R181-NA0 (rev. 100)

Intel^® C621 Express Chipset | Application: Networking

Application:

Networking

2nd Gen. Intel^® Xeon^® Scalable and Intel^® Xeon^® Scalable Processors
6-Channel RDIMM/LRDIMM DDR4, 24 x DIMMs
Supports Intel^® Optane™ DC Persistent Memory
Dual 1Gb/s LAN ports (Intel^® I350-AM2)
1 x Dedicated management port
10 x 2.5" U.2 hot-swappable HDD/SSD bays
1 x PCIe Gen3 x16 expansion slot
1 x OCP Gen3 x16 mezzanine slot
Aspeed^® AST2500 remote management controller
Dual 1200W 80 PLUS Platinum redundant power supply

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* Veškeré zde uvedené materiály jsou pouze orientační. GIGABYTE si vyhrazuje právo kdykoliv měnit nebo revidovat obsah a to bez předchozího upozornění.
* Zmiňovaný výkon je založený na maximálních teoretických hodnotách z rozhraní jednotlivých čipsetů dodavatelů nebo organizace, která definovala specifikaci jednotlivých rozhraní. Skutečný výkon se může lišit v závislosti na konfiguraci systému.
* Všechny ochranné známky a loga jsou vlastnictvím jejich příslušných vlastníků.
* Díky standardní architektuře PC je určité množství paměti vyhrazeno pro systém, proto může být skutečná velikost dostupné paměti nižší než uvedené množství.

SPECIFICATIONS

Dimensions (WxHxD, mm)

1U
438 x 43.5 x 730

Motherboard

MR91-FS0

CPU

2nd Generation Intel^® Xeon^® Scalable and Intel^® Xeon^® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor and Intel® Xeon® Bronze Processor
CPU TDP up to 205W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable

Socket

2 x LGA 3647
Socket P

Chipset

Intel^® C621 Express Chipset

Memory

24 x DIMM slots
DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel^® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MHz

Maximum verified DCPMM configuration:

* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 205W (Max.)
* DCPMM 256GB x12 pcs

DCPMM installation locations:
DIMM_P0_( A1, B1, C1)
DIMM_P0_( D1, E1, F1)
DIMM_P1_( G1, H1, I1)
DIMM_P1_( J1, K1, L1)

NOTE:
1. 2933MHz for 2nd Generation Intel^® Xeon^® Scalable Processors only
2. Intel^® Optane™ DC Persistent Memory for 2nd Generation Intel^® Xeon^® Scalable Processors only
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C
4. To enquire about installing a greater number of DCPMM, please consult with your GIGABYTE technical or sales representative

LAN

2 x 1Gb/s LAN ports (Intel^® I350-AM2)
1 x 10/100/1000 management LAN

Video

Integrated in Aspeed^® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Audio

Storage

10 x 2.5" U.2/ SAS/ SATA hot-swappable HDD/SSD bays

SATA

2 x 7-pin SATA III 6Gb/s with SATA DOM supported
By using pin_8 or external cable for power function

SAS

RAID

Intel^® Virtual RAID On CPU (VROC) RAID 0, 1, 10, 5
Note: VROC module is compatible for Intel^®SSD only

Peripheral Drives

Expansion Slots

Riser Card CRS1014:
- 1 x PCIe x16 slot (Gen3 x16), Full-height half-length

Riser Card CRS1015:
- 1 x PCIe x16 slot (Gen3 x16), Full-height half-length
- Occupied by CNV3124, 4 x U.2 HBA

2 x OCP mezzanine slots
- PCIe Gen3 x16
- Type1, P1, P2, P3, P4, K2, K3
- 1 x OCP mezzanine slot is Occupied by CNVO124, 4 x U.2 mezzanine card

Internal I/O

2 x Power supply connectors
4 x SlimSAS connectors
2 x SATA 7-pin connectors
2 x CPU fan headers
1 x USB 3.0 header
1 x TPM header
1 x VROC connector
1 x Front panel header
1 x HDD back plane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper

Front I/O

1 x USB 3.0
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x NMI button
2 x LAN activity LEDs
1 x HDD activity LED
1 x System status LED

Rear I/O

2 x USB 3.0
1 x VGA
1 x COM (RJ45 type)
2 x RJ45
1 x MLAN
1 x ID button with LED

Backplane I/O

10 x U.2 ports
Bandwidth: PCIe Gen3 x4 per port

TPM

1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000

Power Supply

2 x 1200W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-240V~/ 12-7A, 50-60Hz
DC Input:
- 240Vdc/ 6A

DC Output:
- Max 1000W/ 100-240V~
+12V/ 80.5A
+12Vsb/ 3A
- Max 1200W/ 200-240V~ or 240Vdc input
+12V/ 97A
+12Vsb/ 3A

System Management

Aspeed^® AST2500 management controller
Avocent^® MergePoint IPMI 2.0 web interface:

Network settings
Network security settings
Hardware information
Users control
Services settings
IPMI settings
Sessions control
LDAP settings
Power control
Fan profiles
Voltages, fans and temperatures monitoring
System event log
Events management (platform events, trap settings, email settings)
Serial Over LAN
vKVM & vMedia (HTML5)

OS Compatibility

For Skylake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 6.9 (x64) or later
Red Hat Enterprise Linux 7.3 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later

SUSE Linux Enterprise Server 11.4 (x64) or later
SUSE Linux Enterprise Server 12.2 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 16.04.1 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

For Cascade Lake processors:

Windows Server 2012 R2 with Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later

SUSE Linux Enterprise Server 12.3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later

Weight

13 kg

System Fans

8 x 40x40x56mm (23'000rpm)

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

959 x 588 x 248 mm

Packaging Content

1 x R181-NA0
2 x CPU heatsinks
1 x Rail kit
1 x VROC module
2 x Non-Fabric CPU carrier

Part Numbers

Barebone package: 6NR181NA0MR-00
Part Numbers:
- Motherboard: 9MR91FS0NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-3A0202-K0R
- CPU heatsink: 25ST1-253100-F2R
- Back plane board: 9CBP10A1NR-00
- Front panel board: 9CFP1000NR-00
- Power supply: 25EP0-212002-F3S
- RJ45 type COM cable: 25CR0-200400-Y4R (in option)
- U.2 card_CNV3124: 9CNV3124NR-00, 4 x U.2 ports
- U.2 card_CNVP122: 9CNVP122NR-00, 2 x U.2 ports
- U.2 card_CNVO124: 9CNVO124NR-00, 4 x U.2 ports
- Riser card - CRS1014: 9CRS1014NR-00
- Riser card - CRS1015: 9CRS1015NR-00

SUPPORT

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Ovladače
BIOS
Utility
Firmware

Manuál
Support List

Online Support

Choose your OS
Choose your OS
Windows Server 2019
Windows Server 2016 64bit
Windows Server 2012 R2 64bit
Linux

Chipset

Verze

Velikost

Datum

Intel^® Chipset Driver

Version : 10.1.17861.8101

3.34 MB

2019. 04. 18