single phase with further reduction of the heat and power consumption. This improve the overall power efficiency, durability and service life of the motherboard, which enabling users to maximize the overclocking potential on the AMD Ryzen™ 5000 desktop processors without the concerns of overclocking failures or diminished performance caused by unstable or overheated power supply.

X570S AORUS MASTER, AORUS PRO AX and AERO G models are particularly equipped with GIGABYTE’s newly developed the Active OC Tuner active overclocking technology. The CPU overclocking frequency and the number of operating cores can be dynamically switched between the default precise-overclocking function PBO (Precision Boost Overdrive) and manual overclocking according to different requirements of current configuration and characteristics of running applications. This technology allows user to execute corresponding application by frequency and core numbers to enjoy the maximum performance. Users have no need to confirm the loading or whether it requires multi-cores before running different applications then struggle in the BIOS to switch between PBO and manual overclocking. With GIGABYTE Active OC Tuner active overclocking technology, users can have it both ways once they activate this function to enjoy the advantages of optimized automatic overclocking settings and an more enjoyable system operation with ease.

Storage Performance Boost By Advanced PCIe 4.0 Interface
GIGABYTE X570S AORUS motherboards boast the performance potential of PCIe 4.0 and refine the design of its motherboards to elevate the performance of peripheral components. Design features such as 6-layer and above, 2x copper PCBs with lower inductance, and a PCIe 4.0 B-CLK IC on select model to maximize the PCIe bandwidth with increasing the data transmission capacity on PCIe storage devices and boosting overclocking performance from CPUs and memory. The motherboards unlock hidden performance potential on peripheral components, allowing for blazing fast transmission speeds on these devices. GIGABYTE X570S lineup makes capital out of the PCIe 4.0 interface from the CPU and X570 chipsets, with four PCIe 4.0 M.2 slots on select models, four sets of AORUS 7000S SSDs can operate synchronizely by building a RAID array for impressive storage performance. Enhanced M.2 Thermal Guards III also successfully reduce the chances of thermal throttling and allow users to fully take advantage of the new PCIe 4.0 interface.

More Flexible Ethernet and WIFI Network With Easier High-Speed Transfer Expansions
The entire X570S lineup offers a 2.5 Gbps Ethernet connection speeds for gamers to have the faster and more stable wired network connectivity. All WIFI enabled models in the lineup feature the Intel® Wi-Fi 6 802.11ax standard which delivers blazing fast 2.4 Gbps connection speeds that almost rival the 2.5 Gbps Ethernet connection speeds. X570S AORUS MASTER further builds in Intel® Wi-Fi 6E 802.11ax network with 6 GHz frequency bands for a smoother connections. With both high-speed Ethernet and WIFI, users have extra flexibility and ridiculously fast connection speeds. X570S lineup also integrates front USB 3.2 Type-C® interface for enhanced convenience while select AORUS X570S series motherboards adopt USB 3.2 Gen 2x2 Type-C® with up to 20 Gbps bandwidth for ultrafast transfer speed. With GIGABYTE VISION DRIVE 1TB external SSD, users can get the full benefit from this high-speed transmission.

Fan favorite and well-received features make their return to GIGABYTE X570S motherboards. Sleek aesthetics design, RGB Fusion LED lighting, Ultra durable quality, Hi-Fi audio, and many more trademark features have been further refined and added to the mix with AMD’s built-in features. The entire X570S lineup comes with the newest version of Q-Flash Plus Technology. Users can easily update the BIOS without even installing a processor, memory, graphics cards, or booting up the PC so they can flash the BIOS and have no worries about not being able to boot up the system due to an unsupported BIOS version.

The Innovative X570S AERO G For Creators
GIGABYTE integrated the AERO and VISION products for creators into the AERO series to integrate product series names and increase market focus, as well as maximizing brand management and consumer product marketing strategies. Starting from the AMD platform, X570S AERO G will be released concurrently as X570S series, and the VISION series will become a part of AERO.

The new X570S AERO G adopts 14 phases all-digital power supply of high-quality Intersil PWM controller with 60 Amps per phase DrMOS design, and equips with the new fully covered heat sink of twice heat dissipation area to provide more stable and ultra cool power supply. X570S AERO G features full functions exclusive for creators, with four sets of thermal-armored PCIe 4.0 M.2 slots, promising no throttling under the overheat by heavy operation. X570S AERO G also adopts renowned VisionLINK technology, which allows for data and video transmission based on USB Type-C® cable and provides pen displays power delivery up to 60W. VisionLINK technology brings the benefit of easy data transfer and convenient power charging to creators without cable clutter, which save them more time and effort for the content creation. Meanwhile, the features of 2.5 GbE Ethernet, Intel® Wi-Fi 6 802.11ax wireless network, USB 3.2 Gen 2x2 Type-C®, front Type-C® interface, and Active OC Tuner technology enable a great improvement on work efficiency for creators.

GIGABYTE X570S series motherboards use only the finest components reinforced by GIGABYTE Ultra Durable™ Technology with comprehensive functions. This series become the excellent choice for users seeking to build a high-end PC system and enjoy the GIGABYTE’s exclusive technologies have to offer. Interested in learning more about the X570S lineup? Please visit the official website for more information!

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