- Home
- Enterprise
- GPU Servers
- G593-ZD2
G593-ZD2
(rev. AAX1)
HPC/AI Server - AMD EPYC™ 9004 - 5U DP HGX™ H100 8-GPU
| Application:
AI
,
AI Training
,
AI Inference
&
HPC
Application:
- Supports NVIDIA HGX™ H100 with 8 x SXM5 GPUs
- Supports NVIDIA® NVLink® and NVSwitch™ technology
- Up to 900GB/s GPU to GPU interconnection
- AMD EPYC™ 9004 Series processors
- AMD EPYC™ 9004 Series processors with AMD 3D V-Cache™ Technology
- Dual processor, 5nm technology
- 12-Channel RDIMM DDR5 per processor, 24 x DIMMs
- Dual ROM Architecture
- 2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
- 1 x Dedicated management port
- 2 x M.2 slots with PCIe Gen3 x4 and x1 interface
- 8 x 2.5" Gen5 NVMe hot-swappable bays
- 4 x FHHL PCIe Gen5 x16 slots
- 8 x LP PCIe Gen5 x16 slots
- 4+2 3000W (240V) 80 PLUS Titanium redundant power supplies
Request a Quote
* 사이트에서 제공되는 모든 자료는 참조용일 뿐입니다. 기가바이트는 사이트의 자료를 사전 통지없이 언제든지 수정할 권리를 지닙니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.
SPECIFICATIONS
Dimensions (WxHxD, mm)
5U
447 x 222.25 x 945
447 x 222.25 x 945
Motherboard
MZB3-G43
CPU
AMD EPYC™ 9004 Series processors
AMD EPYC™ 9004 Series processors with AMD 3D V-Cache™ Technology
Dual processor, 5nm technology
*Up to 128-core, 256 threads per processor
cTDP up to 300W at ambient 35°C
*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
AMD EPYC™ 9004 Series processors with AMD 3D V-Cache™ Technology
Dual processor, 5nm technology
*Up to 128-core, 256 threads per processor
cTDP up to 300W at ambient 35°C
*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
2 x LGA 6096
Socket SP5
Socket SP5
Chipset
System on Chip
Memory
24 x DIMM slots
DDR5 memory supported only
12-Channel memory architecture per processor
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz
DDR5 memory supported only
12-Channel memory architecture per processor
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz
LAN
Front side:
2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
NCSI function supported
1 x 10/100/1000 management LAN
2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
NCSI function supported
1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Storage
Front side:
8 x 2.5" Gen5 NVMe hot-swappable bays, from PEX89104
8 x 2.5" Gen5 NVMe hot-swappable bays, from PEX89104
SAS
N/A
RAID
N/A
Expansion Slots
Supports NVIDIA HGX™ H100 with 8 x SXM5 GPUs
8 x PCIe x16 (Gen5 x16) low-profile slots, from PEX89104
2 x PCIe x16 (Gen5 x16) FHHL slots, from CPU_0
2 x PCIe x16 (Gen5 x16) FHHL slots, from CPU_1
1 x M.2 slot:
- M-key
- PCIe Gen3 x1, from CPU_0
- Supports 2280/22110 cards
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2280/22110 cards
8 x PCIe x16 (Gen5 x16) low-profile slots, from PEX89104
2 x PCIe x16 (Gen5 x16) FHHL slots, from CPU_0
2 x PCIe x16 (Gen5 x16) FHHL slots, from CPU_1
1 x M.2 slot:
- M-key
- PCIe Gen3 x1, from CPU_0
- Supports 2280/22110 cards
1 x M.2 slot:
- M-key
- PCIe Gen3 x4, from CPU_1
- Supports 2280/22110 cards
Internal I/O
2 x M.2 slots
1 x TPM header
1 x Front panel header
1 x TPM header
1 x Front panel header
Front I/O
2 x USB 3.2 Gen1
1 x VGA
2 x RJ45
1 x MLAN (default port)
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x NMI button
1 x System status LED
1 x HDD access LED
1 x VGA
2 x RJ45
1 x MLAN (default port)
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x NMI button
1 x System status LED
1 x HDD access LED
Rear I/O
1 x MLAN
Backplane I/O
Speed and bandwidth:
PCIe Gen5 x4
PCIe Gen5 x4
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Optional TPM2.0 kit: CTM010
Power Supply
4+2 3000W (240V) 80 PLUS Titanium redundant power supplies
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input:
- 240Vdc/ 14A
DC Output:
Max 1450W at 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
Max 2900W at 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
Max 3000W at 220-240V~ or 240Vdc
+54V/ 55.6A
+12Vsb/ 3A
NOTE: The system power supply requires C19 power cord
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input:
- 240Vdc/ 14A
DC Output:
Max 1450W at 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
Max 2900W at 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
Max 3000W at 220-240V~ or 240Vdc
+54V/ 55.6A
+12Vsb/ 3A
NOTE: The system power supply requires C19 power cord
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
Front: 5 x 80x80x80mm (17,200rpm), 6 x 60x60x76mm (21,700rpm)
Rear: 6 x 80x80x80mm (17,000rpm), 4 x 40x40x56mm (29,700rpm)
Internal: 4 x 40x40x28mm (25,000rpm), 4 x 60x60x56mm (24,000rpm)
Rear: 6 x 80x80x80mm (17,000rpm), 4 x 40x40x56mm (29,700rpm)
Internal: 4 x 40x40x28mm (25,000rpm), 4 x 60x60x56mm (24,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
N/A
Packaging Content
1 x G593-ZD2
2 x CPU fansinks
1 x L-shape Rail kit
2 x CPU fansinks
1 x L-shape Rail kit
Part Numbers
- Barebone w/ NVIDIA module: 6NG593ZD2DR000AAX1*
- Motherboard: 9MZB3G43NR-000
- L-shape Rail kit: 25HB2-A96102-K0R
- CPU fansink: 25ST1-24320H-M1R (TBD)
- Front panel board - CFPG540: 9CFPG540NR-00
- Backplane board - CBPG680: 9CBPG680NR-00
- Fan module 80x80x80mm: 25ST2-808037-S1R/25ST2-888032-S1R
- Fan module 60x60x76mm: 25ST2-667630-S1R
- Fan module 60x60x56mm: 25ST2-665620-S1R
- Fan module 40x40x56mm: 25ST2-40562G-A0R
- Fan module 40x40x28mm: 25ST2-44282D-D0R
- I/O board - CDB66: 9CDB66NR-00
- PCIe bridge board - CPBG044: 9CPBG044NR-00
- PCIe switch board - CPBG902: 9CPBG902NR-00
- Power supply: 25EP0-23000A-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- Motherboard: 9MZB3G43NR-000
- L-shape Rail kit: 25HB2-A96102-K0R
- CPU fansink: 25ST1-24320H-M1R (TBD)
- Front panel board - CFPG540: 9CFPG540NR-00
- Backplane board - CBPG680: 9CBPG680NR-00
- Fan module 80x80x80mm: 25ST2-808037-S1R/25ST2-888032-S1R
- Fan module 60x60x76mm: 25ST2-667630-S1R
- Fan module 60x60x56mm: 25ST2-665620-S1R
- Fan module 40x40x56mm: 25ST2-40562G-A0R
- Fan module 40x40x28mm: 25ST2-44282D-D0R
- I/O board - CDB66: 9CDB66NR-00
- PCIe bridge board - CPBG044: 9CPBG044NR-00
- PCIe switch board - CPBG902: 9CPBG902NR-00
- Power supply: 25EP0-23000A-D0S
Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
* 사이트에서 제공되는 모든 자료는 참조용일 뿐입니다. 기가바이트는 사이트의 자료를 사전 통지없이 언제든지 수정할 권리를 지닙니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.
* 모든 상표와 로고는 해당 소유자의 자산입니다.
* PC의 표준 아키텍쳐에 의해, 메모리의 특정 부분이 시스템에 사용되어 실제 메모리 크기는 표준보다 적게 표시될 수 있습니다.
SUPPORT
- All
- All
- Windows Server 2022
- Windows Server 2019
- Linux
Chipset
Chipset
버전
사이즈
날짜
AMD Chipset Driver
Version : 4.06.27.500
16.58 MB
Nov 11, 2022
OS: Windows Server 2019,Windows Server 2022
LAN
LAN
버전
사이즈
날짜
Intel® LAN Driver and Utility
Version : 27.4
755.19 MB
Nov 11, 2022
OS: Windows Server 2019,Windows Server 2022
BIOS
설명
버전
사이즈
날짜
Windows and UEFI mode flash BIOS SOP
Please download BIOS update tool from AMI Website
Please download BIOS update tool from AMI Website
-
0.31 MB
Jan 29, 2021
경고:
BIOS 플래시는 잠재적인 위험요소가 있기 때문에 현재 버전의 BIOS를 사용하는 동안 문제가 발생하지 않았다면 BIOS를 플래시하지 않는 것을 권장합니다. BIOS를 플래시하려면 조심해야 하며 부적절한 BIOS 플래시는 시스템에 고장을 일으킬 수 있습니다.
What is a BETA?
BETA는 최종 제품의 기능 중 일부는 포함되지 않을 수도 있습니다. BETA 서비스 동안에 제품의 새로운 특징을 미리 살펴볼 수 있으며 기가바이트의 제품을 최대한 경험할 수 있습니다.
BIOS 플래시는 잠재적인 위험요소가 있기 때문에 현재 버전의 BIOS를 사용하는 동안 문제가 발생하지 않았다면 BIOS를 플래시하지 않는 것을 권장합니다. BIOS를 플래시하려면 조심해야 하며 부적절한 BIOS 플래시는 시스템에 고장을 일으킬 수 있습니다.
What is a BETA?
BETA는 최종 제품의 기능 중 일부는 포함되지 않을 수도 있습니다. BETA 서비스 동안에 제품의 새로운 특징을 미리 살펴볼 수 있으며 기가바이트의 제품을 최대한 경험할 수 있습니다.
- All
- All
- Windows Server 2022
- Windows Server 2019
- Windows Server 2016 R2 64bit
- Windows Server 2016 64bit
- Windows Server 2012 R2 64bit
- Windows Server 2012 64bit
- Windows 10 64bit
- VMware
- Ubuntu
- Linux CentOS
- Linux
유틸리티
설명
버전
사이즈
날짜
GSM CLI
Version : 2.1.67
111.17 MB
Oct 31, 2023
OS: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
GSM Server
Version : 2.12
926.33 MB
Jan 18, 2023
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
GSM Agent
Version : 2.5
720.29 MB
Dec 27, 2021
OS: Linux,Windows Server 2016 64bit,Windows Server 2019
Firmware
설명
버전
사이즈
날짜
BMC Firmware with embedded GIGABYTE Management Console
(AST2600 AMI)
(AST2600 AMI)
Version : 13.05.07
112.97 MB
Sep 27, 2023
English
매뉴얼
설명
버전
사이즈
날짜
User Guide - GIGABYTE Management Console (AMI AST2600)
Version : 1.0
17.39 MB
Aug 29, 2023
English
Support List
설명
버전
사이즈
날짜
OS Support List
Version : 1.2
0.17 MB
Sep 07, 2023
AMD EPYC™ 9004 Series Processors OS Support List
RESOURCES
Articles
AI & AIoT | October 04, 2023
How to Benefit from AI In the Healthcare & Medical Industry
If you work in healthcare and medicine, take some minutes to browse our in-depth analysis on how artificial intelligence has brought new opportunities to this sector, and what tools you can use to benefit from them. This article is part of GIGABYTE Technology’s ongoing “Power of AI” series, which examines the latest AI trends and elaborates on how industry leaders can come out on top of this invigorating paradigm shift.
Tech Guide | September 11, 2023
How to Pick the Right Server for AI? Part One: CPU & GPU
With the advent of generative AI and other practical applications of artificial intelligence, the procurement of “AI servers” has become a priority for industries ranging from automotive to healthcare, and for academic and public institutions alike. In GIGABYTE Technology’s latest Tech Guide, we take you step by step through the eight key components of an AI server, starting with the two most important building blocks: CPU and GPU. Picking the right processors will jumpstart your supercomputing platform and expedite your AI-related computing workloads.
AI & AIoT | September 08, 2023
10 Frequently Asked Questions about Artificial Intelligence
Artificial intelligence. The world is abuzz with its name, yet how much do you know about this exciting new trend that is reshaping our world and history? Fret not, friends; GIGABYTE Technology has got you covered. Here is what you need to know about the ins and outs of AI, presented in 10 bite-sized Q and A’s that are fast to read and easy to digest!
AI & AIoT | August 09, 2023
How to Benefit from AI in the Automotive & Transportation Industry
If you work in the automotive and transportation industry, spend a few minutes to read our in-depth analysis of how artificial intelligence has created new opportunities in this sector, and what tools you can use to get ahead. This article is part of GIGABYTE Technology’s ongoing “Power of AI” series, which examines the latest AI-related trends, and how intrepid visionaries can reap the benefits of this exciting paradigm shift.
Tech Guide | June 29, 2023
To Harness Generative AI, You Must Learn About “Training” & “Inference”
Unless you’ve been living under a rock, you must be familiar with the “magic” of generative AI: how chatbots like ChatGPT can compose anything from love letters to sonnets, and how text-to-image models like Stable Diffusion can render art based on text prompts. The truth is, generative AI is not only easy to make sense of, but also a cinch to work with. In our latest Tech Guide, we dissect the “training” and “inference” processes behind generative AI, and we recommend total solutions from GIGABYTE Technology that’ll enable you to harness its full potential.
Video
News
Media Review
Others
Back to G593-ZD2
