S453-Z30
(rev. AAV1)

Storage Server - AMD EPYC™ 9004 - 4U UP 36+2-Bay SATA/SAS
  • AMD EPYC™ 9004 series processors
  • AMD EPYC™ 9004 series processors with AMD 3D V-Cache™ Technology
  • Single processor, 5nm technology
  • 12-Channel RDIMM DDR5, 24 x DIMMs
  • 2 x 10Gb/s LAN ports (Broadcom® BCM57416)
  • 1 x Dedicated management port
  • 24 x 3.5"/2.5" SATA/SAS hot-swappable bays on front side
  • 12 x 3.5"/2.5" SATA/SAS hot-swappable bays on rear side
  • 2 x 2.5" SATA/SAS bays on rear side for boot drives
  • SAS expander with 12Gb/s transfer speed
  • 1 x M.2 slot with PCIe Gen4 x4 interface
  • 4 x LP PCIe Gen5 x16 slots
  • Dual 1600W (240V) 80 PLUS Titanium redundant power supply
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* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SPECIFICATIONS

Dimensions (WxHxD, mm)
4U
482.6 x 177 x 625
Motherboard
CPU
AMD EPYC™ 9004 series processors
AMD EPYC™ 9004 series processors with AMD 3D V-Cache™ Technology
Single processor, 5nm technology
*Up to 128-core, 256 threads per processor
cTDP up to 300W at ambient 35°C

*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.
Socket
1 x LGA 6096
Socket SP5
Chipset
System on Chip
Memory
24 x DIMM slots
DDR5 memory supported only
12-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz (1DPC), 3600 MHz (2DPC)
LAN
Rear side:
2 x 10Gb/s BASE-T LAN ports (1 x Broadcom® BCM57416)
NCSI function supported

1 x 10/100/1000 management LAN
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Storage
Front side:
24 x 3.5"/2.5" SATA/SAS hot-swappable bays, connected to expander

Rear side:
12 x 3.5"/2.5" SATA/SAS hot-swappable bays, connected to expander
2 x 2.5" SATA/SAS bays for boot drives, from onboard connector
- (Additional SAS card is required for SAS support on boot drives)

1 x Broadcom SAS35x48 expanders
Bandwidth: SATA 6Gb/s or SAS 12Gb/s per port

SAS card is required to enable the drive bays

Recommended SAS cards:
CSA4710
CRA4760
CRA4761
SAS
Supported
RAID
Depends on SAS add-on Card
Expansion Slots
4 x PCIe x 16 (Gen5 x16) low-profile slots

1 x M.2 slot:
- M-key
- PCIe Gen4 x4
- Supports 2280/22100 cards
Internal I/O
1 x M.2 slot
1 x TPM header
Front I/O
2 x USB 3.2 Gen1
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x HDD status LED
1 x System status LED
Rear I/O
2 x USB 3.2 Gen1
1 x VGA
1 x COM
2 x RJ45
1 x MLAN
1 x ID button with LED
Backplane Board
Speed and bandwidth:
Front side - CBPD4O0: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBP2021: SATA 6Gb/s or SAS 12Gb/s
Rear side - CBPD0C0: SATA 6Gb/s or SAS 12Gb/s
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
Dual 1600W 80 PLUS Titanium redundant power supply

AC Input:
- 100-127V~/ 12A, 50-60Hz
- 200-240V~/ 10A, 50-60Hz

DC Input:
- 240Vdc/ 8A

DC Output:
- Max 1000W/ 100-127V~
+ 12.2V/ 82A
+ 12.2Vsb/ 3A
- Max 1600W/ 200-240V~ or 240Vdc Input
+ 12.2V/ 132A
+ 12.2Vsb/ 3A
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
4 x 80x80x38mm (16,300rpm)
4 x 80x80x38mm (9,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions
843 x 610 x 290 mm
Packaging Content
1 x S453-Z30
1 x CPU heatsink
1 x 3-Section Rail kit
Part Numbers
- Barebone package: 6NS453Z30MR000AAV1*
- Motherboard: 9MZ33AR0NR-000
- 3-Section Rail kit: 25HB2-3A6104-I0R
- CPU heatsink: 25ST1-143100-A0R
- Backplane board - CBP2021: 9CBP2021NR-00
- Backplane board - CBPD0C0: 9CBPD0C0NR-00
- Backplane board - CBPD4O0: 9CBPD4O0NR-00
- Fan module: 25420-8038B-D00R
- Fan module: 25ST2-883829-D0R
- Power supply: 25EP0-21600D-G1S
* 產品規格會依各國家地區出貨而有所變動,應以各地實際出貨狀況為準。誠摯建議與當地經銷商或零售商確認最新產品販售規格。
* 以上產品之規格、圖片及其他資訊僅供參考,如與實際產品有任何不相符之處,應以實際產品為準。技嘉科技保留在任何時間做出修改之權利。對任何因使用上述資料而引致之損失,技嘉科技概不承擔任何責任。
* 本產品所標示之各項效能表現為各晶片廠商或各制定介面官方組織所提出的最大理論值,實際效能可能因規格及設備而有所不同。
* 本文中所使用之各項商標及企業識別圖示,均為其合法所有人之財產。
* 基於PC基本架構,有部分記憶體空間須留作系統用途,故所偵測到之記憶體大小會比實際上較少。

SUPPORT

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Linux
網路介面
Warning:
更新BIOS有其潛在的風險,如果您使用目前版本的BIOS沒有問題,我們建議您不要任意更新BIOS。如需更新BIOS,請小心的執行,以避免不當的操作而造成系統毀損.

什麼是 BETA 版?
BETA版是正式推出前的試用版本。雖然該版本已經過測試,但可能還存在部份尚未發現、可能影響執行效能和功能的小問題。 請注意BETA版非正式的版本,並請密切注意正式版本的推出。

  • All
  • All
  • Windows Server 2022
  • Windows Server 2019
  • Windows Server 2016 R2 64bit
  • Windows Server 2016 64bit
  • Windows Server 2012 R2 64bit
  • Windows Server 2012 64bit
  • Windows 10 64bit
  • VMware
  • Ubuntu
  • Linux CentOS
  • Linux
工具程式
說明
版本
檔案大小
日期
GSM CLI
Version : 2.1.72
147.86 MB
Mar 05, 2024
作業系統: Windows Server 2012 64bit,Windows Server 2012 R2 64bit,Linux CentOS,Windows 10 64bit,Ubuntu,Windows Server 2016 R2 64bit,Windows Server 2019,Windows Server 2022
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