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Server motherboards for demanding applications come in form factors: EEB/E-ATX/ATX/microATX/mini-ITX.

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Compute, Storage, and Networking are possible in high density, multi-node servers at lower TCO and greater efficiency.

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Ensure peak performance in all configurations. Adopt direct-to-chip liquid cooling for the rising AI/HPC era.

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Address rising server heat with submerged cooling. Embrace next-gen liquid cooling for improved TCO and PUE.

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Arm architecture servers will compete in Cloud to Edge as they tackle compute-bound workloads.

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Processing power, large amounts of data, fast networking, and accelerators all bundle into a scale out ready HPC and/or AI server solution.

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Systems that do visual applications from computer graphics to computer animation rely on visual computing servers.

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Processing power, large amounts of data, fast networking, and accelerators all bundle into a scale out ready HPC and/or AI server solution.

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Securely manage the use of files and applications for office environments while storing large amounts of data.

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Real time data processing at the source is required for edge computing with reduced latency for Internet of Things (IoT) and 5G networks as they use cloud.

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3U Server

Real time data processing at the source is required for edge computing with reduced latency for Internet of Things (IoT) and 5G networks as they use cloud. Edge servers are deployed in locations that demand smaller chassis servers, and these servers are under 500mm in depth.

Applications Include :
Real-time monitoring
Live UHD Video Streaming
IoT Devices
Autonomous Vehicles

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R292

Model R292-4S1 / R292-4S0

Form Factor 2U

CPU Type 3rd Gen Intel Xeon Scalable

DIMM Slots 48

LAN Speed 10Gb/s

LAN Ports 2

Drive Bays 10 x 2.5"

PSU Dual 3200W

Form Factor CPU Type DIMM Slots LAN Speed LAN Ports Drive Bays PSU

R292-4S1 2U 3rd Gen Intel Xeon Scalable 48 10Gb/s 2 10 x 2.5" Dual 3200W

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R292-4S0 2U 3rd Gen Intel Xeon Scalable 48 10Gb/s 2 10 x 2.5" Dual 3200W

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