MC13-LE0
(rev. 1.x)

Motherboard - AMD Ryzen™ 7000 - microATX UP 1Gb/s LAN

Single AMD Ryzen™ 7000 Series Processors (with AMD 3D V-Cache™ Technology)
Dual Channel ECC/Non-ECC UDIMM DDR5, 4 DIMMs
2 x 1Gb/s LAN ports via Intel^® I210
4 x SATA 6Gb/s ports
1 x M.2 slot with PCIe Gen5 x4 interface
1 x PCIe Gen5 x16 expansion slot
1 x PCIe Gen4 x4 expansion slot

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* ここに記載されている全ての資料は参考用です。 GIGABYTEは、予告なしに変更する場合があります。
* パフォーマンスについては、インターフェイス仕様の理論上の最大値に基づいています。実際のパフォーマンスは、システム構成によって異なる場合があります。
* 記載されている会社名、商品名、およびロゴは各社の商標または登録商標です。
* メモリー容量は、システムリソースに予約され実際の搭載メモリーより少なくなる場合があります。

SPECIFICATIONS

Form Factor

microATX
244W x 244D mm

CPU

AMD Ryzen™ 7000 Series Processors
AMD Ryzen™ 7000 Series Processors with AMD 3D V-Cache™ Technology
Single processor, 5nm technology
TDP up to 170W

Note:
- Recommend to install 170W CPU with liquid cooling kit.
- When installing liquid cooling kit for CPU or GPU, please keep proper airflow for ventilation to prevent heat accumulation.

Socket

1 x AM5

Chipset

AMD B650E

Memory

4 x DIMM slots
DDR5 memory supported only
Dual channel memory architecture
ECC UDIMM 1Rx8/2Rx8 supported
Non-ECC UDIMM 1Rx8/2Rx8/1Rx16 supported
Total capacity up to 128GB
Memory speed: Up to 5200 MT/s (1DPC), 3600 MT/s (2DPC)

LAN

2 x 1Gb/s LAN ports (Intel^® I210 )
Support NCSI function

1 x 10/100/1000 Mbps Management LAN

Video

Integrated in Aspeed^® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp

Audio

N/A

Storage Interface

FCH:
4 x SATA 6Gb/s ports

RAID

RAID 0/1/10

Expansion Slots

Slot_3: PCIe x16 (Gen5 x16) slot, from CPU
Slot_1: PCIe x4 (Gen4 x4) slot, from FCH

1 x M.2 slot:
- M-key
- PCIe Gen5 x4, from CPU
- Supports 2242/2280 cards

Internal I/O

1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
5 x System fan headers
1 x USB 2.0 (Type-A)
1 x USB 3.2 Gen1 x2 header
1 x USB 2.0 x2 header
1 x M.2 slot
4 x SATA connectors
1 x Front panel header
1 x Backplane board header
1 x PMBUS connector
1 x IPMB connector
1 x TPM header

Rear I/O

2 x USB 3.2 Gen1 (Type-A)
1 x VGA
1 x COM
2 x RJ45
1 x MLAN
1 x ID button with LED

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

OS Supported

Windows 10 (x64)
Windows 11 (x64)

Board Management

Aspeed^® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
Advanced power capping
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings

PSU Connectors

1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector

Operating Properties

Operating temperature: 10°C to 40°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Retail Packaging Content

1 x MC13-LE0
1 x I/O shield
1 x Quick start guide
4 x SATA 6Gb/s cables (500mm)

Single Box dimensions: 321 x 308.5 x 78.5 mm
Carton dimensions: 630 x 420 x 345 mm
Quantity: 10 x single boxes in one carton

Bulk Packaging Content

10 x MC13-LE0
10 x I/O shields

Carton dimensions: 609 x 581 x 362 mm
MOQ: 10 PCS MC13-LE0

Reference Numbers

Retail: 9MC13LE0MR-000-1*
Bulk: 9MC13LE0NR-000-1*

Part Numbers:

- I/O shield: 12AIO-MC13LE-00R
- SATA cable (500mm)(2 in 1 package): 12CF1-2SAT01-31R

SUPPORT

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Windows 11 64bit
Windows 10 64bit

Chipset

バージョン

サイズ

日付

AMD Chipset Driver

Version : 4.06.09.215

50.69 MB

May 10, 2023

MC13-LE0 (rev. 1.x)

SPECIFICATIONS

SUPPORT

RESOURCES

MC13-LE0 (rev. 1.x)

MC13-LE0
(rev. 1.x)