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H263-V11
(rev. LAW1)
To be released
HPC/AI Arm Server - NVIDIA Grace Hopper Superchip - 2U 4-Node 16-Bay Gen4 NVMe DLC
| Application:
AI
,
AI Training
,
AI Inference
&
HPC
Application:
- Direct liquid cooling solution
- CPU+GPU design for giant-scale AI and HPC
- 2U 4-node rear access server system
- NVIDIA Grace Hopper Superchip
- 900GB/s NVLink-C2C Interconnect
- Up to 480GB CPU LPDDR5X ECC memory per module
- Up to 96GB GPU HBM3 per module
- Compatible with NVIDIA BlueField-2 / BlueField-3 DPUs
- 8 x 10Gb/s BASE-T LAN ports (Intel® X550-AT2)
- 4 x Dedicated management ports
- 1 x CMC port
- 16 x 2.5" Gen4 NVMe hot-swappable bays
- 8 x M.2 slots with PCIe Gen5 x4 interface
- 4 x FHHL PCIe Gen5 x16 slots
- 4 x OCP 3.0 Gen5 x16 slots
- Triple 3000W (240V) 80 PLUS Titanium redundant power supply
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SPECIFICATIONS
Dimensions (WxHxD, mm)
2U 4-Node - Rear access
440 x 87.5 x 850
440 x 87.5 x 850
Motherboard
MV13-HD0
Superchip
NVIDIA Grace Hopper Superchip:
- 1 x Grace CPU
- 1 x Hopper H100 GPU
- Connected with NVLink-C2C
- TDP up to 1000W (CPU + GPU + memory)
- 1 x Grace CPU
- 1 x Hopper H100 GPU
- Connected with NVLink-C2C
- TDP up to 1000W (CPU + GPU + memory)
Memory
Per node:
Grace CPU:
- Up to 480GB of LPDDR5X memory with ECC
- Memory bandwidth up to 512GB/s
Hopper H100 GPU:
- Up to 96GB HBM3
- Memory bandwidth up to 4TB/s
Grace CPU:
- Up to 480GB of LPDDR5X memory with ECC
- Memory bandwidth up to 512GB/s
Hopper H100 GPU:
- Up to 96GB HBM3
- Memory bandwidth up to 4TB/s
LAN
Per node:
2 x 10GbE LAN ports (1 x Intel® X550-AT2)
Support NCSI function
1 x Dedicated management port
Total:
8 x 10GbE LAN ports (4 x Intel® X550-AT2)
Support NCSI function
4 x Dedicated management ports
1 x CMC port
2 x 10GbE LAN ports (1 x Intel® X550-AT2)
Support NCSI function
1 x Dedicated management port
Total:
8 x 10GbE LAN ports (4 x Intel® X550-AT2)
Support NCSI function
4 x Dedicated management ports
1 x CMC port
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage
Per node:
4 x 2.5" Gen4 NVMe hot-swappable bays, from PEX89048
Total:
16 x 2.5" Gen4 NVMe hot-swappable bays, from CPU
4 x 2.5" Gen4 NVMe hot-swappable bays, from PEX89048
Total:
16 x 2.5" Gen4 NVMe hot-swappable bays, from CPU
SAS
N/A
RAID
N/A
Expansion Slots
Per node:
PCIe cable:
- 1 x PCIe x16 (Gen5 x16) FHHL slot, from CPU
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU
Supports NCSI function
2 x M.2 slots:
- M-key
- PCIe Gen5 x4, from PEX89048
- Supports 2280/22110 cards
Total:
PCIe cable x 4:
- 4 x PCIe x16 (Gen5 x16) FHHL slots, from CPU
4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU
Support NCSI function
8 x M.2 slots:
- M-key
- PCIe Gen5 x4, from PEX89048
- Supports 2280/22110 cards
PCIe cable:
- 1 x PCIe x16 (Gen5 x16) FHHL slot, from CPU
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU
Supports NCSI function
2 x M.2 slots:
- M-key
- PCIe Gen5 x4, from PEX89048
- Supports 2280/22110 cards
Total:
PCIe cable x 4:
- 4 x PCIe x16 (Gen5 x16) FHHL slots, from CPU
4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU
Support NCSI function
8 x M.2 slots:
- M-key
- PCIe Gen5 x4, from PEX89048
- Supports 2280/22110 cards
Internal I/O
Per node:
2 x M.2 slots
1 x COM
1 x TPM header
1 x OCP 3.0 slot
2 x M.2 slots
1 x COM
1 x TPM header
1 x OCP 3.0 slot
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button
Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*1 x CMC reset button
*Only one CMC status LED and reset button per system
Rear I/O
Per node:
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.2 Gen1
4 x Mini-DP
8 x RJ45
4 x MLAN
1 x ID LED
*1 x CMC port
*Only one CMC port per system
2 x USB 3.2 Gen1
1 x Mini-DP
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.2 Gen1
4 x Mini-DP
8 x RJ45
4 x MLAN
1 x ID LED
*1 x CMC port
*Only one CMC port per system
Backplane I/O
Speed and bandwidth:
PCIe Gen4 x4
PCIe Gen4 x4
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM012
Optional TPM2.0 kit: CTM012
Power Supply
Triple 3000W (240V) 80 PLUS Titanium redundant power supply
AC Input:
- 100-127V~/ 16A, 50-60Hz
- 200-240V~/ 16A, 50-60Hz
DC Input:
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+ 12.2V/ 98.36A
+ 12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+ 12.2V/ 213A
+ 12.2Vsb/ 3A
- Max 3000W/ 208-240V~
+ 12.2V/ 245.9A
+ 12.2Vsb/ 3A
NOTE: The system power supply requires C19 power cord
AC Input:
- 100-127V~/ 16A, 50-60Hz
- 200-240V~/ 16A, 50-60Hz
DC Input:
- 240Vdc/ 16A
DC Output:
- Max 1200W/ 100-127V~
+ 12.2V/ 98.36A
+ 12.2Vsb/ 3A
- Max 2600W/ 200-207V~
+ 12.2V/ 213A
+ 12.2Vsb/ 3A
- Max 3000W/ 208-240V~
+ 12.2V/ 245.9A
+ 12.2Vsb/ 3A
NOTE: The system power supply requires C19 power cord
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
TBD
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Note:
1) The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
2) If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Note:
1) The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
2) If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.
Packaging Dimensions
TBD
Packaging Content
1 x H263-V11
1 x 3-Section Rail kit
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NH263V11DR000LAW1*
- 3-Section Rail kit: 25HB2-A66125-K0R
Optional parts:
- GIGABYTE DLC kit: 25H26-3V10000-E29X (QPA:4)
- GIGABYTE 2U4N Manifold: 25H27-3Z80000-E07X (1 set per rack)
- 3-Section Rail kit: 25HB2-A66125-K0R
Optional parts:
- GIGABYTE DLC kit: 25H26-3V10000-E29X (QPA:4)
- GIGABYTE 2U4N Manifold: 25H27-3Z80000-E07X (1 set per rack)
* The entire materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at anytime without prior notice.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
* Advertised performance is based on maximum theoretical interface values from respective Chipset vendors or organization who defined the interface specification. Actual performance may vary by system configuration.
* All trademarks and logos are the properties of their respective holders.
* Due to standard PC architecture, a certain amount of memory is reserved for system usage and therefore the actual memory size is less than the stated amount.
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